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公开(公告)号：US5410445A
公开(公告)日：1995-04-25
申请号：US235808
申请日：1994-04-29
Applicant: Yasuo Kanetake
Inventor： Yasuo Kanetake
Abstract: A solid electrolytic capacitor is provided which comprises a capacitor element including a chip and an anode wire projecting from the chip, an anode lead electrically connected to the anode wire, a cathode lead electrically connected to the chip, and a resin package enclosing the capacitor element together with part of the anode and cathode leads. The resin package has a first end face from which the cathode lead projects out, and a second end face located adjacent to the anode lead. Each of the anode and cathode leads is bent outside the package toward the underside thereof. The resin package includes a larger width portion adjacent to the first end face and a smaller width portion adjacent to the second end face. The anode lead extends transversely of the anode wire and projects laterally from the smaller width portion.
Abstract translation: 提供一种固体电解电容器，其包括电容器元件，该电容器元件包括芯片和从该芯片突出的阳极引线，阳极引线与阳极引线电连接，阴极引线与芯片电连接，以及封装电容元件 以及阳极和阴极引线的一部分。 树脂封装具有第一端面，阴极引线从该第一端面突出，以及位于阳极引线附近的第二端面。 阳极和阴极引线中的每一个朝向其下侧弯曲。 树脂封装包括与第一端面相邻的较大宽度部分和与第二端面相邻的较小宽度部分。 阳极引线横向于阳极引线延伸并从较小宽度部分横向突出。
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公开(公告)号：US5387762A
公开(公告)日：1995-02-07
申请号：US170785
申请日：1993-12-21
Applicant: Miki Hasegawa , Yasuo Kanetake
Inventor： Miki Hasegawa , Yasuo Kanetake
CPC classification number: H01L21/4842 , H01L23/49555 , H05K3/3426 , H01L2924/0002 , H05K2201/10651 , H05K2201/10689 , H05K2201/10984 , H05K2203/041 , Y02P70/613 , Y10T29/4914
Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
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3.发明申请公开(公告)号：US20100103588A1
公开(公告)日：2010-04-29
申请号：US12530273
申请日：2008-03-07
Applicant: Naoaki Tsurumi , Yasuo Kanetake
Inventor： Naoaki Tsurumi , Yasuo Kanetake
CPC classification number: H01G9/052 , H01G9/0032 , H01G9/0525 , H01G9/07 , Y10T29/417
Abstract: A composite material (A) includes a porous sintered body (12) and an insulation film (2) which covers the porous sintered body (12). The porous sintered body (12) is made of a combination of a metal element (12a) which has a melting temperature not lower than 1600° C., and a nonmetal element (12b, 12c). The insulation film (2) includes the nonmetal element (12b, 12c) and N.
Abstract translation: 复合材料（A）包括多孔烧结体（12）和覆盖多孔烧结体（12）的绝缘膜（2）。 多孔烧结体（12）由熔融温度不低于1600℃的金属元件（12a）和非金属元件（12b，12c）的组合构成。 绝缘膜（2）包括非金属元件（12b，12c）和N。
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公开(公告)号：US06493214B1
公开(公告)日：2002-12-10
申请号：US09616064
申请日：2000-07-13
Applicant: Yasuo Kanetake , Makoto Aoyama
Inventor： Yasuo Kanetake , Makoto Aoyama
IPC: H01G904
CPC classification number: H01G9/012
Abstract: An anode lead (11) is embedded at one end thereof in a sintered body in a capacitor element (1), and is welded at the other end thereof to a first outside lead (2). A cathode (12) is electrically connected to a second outside lead (3). The capacitor element is covered with a resin, thereby forming a resin package (5). The tip end of the first outside lead, to which the other end of the anode lead 11 is welded, is configured in such a manner as to have a capacity greater than those of other portions of the first outside lead: namely, the tip end of the first outside lead is widened or thickened in such a manner as to increase the volume of the first outside lead per unit length. Thus, it is possible to provide a solid electrolytic capacitor having the structure in which inclination of the welded portion of the anode lead can be eliminated or the welding reliability of the anode lead can be enhanced without reducing the size of the sintered body in the capacitor element or increasing the size of the package.
