公开(公告)号：US08884517B1

公开(公告)日：2014-11-11

申请号：US13274489

申请日：2011-10-17

申请人： Frank Tin Chung Shum ,  Frank M. Steranka ,  Michael R. Krames

发明人： Frank Tin Chung Shum ,  Frank M. Steranka ,  Michael R. Krames

IPC分类号： H01K1/62 ,  H01J9/24

CPC分类号： F21V29/15 ,  F21K9/23 ,  F21K9/90 ,  F21V29/70 ,  F21V29/74 ,  F21V29/83 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An lighting source includes a driver for outputting electrical power in response to external electrical power, wherein the driver generates heat in response thereto, a lamp coupled to the driver, for outputting light in response to the electrical power, wherein the lamp generates heat in response thereto, a first heat sink physically coupled to the driver for receiving and dissipating heat there from, a second heat sink physically coupled to the light for receiving heat and dissipating heat there from, and an insulating portion disposed between the first heat sink and the second heat sink, wherein the insulating portion is configured to inhibit heat from the lamp from being transferred to the driver.

摘要翻译： 照明源包括用于响应于外部电力输出电力的驱动器，其中驱动器响应于此而产生热量，连接到驱动器的灯，用于响应于电功率而输出光，其中灯发出响应的热量 物理耦合到驱动器的第一散热器，用于从其接收和散发热量，物理耦合到光的第二散热器，用于接收热量并从中散发热量;以及绝缘部分，设置在第一散热器和第二散热器之间 散热器，其中所述绝缘部分被配置为抑制来自所述灯的热量被传送到所述驱动器。

公开(公告)号：US08541951B1

公开(公告)日：2013-09-24

申请号：US13298905

申请日：2011-11-17

申请人： Frank Tin Chung Shum ,  Frank M. Steranka ,  Cliff Jue

发明人： Frank Tin Chung Shum ,  Frank M. Steranka ,  Cliff Jue

IPC分类号： H05B37/02

CPC分类号： H05B33/0824

摘要： Power management and thermal management for high intensity LED lamps are disclosed.

摘要翻译： 公开了高强度LED灯的电源管理和热管理。

公开(公告)号：US07419839B2

公开(公告)日：2008-09-02

申请号：US10987241

申请日：2004-11-12

申请人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

发明人： Michael D. Camras ,  William R. Imler ,  Frank S. Wall, Jr ,  Frank M. Steranka ,  Michael R. Krames ,  Helena Ticha ,  Ladislav Tichy

IPC分类号： H01L21/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with at least one light emitting device (LED) die mounted on a submount with an optical element subsequently thermally bonded to the LED die. The LED die is electrically coupled to the submount through contact bumps that have a higher temperature melting point than is used to thermally bond the optical element to the LED die. In one implementation, a single optical element is bonded to a plurality of LED dice that are mounted to the submount and the submount and the optical element have approximately the same coefficients of thermal expansion. Alternatively, a number of optical elements may be used. The optical element or LED die may be covered with a coating of wavelength converting material. In one implementation, the device is tested to determine the wavelengths produced and additional layers of the wavelength converting material are added until the desired wavelengths are produced.

摘要翻译： 设备具有至少一个发光器件（LED）裸片，该发光器件（LED）裸片安装在具有随后热粘合到LED管芯上的光学元件的基座上。 LED管芯通过接触凸块电连接到副安装座，接触凸块具有比用于将光学元件热粘合到LED管芯的温度高的熔点。 在一个实现中，单个光学元件被结合到安装到基座上的多个LED芯片，并且基座和光学元件具有大致相同的热膨胀系数。 或者，可以使用多个光学元件。 光学元件或LED管芯可以用波长转换材料的涂层覆盖。 在一个实施方案中，测试该器件以确定产生的波长，并且添加波长转换材料的附加层，直到产生所需的波长。

公开(公告)号：US06969946B2

公开(公告)日：2005-11-29

申请号：US10669789

申请日：2003-09-23

申请人： Frank M. Steranka ,  Daniel A. Steigerwald ,  Matthijs H. Keuper

发明人： Frank M. Steranka ,  Daniel A. Steigerwald ,  Matthijs H. Keuper

IPC分类号： H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01J5/16 ,  H05B33/00 ,  H05B33/22

CPC分类号： H01L33/58 ,  H01L33/46 ,  H01L33/60

摘要： The amount of usefully captured light in an optical system may be increased by concentrating light in a region where it can be collected by the optical system. A light emitting device may include a substrate and a plurality of semiconductor layers. In some embodiments, a reflective material overlies a portion of the substrate and has an opening through which light exits the device. In some embodiments, reflective material overlies a portion of a surface of the semiconductor layers and has an opening through which light exits the device. In some embodiments, a light emitting device includes a transparent member with a first surface and an exit surface. At least one light emitting diode is disposed on the first surface. The transparent member is shaped such that light emitted from the light emitting diode is directed toward the exit surface.

