Article alignment method
    1.
    发明授权
    Article alignment method 失效
    文章对齐方式

    公开(公告)号:US5152055A

    公开(公告)日:1992-10-06

    申请号:US691658

    申请日:1991-04-26

    IPC分类号: H01L21/68

    摘要: Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30). Translational alignment of the arrays of first and second conductive members (16,18) is accomplished by displacing the substrate (14) so that the first and second conductive members in the first column on the article and substrate, respectively, are aligned at the same time that the first and second conductive members in the first row of first and second conductive members on the article and substrate, respectively, are aligned.

    摘要翻译: 多个垂直的第一导电构件(16)中的每一个以物体(12)上的正交行和列的阵列与在衬底(14)上排列成类似阵列的对应的第二导电构件(18)对准, 通过将制品定位成与衬底隔开的关系来实现。 第一和第二导电构件(16,18)的阵列首先通过旋转制品(12)而成角度地对准,使得分别在制品和基底上的第一和第二导电构件的第一列之间的偏移,如 物品和基板的第一端处的电视摄像机(32)分别与第二相机(30)所看到的另一端分别与物品和基板上的第一和第二部件之间的偏移相同 )。 第一和第二导电构件(16,18)的阵列的平移对准是通过移动衬底(14)来实现的,使得制品和衬底上的第一列中的第一和第二导电构件分别对准 第一和第二导电构件中的第一导电构件和第二导电构件中的第一和第二导电构件分别对准的时间。

    Article alignment method and apparatus
    3.
    发明授权
    Article alignment method and apparatus 失效
    物品对准方法和装置

    公开(公告)号:US5194948A

    公开(公告)日:1993-03-16

    申请号:US891089

    申请日:1992-06-01

    IPC分类号: H01L21/68

    摘要: Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30). Translational alignment of the arrays of first and second conductive members (16,18) is accomplished by displacing the substrate (14) so that the first and second conductive members in the first column on the article and substrate, respectively, are aligned at the same time that the first and second conductive members in the first row of first and second conductive members on the article and substrate, respectively, are aligned.

    摘要翻译: 多个垂直的第一导电构件(16)中的每一个以物体(12)上的正交行和列的阵列与在衬底(14)上排列成类似阵列的对应的第二导电构件(18)对准, 通过将制品定位成与衬底隔开的关系来实现。 第一和第二导电构件(16,18)的阵列首先通过旋转制品(12)而成角度地对准,使得分别在制品和基底上的第一和第二导电构件的第一列之间的偏移,如 物品和基板的第一端处的电视摄像机(32)分别与第二相机(30)所看到的另一端分别与物品和基板上的第一和第二部件之间的偏移相同 )。 第一和第二导电构件(16,18)的阵列的平移对准是通过移动衬底(14)来实现的,使得制品和衬底上的第一列中的第一和第二导电构件分别对准 第一和第二导电构件中的第一导电构件和第二导电构件中的第一和第二导电构件分别对准的时间。

    Method and compositions for achieving a kinetically controlled solder
bond
    4.
    发明授权
    Method and compositions for achieving a kinetically controlled solder bond 失效
    用于实现动态控制的焊料接合的方法和组合物

    公开(公告)号:US5990560A

    公开(公告)日:1999-11-23

    申请号:US955686

    申请日:1997-10-22

    CPC分类号: B23K35/0238 B23K35/001

    摘要: An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.

    摘要翻译: 公开了用于实现动力学控制的焊料接合的改进的方法和组合物,其特别适用于制造混合集成电路和光学组件。 该方法包括使用焊料层,淬火层和设置在焊料层和淬火层之间的控制层,其中控制层有利地由铂薄膜组成。 此外,还优选由铂薄膜构成的阻挡层设置在焊料层和待接合部件之间,以防止在焊接过程期间焊料材料的氧化或焊接部件的后续存储。