Abstract translation: 阳极引线（11）的一端嵌入到电容器元件（1）的烧结体中，并且在另一端焊接到第一外引线（2）。 阴极（12）电连接到第二外引线（3）。 电容器元件被树脂覆盖，从而形成树脂封装（5）。 阳极引线11的另一端被焊接的第一外部引线的尖端被构造成具有比第一外部引线的其他部分的容量更大的容量：即，尖端 的第一外部引线的宽度增加或增厚，以增加每单位长度的第一外部引线的体积。 因此，可以提供一种固体电解电容器，其具有可以消除阳极引线的焊接部分的倾斜或者可以增强阳极引线的焊接可靠性而不减小电容器中的烧结体的尺寸的结构 元件或增加包装的尺寸。
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5.发明授权Method of mounting solid electrolytic capacitor onto printed circuit board, and assembly of the capacitor and the board 失效将固体电解电容器安装到印刷电路板上的方法，以及电容器和电路板的组装
公开(公告)号：US5784248A
公开(公告)日：1998-07-21
申请号：US832910
申请日：1997-04-04
Applicant: Tomohiro Tomiyasu , Yasuo Kanetake
Inventor： Tomohiro Tomiyasu , Yasuo Kanetake
IPC: H01G2/06 , H01G2/04 , H01G9/00 , H01G9/004 , H01G9/012 , H01G9/04 , H01G9/052 , H01G9/12 , H01L21/60 , H05K1/02 , H05K3/28 , H05K3/30 , H05K3/32
CPC classification number: H01G2/04 , H01G9/012 , H01L24/48 , H05K1/0201 , H05K3/328 , H01L2224/05599 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/49175 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01025 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H05K1/0263 , H05K2201/10181 , H05K2201/10287 , H05K2201/10477 , H05K2203/049 , H05K3/284 , H05K3/303 , H05K3/305 , H05K3/321
Abstract: A method and assembly are provided for mounting a solid electrolytic capacitor onto a printed circuit board including an anode pad and a cathode pad. The capacitor includes a capacitor element which has an anode and a cathode electrically separated by a dielectric substance. The cathode includes an outer cathode terminal layer formed over the element. The method includes the steps of removing a part of the cathode terminal layer to expose a flat anode terminal surface, attaching the element to the printed circuit board for bringing the cathode terminal layer into electrical connection with the cathode pad, electrically connecting the flat anode terminal surface to the anode pad via a metal wire, and enclosing the element in a resin member for protection.
Abstract translation: 提供了一种将固体电解电容器安装到包括阳极焊盘和阴极焊盘的印刷电路板上的方法和组件。 该电容器包括电容器元件，其具有由电介质物质电隔离的阳极和阴极。 阴极包括形成在元件上的外阴极端子层。 该方法包括以下步骤：去除阴极端子层的一部分以暴露平坦的阳极端子表面，将该元件附着到印刷电路板上，以使阴极端子层与阴极焊盘电连接，将平坦的阳极端子 通过金属线将其表面连接到阳极焊盘，并将元件封装在树脂构件中用于保护。
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Patent Agency Ranking
6.发明授权公开(公告)号：US08379370B2
公开(公告)日：2013-02-19
申请号：US12530273
申请日：2008-03-07
Applicant: Naoaki Tsurumi , Yasuo Kanetake
Inventor： Naoaki Tsurumi , Yasuo Kanetake
CPC classification number: H01G9/052 , H01G9/0032 , H01G9/0525 , H01G9/07 , Y10T29/417
Abstract: A composite material (A) includes a porous sintered body (12) and an insulation film (2) which covers the porous sintered body (12). The porous sintered body (12) is made of a combination of a metal element (12a) which has a melting temperature not lower than 1600° C., and a nonmetal element (12b, 12c). The insulation film (2) includes the nonmetal element (12b, 12c) and N.
Abstract translation: 复合材料（A）包括多孔烧结体（12）和覆盖多孔烧结体（12）的绝缘膜（2）。 多孔烧结体（12）由熔融温度不低于1600℃的金属元件（12a）和非金属元件（12b，12c）的组合构成。 绝缘膜（2）包括非金属元件（12b，12c）和N.