摘要翻译： 光学系统中有效捕获的光的量可以通过将光集中在可由光学系统收集的区域中来增加。 发光器件可以包括衬底和多个半导体层。 在一些实施例中，反射材料覆盖在衬底的一部分上并且具有光从该器件离开的开口。 在一些实施例中，反射材料覆盖在半导体层的表面的一部分上并且具有光从该器件离开的开口。 在一些实施例中，发光器件包括具有第一表面和出射表面的透明构件。 至少一个发光二极管设置在第一表面上。 透明构件被成形为使得从发光二极管发射的光朝向出射表面。

公开(公告)号：US08628985B2

公开(公告)日：2014-01-14

申请号：US13252398

申请日：2011-10-04

申请人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

发明人： Michael D. Camras ,  Michael R. Krames ,  Wayne L. Snyder ,  Frank M. Steranka ,  Robert C. Taber ,  John J. Uebbing ,  Douglas W. Pocius ,  Troy A. Trottier ,  Christopher H. Lowery ,  Gerd O. Mueller ,  Regina B. Mueller-Mach

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/20 ,  H01L33/32 ,  H01L33/405 ,  H01L33/502 ,  H01L33/62

摘要： Light emitting devices with improved light extraction efficiency are provided. The light emitting devices have a stack of layers including semiconductor layers comprising an active region. The stack is bonded to a transparent lens having a refractive index for light emitted by the active region preferably greater than about 1.5, more preferably greater than about 1.8. A method of bonding a transparent lens to a light emitting device having a stack of layers including semiconductor layers comprising an active region includes elevating a temperature of the lens and the stack and applying a pressure to press the lens and the stack together. Bonding a high refractive index lens to a light emitting device improves the light extraction efficiency of the light emitting device by reducing loss due to total internal reflection. Advantageously, this improvement can be achieved without the use of an encapsulant.

摘要翻译： 提供了具有提高光提取效率的发光器件。 发光器件具有包括有源区的半导体层的一叠层。 叠层结合到具有由有源区发射的光的折射率的透明透镜，优选大于约1.5，更优选大于约1.8。 将透明透镜粘合到具有包括有源区的半导体层的层叠的发光器件的方法包括提高透镜和叠层的温度并施加压力以将透镜和叠层压在一起。 将高折射率透镜粘合到发光器件通过减少由于全内反射引起的损耗来提高发光器件的光提取效率。 有利地，可以在不使用密封剂的情况下实现这种改进。

公开(公告)号：US20120043552A1

公开(公告)日：2012-02-23

申请号：US13211145

申请日：2011-08-16

申请人： Aurelien J. F. David ,  Troy Trottier ,  Frank M. Steranka ,  Michael R. Krames

发明人： Aurelien J. F. David ,  Troy Trottier ,  Frank M. Steranka ,  Michael R. Krames

IPC分类号： H01L27/15 ,  H01L33/32 ,  H01L33/50

CPC分类号： H01L33/504 ,  C09K11/0883 ,  C09K11/565 ,  C09K11/7721 ,  C09K11/7734 ,  C09K11/7739 ,  C09K11/7774 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/32 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L2924/0002 ,  Y02B20/181 ,  H01L2924/00

摘要： An LED pump light with multiple phosphors is described. LEDs emitting radiation at violet and/or ultraviolet wavelengths are used to pump phosphor materials that emit other colors. The LEDs operating in different wavelength ranges are arranged to reduce light re-absorption and improve light output efficiency.

摘要翻译： 描述了具有多种荧光体的LED泵浦光。 用紫外线和/或紫外线波长发射辐射的LED用于泵浦发射其它颜色的荧光体材料。 布置在不同波长范围内的LED，以减少光吸收并提高光输出效率。

公开(公告)号：US20100109568A1

公开(公告)日：2010-05-06

申请号：US12686209

申请日：2010-01-12

申请人： Michael D. CAMRAS ,  William R. IMLER ,  Franklin J. WALL, JR. ,  Frank M. STERANKA ,  Michael R. KRAMES ,  Helena TICHA ,  Ladislav TICHY ,  Robertus G. Alferink

发明人： Michael D. CAMRAS ,  William R. IMLER ,  Franklin J. WALL, JR. ,  Frank M. STERANKA ,  Michael R. KRAMES ,  Helena TICHA ,  Ladislav TICHY ,  Robertus G. Alferink

IPC分类号： H05B37/02 ,  H01L21/50 ,  H01L33/00

CPC分类号： H05B33/0857 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different correlated color temperature (CCT) and are covered with an optical element that assists in mixing the light from the LEDs to produce a desired correlated color temperature. The optical element may be bonded to the phosphor converted light emitting devices. The optical element may be a dome mounted over the phosphor converted light emitting devices and filled with an encapsulant.

