公开(公告)号：US20110316119A1

公开(公告)日：2011-12-29

申请号：US13168111

申请日：2011-06-24

Applicant: Yong-hoon KIM ,  Yeong-jun Cho ,  Ji-hyun Lee ,  Hee-seok Lee

Inventor： Yong-hoon KIM ,  Yeong-jun Cho ,  Ji-hyun Lee ,  Hee-seok Lee

IPC: H01L23/485

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/228 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/642 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1902 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Provided is a semiconductor package including a de-coupling capacitor. The semiconductor package includes a substrate, on an upper surface of which a semiconductor chip is mounted; a plurality of first conductive bumps that are disposed on a lower surface of the substrate and that electrically connect the substrate to an external device; and a de-coupling capacitor that is disposed on the lower surface of the substrate and includes an electrode portion and at least one dielectric layer, wherein the electrode portion of the de-coupling capacitor includes second conductive bumps that electrically connect the substrate to an external device.

Abstract translation: 提供了包括去耦电容器的半导体封装。 半导体封装包括：衬底，其上表面安装有半导体芯片; 多个第一导电凸块，其设置在所述基板的下表面上，并将所述基板电连接到外部装置; 以及解耦电容器，其设置在所述基板的下表面上并且包括电极部分和至少一个电介质层，其中所述解耦电容器的电极部分包括将所述基板电连接到外部的第二导电凸块 设备。