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公开(公告)号：US5451716A
公开(公告)日：1995-09-19
申请号：US302454
申请日：1994-09-09
Applicant: Miki Hasegawa , Yasuo Kanetake
Inventor： Miki Hasegawa , Yasuo Kanetake
CPC classification number: H01L21/4842 , H01L23/49555 , H05K3/3426 , H01L2924/0002 , H05K2201/10651 , H05K2201/10689 , H05K2201/10984 , H05K2203/041 , Y02P70/613 , Y10T29/4914
Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
Abstract translation: 提供一种电子部件，其包括用于封装内部部件的树脂封装体和至少一个从树脂封装体伸出以具有粘结端的引线端子。 引线端子被弯曲以在引线端子和树脂封装之间提供腋窝状部分，用于将焊丝保持在夹持状态。 在将电子部件安装到电路板时，使焊丝在焊接温度下熔化，以与沿着引线端子的接合端的焊锡焊片合并。
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公开(公告)号：US5432672A
公开(公告)日：1995-07-11
申请号：US135344
申请日：1993-10-13
Applicant: Chojiro Kuriyama , Yasuo Kanetake
Inventor： Chojiro Kuriyama , Yasuo Kanetake
CPC classification number: H01G9/0003
Abstract: A solid electrolytic capacitor of the type having a built-in fuse is disclosed in which a connecting portion between the fuse and a capacitor element is made thin and securely formed to accommodate the capacitor element to be increased in capacitance without changing the outer size of a resin package. The solid electrolytic capacitor including a capacitor element, an internal anode lead extending from one surface of the capacitor element, other surfaces of the capacitor element serving as a cathode terminal wall, an external anode lead connected to the internal anode lead, an external cathode lead connected to the cathode terminal wall through a fuse, and a resin package encapsulating the capacitor element, the fuse and respective connecting portions of the external anode lead and the external cathode lead. A connecting portion between the fuse and one end of the external cathode lead lies adjacent the capacitor element and in or out of a plane coplanar with the surface of the cathode terminal wall to which the fuse is pressure-welded.
Abstract translation: 公开了一种具有内置熔丝的固体电解电容器，其中熔丝和电容器元件之间的连接部分被制成薄且牢固地形成，以容纳电容器元件以增加电容而不改变电容元件的外部尺寸 树脂包装。 固体电解电容器包括电容器元件，从电容器元件的一个表面延伸的内部阳极引线，用作阴极端子壁的电容器元件的其他表面，连接到内部阳极引线的外部阳极引线，外部阴极引线 通过熔丝连接到阴极端子壁，以及封装电容器元件的树脂封装，外部阳极引线和外部阴极引线的熔丝和相应的连接部分。 保险丝和外部阴极引线的一端之间的连接部分位于电容器元件附近并且在与熔丝被熔接的阴极端子壁的表面共面的平面内或外部。
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公开(公告)号：US5781401A
公开(公告)日：1998-07-14
申请号：US754309
申请日：1996-11-21
Applicant: Tomohiro Tomiyasu , Yasuo Kanetake
Inventor： Tomohiro Tomiyasu , Yasuo Kanetake
CPC classification number: H01G9/012 , Y10T29/417
Abstract: An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.
Abstract translation: 封装的固体电解电容器具有阳极引线端子，阴极引线端子，电容器元件和由合成树脂材料制成并且完全封装电容器元件的模具。 电容器元件具有从主体纵向突出的阳极棒，并且设置在阳极引线端子和阴极引线端子之间，其主体与阴极引线端子电连接。 阳极棒的顶端焊接到阳极引线端子。 阳极引线端子与其一体形成为纵向呈L形的凸起部分，并且能够将阳极棒插入其中间部分，防止其在焊接时弯曲。
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公开(公告)号：US5446623A
公开(公告)日：1995-08-29
申请号：US294017
申请日：1994-08-23
Applicant: Yasuo Kanetake
Inventor： Yasuo Kanetake
IPC: H01G4/228 , H01G9/00 , H01G9/004 , H01G9/008 , H01L23/495 , H05K1/18 , H05K3/34 , H01R9/00 , H05K7/02
CPC classification number: H01G9/008 , H01L23/49555 , H05K3/3426 , H01L2224/32245 , H05K2201/0969 , H05K2201/10568 , H05K2203/167 , H05K2203/168 , Y02P70/613
Abstract: A surface mounting type polar electronic component is provided which comprises a polar element electrically connected to a positive lead and a negative lead, and a package enclosing the polar element together with part of the respective leads, the package having a mounting face. The leads have respective contact ends bent substantially in parallel to the mounting face of the package for contact with corresponding electrode pads of a circuit board. One of the leads has a projection extending beyond the contact end of said one lead for insertion into an insertion hole formed at a relevant one of the electrode pads.
Abstract translation: 提供表面安装型极性电子部件，其包括电连接到正引线和负引线的极性元件，以及将极性元件与部分引线封装的封装，封装具有安装面。 引线具有基本平行于封装的安装面弯曲的相应接触端，用于与电路板的相应电极焊盘接触。 引线之一具有延伸超过所述一个引线的接触端的突起，用于插入形成在相关一个电极焊盘上的插入孔中。
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