摘要翻译： 设备具有产生广谱光的多个磷光体转换发光器件（LED）的阵列。 磷光体转换的LED可以产生具有不同相关色温（CCT）的光，并且被有助于混合来自LED的光以产生期望的相关色温的光学元件覆盖。 光学元件可以结合到磷光体转换的发光器件上。 光学元件可以是安装在磷光体转换的发光器件上并且填充有密封剂的圆顶。

公开(公告)号：US07009213B2

公开(公告)日：2006-03-07

申请号：US10633054

申请日：2003-07-31

申请人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

发明人： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

摘要翻译： 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US5502316A

公开(公告)日：1996-03-26

申请号：US542210

申请日：1995-10-12

申请人： Fred A. Kish ,  Frank M. Steranka ,  Dennis C. DeFevere ,  Virginia M. Robbins ,  John Uebbing

发明人： Fred A. Kish ,  Frank M. Steranka ,  Dennis C. DeFevere ,  Virginia M. Robbins ,  John Uebbing

IPC分类号： H01L21/02 ,  H01L21/20 ,  H01L21/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/14 ,  H01L33/30

CPC分类号： H01L33/30 ,  H01L25/0756 ,  H01L33/005 ,  H01L33/0062 ,  H01L33/0079 ,  H01L33/0087 ,  H01L2924/0002 ,  H01L33/145

摘要： A method of forming a light emitting diode (LED) includes providing a temporary growth substrate that is selected for compatibility with fabricating LED layers having desired mechanical characteristics. For example, lattice matching is an important consideration. LED layers are then grown on the temporary growth substrate. High crystal quality is thereby achieved, whereafter the temporary growth substrate can be removed. A second substrate is bonded to the LED layers utilizing a wafer bonding technique. The second substrate is selected for optical properties, rather than mechanical properties. Preferably, the second substrate is optically transparent and electrically conductive and the wafer bonding technique is carried out to achieve a low resistance interface between the second substrate and the LED layers. Wafer bonding can also be carried out to provide passivation or light-reflection or to define current flow.

摘要翻译： 形成发光二极管（LED）的方法包括提供临时生长衬底，其被选择用于与制造具有期望的机械特性的LED层的相容性。 例如，晶格匹配是重要的考虑因素。 然后在临时生长衬底上生长LED层。 由此实现了高的晶体质量，之后可以去除临时生长衬底。 使用晶片接合技术将第二基板结合到LED层。 选择第二基板用于光学性能，而不是机械性能。 优选地，第二衬底是光学透明且导电的，并且执行晶片接合技术以实现第二衬底和LED层之间的低电阻界面。 还可以进行晶片结合以提供钝化或光反射或限定电流。

公开(公告)号：US5376580A

公开(公告)日：1994-12-27

申请号：US36532

申请日：1993-03-19

申请人： Fred A. Kish ,  Frank M. Steranka ,  Dennis C. DeFevere ,  Virginia M. Robbins ,  John Uebbing

发明人： Fred A. Kish ,  Frank M. Steranka ,  Dennis C. DeFevere ,  Virginia M. Robbins ,  John Uebbing

IPC分类号： H01L21/02 ,  H01L21/20 ,  H01L21/60 ,  H01L25/075 ,  H01L33/00 ,  H01L33/14 ,  H01L33/30

CPC分类号： H01L33/30 ,  H01L25/0756 ,  H01L33/005 ,  H01L33/0062 ,  H01L33/0079 ,  H01L33/0087 ,  H01L2924/0002 ,  H01L33/145

摘要： A method of forming a light emitting diode (LED) includes providing a temporary growth substrate that is selected for compatibility with fabricating LED layers having desired mechanical characteristics. For example, lattice matching is an important consideration. LED layers are then grown on the temporary growth substrate. High crystal quality is thereby achieved, whereafter the temporary growth substrate can be removed. A second substrate is bonded to the LED layers utilizing a wafer bonding technique. The second substrate is selected for optical properties, rather than mechanical properties. Preferably, the second substrate is optically transparent and electrically conductive and the wafer bonding technique is carried out to achieve a low resistance interface between the second substrate and the LED layers. Wafer bonding can also be carried out to provide passivation or light-reflection or to define current flow.

摘要翻译： 形成发光二极管（LED）的方法包括提供临时生长衬底，其被选择用于与制造具有期望的机械特性的LED层的相容性。 例如，晶格匹配是重要的考虑因素。 然后在临时生长衬底上生长LED层。 由此实现了高的晶体质量，之后可以去除临时生长衬底。 使用晶片接合技术将第二基板结合到LED层。 选择第二基板用于光学性能，而不是机械性能。 优选地，第二衬底是光学透明且导电的，并且执行晶片接合技术以实现第二衬底和LED层之间的低电阻界面。 还可以进行晶片结合以提供钝化或光反射或限定电流。