Abstract:
A composite material (A) includes a porous sintered body (12) and an insulation film (2) which covers the porous sintered body (12). The porous sintered body (12) is made of a combination of a metal element (12a) which has a melting temperature not lower than 1600° C., and a nonmetal element (12b, 12c). The insulation film (2) includes the nonmetal element (12b, 12c) and N.
Abstract:
An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
Abstract:
A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of a resin package. The solid electrolytic capacitor including a capacitor element, an internal anode lead extending from one surface of the capacitor element, other surfaces of the capacitor element serving as a cathode terminal wall, an external anode lead connected to the internal anode lead, an external cathode lead connected to the cathode terminal wall through a fuse, and a resin package encapsulating the capacitor element, the fuse and respective connecting portions of the external anode lead and the external cathode lead. A connecting portion between the fuse and one end of the external cathode lead lies adjacent the capacitor element and in or out of a plane coplanar with the surface of the cathode terminal wall to which the fuse is pressure-welded.
Abstract:
A composite material (A) includes a porous sintered body (12) and an insulation film (2) which covers the porous sintered body (12). The porous sintered body (12) is made of a combination of a metal element (12a) which has a melting temperature not lower than 1600° C., and a nonmetal element (12b, 12c). The insulation film (2) includes the nonmetal element (12b, 12c) and N.
Abstract:
An anode lead (11) is embedded at one end thereof in a sintered body in a capacitor element (1), and is welded at the other end thereof to a first outside lead (2). A cathode (12) is electrically connected to a second outside lead (3). The capacitor element is covered with a resin, thereby forming a resin package (5). The tip end of the first outside lead, to which the other end of the anode lead 11 is welded, is configured in such a manner as to have a capacity greater than those of other portions of the first outside lead: namely, the tip end of the first outside lead is widened or thickened in such a manner as to increase the volume of the first outside lead per unit length. Thus, it is possible to provide a solid electrolytic capacitor having the structure in which inclination of the welded portion of the anode lead can be eliminated or the welding reliability of the anode lead can be enhanced without reducing the size of the sintered body in the capacitor element or increasing the size of the package.
Abstract:
A method and assembly are provided for mounting a solid electrolytic capacitor onto a printed circuit board including an anode pad and a cathode pad. The capacitor includes a capacitor element which has an anode and a cathode electrically separated by a dielectric substance. The cathode includes an outer cathode terminal layer formed over the element. The method includes the steps of removing a part of the cathode terminal layer to expose a flat anode terminal surface, attaching the element to the printed circuit board for bringing the cathode terminal layer into electrical connection with the cathode pad, electrically connecting the flat anode terminal surface to the anode pad via a metal wire, and enclosing the element in a resin member for protection.
Abstract:
A solid electrolyte capacitor includes a capacitor element, an anode lead, and a cathode lead. The capacitor element includes a capacitor chip, an anode wire projecting from the capacitor chip, and a cathode electrode formed on outer surfaces of the capacitor chip. The anode lead is electrically connected to the anode wire, whereas the cathode lead is electrically connected to the cathode electrode. A method for making such a solid electrolyte capacitor includes a laser irradiation step for irradiating the anode wire with a laser beam, and a connection step for connecting the anode wire with the anode lead after the laser irradiation step.
Abstract:
Provided is a solid electrolytic capacitor including a capacitor element, an internal anode lead extending from a substantially central portion of one lateral surface of the capacitor element, other surfaces of the capacitor element normal to the lateral surface being adapted to serve as cathode terminal walls, an external anode lead connected to the internal anode lead, an external cathode lead connected to one of the cathode terminal wall, and a resin mold encapsulating the capacitor element as well as connecting portions associated therewith, wherein the external anode lead connected to the internal anode lead is bent to have at least two steps at its end portion, a lower step of said at least two steps being fixed to another one of the cathode terminal walls through an insulating material, an upper step of said at least two steps being fixed to the internal anode lead. The solid electrolytic capacitor prevents the capacitor element thereof from being displaced and the leads thereof from breaking, allows an easy assembling operation, and contributes to the down-scaling of a capacitor.
Abstract:
A package-type solid electrolytic capacitor is provided which comprises a pair of capacitor elements, a pair of diodes associated with the capacitor elements, a pair of leads associated with the capacitor elements and the diodes, and a resin package enclosing the capacitor elements, the diodes and part of the leads. The leads may be exchangeably connectable to a positive and a negative electrodes of a circuit pattern. In one state of lead connection, one of the diodes passes a current only for one of the capacitor elements. In the other state of lead connection, the other diode passes a current only for the other capacitor element. Thus, the capacitor is non-polar and therefore can be mounted without paying any attention to the polarity.
Abstract:
A solid electrolytic capacitor is constructed by a capacitor element body, a metal rod extended through the central part of the element body, an anode member, and an insulating layer placed between the flange part of the anode member and the element body. The capacitor element body consists of a chip-like porous solid formed by shaping and sintering rectifying metal particles, the porous solid having a dielectric layer and a solid electrolytic layer both being formed thereon. The anode member includes a protruded part and a flange part, the end face of the protruded part being brought into contact and connected with one of the end faces of the metal rod. A method of manufacturing solid electrolytic capacitors thus constructed is also disclosed.