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公开(公告)号：US5152055A
公开(公告)日：1992-10-06
申请号：US691658
申请日：1991-04-26
IPC分类号： H01L21/68
CPC分类号： H01L21/681 , Y10T29/49133 , Y10T29/53091
摘要： Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30). Translational alignment of the arrays of first and second conductive members (16,18) is accomplished by displacing the substrate (14) so that the first and second conductive members in the first column on the article and substrate, respectively, are aligned at the same time that the first and second conductive members in the first row of first and second conductive members on the article and substrate, respectively, are aligned.
摘要翻译： 多个垂直的第一导电构件（16）中的每一个以物体（12）上的正交行和列的阵列与在衬底（14）上排列成类似阵列的对应的第二导电构件（18）对准， 通过将制品定位成与衬底隔开的关系来实现。 第一和第二导电构件（16,18）的阵列首先通过旋转制品（12）而成角度地对准，使得分别在制品和基底上的第一和第二导电构件的第一列之间的偏移，如 物品和基板的第一端处的电视摄像机（32）分别与第二相机（30）所看到的另一端分别与物品和基板上的第一和第二部件之间的偏移相同 ）。 第一和第二导电构件（16,18）的阵列的平移对准是通过移动衬底（14）来实现的，使得制品和衬底上的第一列中的第一和第二导电构件分别对准 第一和第二导电构件中的第一导电构件和第二导电构件中的第一和第二导电构件分别对准的时间。
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公开(公告)号：US5194948A
公开(公告)日：1993-03-16
申请号：US891089
申请日：1992-06-01
IPC分类号： H01L21/68
CPC分类号： H01L21/681 , Y10T29/49131 , Y10T29/49133 , Y10T29/53178
摘要： Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30). Translational alignment of the arrays of first and second conductive members (16,18) is accomplished by displacing the substrate (14) so that the first and second conductive members in the first column on the article and substrate, respectively, are aligned at the same time that the first and second conductive members in the first row of first and second conductive members on the article and substrate, respectively, are aligned.
摘要翻译： 多个垂直的第一导电构件（16）中的每一个以物体（12）上的正交行和列的阵列与在衬底（14）上排列成类似阵列的对应的第二导电构件（18）对准， 通过将制品定位成与衬底隔开的关系来实现。 第一和第二导电构件（16,18）的阵列首先通过旋转制品（12）而成角度地对准，使得分别在制品和基底上的第一和第二导电构件的第一列之间的偏移，如 物品和基板的第一端处的电视摄像机（32）分别与第二相机（30）所看到的另一端分别与物品和基板上的第一和第二部件之间的偏移相同 ）。 第一和第二导电构件（16,18）的阵列的平移对准是通过移动衬底（14）来实现的，使得制品和衬底上的第一列中的第一和第二导电构件分别对准 第一和第二导电构件中的第一导电构件和第二导电构件中的第一和第二导电构件分别对准的时间。
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公开(公告)号：US5174021A
公开(公告)日：1992-12-29
申请号：US708327
申请日：1991-05-31
IPC分类号： H01L21/00 , H01L21/683
CPC分类号： H01L21/67144 , H01L21/6838 , Y10T279/11 , Y10T29/49144 , Y10T29/53178 , Y10T29/53191
摘要： A first flat surface portion (17) of an upper mounting member (11) is made to be parallel with a second flat surface portion (18) of a lower mounting member (12) by, first, supporting the lower mounting member on a spherical cushion of air defined by a lower surface portion (20). The first surface portion (17) is next brought into contact with the second surface portion (18) which causes an adjustment in the position of lower mounting member (12) so as to make the surfaces (17) and (18) coplanar. The air supply to the lower mounting member is then reversed to apply a vacuum which draws the lower mounting member (12) into contact with the support member (22) so as to fix the second surface portion (18) in a parallel relationship to that of the first surface portion (17).
摘要翻译： 上部安装构件（11）的第一平面部分（17）通过首先将下部安装构件支撑在球形的壳体上而与下部安装构件（12）的第二平坦表面部分（18）平行， 由下表面部分（20）限定的空气缓冲垫。 第一表面部分（17）接着与第二表面部分（18）接触，这导致下部安装部件（12）的位置的调节，以使表面（17）和（18）共面。 然后将下部安装构件的空气供给反向，以施加将下部安装构件（12）与支撑构件（22）接触的真空，以便将第二表面部分（18）与 的第一表面部分（17）。
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公开(公告)号：US5178723A
公开(公告)日：1993-01-12
申请号：US787153
申请日：1991-11-04
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
CPC分类号： G02B6/362 , G02B6/32 , G02B6/3652 , G02B6/3692 , G02B6/3855
摘要： A holder member (32) is made with a configuration of indentations (33) corresponding to the indentations (24, 25) on a substrate (23) within which optical elements (11-14, 16-19) are to be bonded. Vacuum channels (34) are made in the holder member, each communicating with one of the holder indentations (33), through which a vacuum is applied to temporarily hold the optical elements in place. The substrate containing the indentations or grooves within which optical elements are to be bonded is then positioned above the optical elements mounted in the holder member (FIG. 8). The optical elements are simultaneously bonded to the substrate by lowering the substrate to contact the elements to effect the bond. After bonding, the holder vacuum is released and the substrate (23) is withdrawn with all of the optical elements (11-14, 16-19) bonded to it.
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公开(公告)号：US5478005A
公开(公告)日：1995-12-26
申请号：US267053
申请日：1994-06-27
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
CPC分类号： B23K1/012
摘要： For soldering together two surfaces of a workpiece by means of solder, and without the use of a solder flux, apparatus includes means for preheating the workpiece and solder to a temperature close to but less than the solder fusing temperature, and means for directing two jets of a hot, non-oxidizing gas towards the preform from opposite sides thereof and along a straight line axis. The hot gas melts the solder and causes flow of the melted solder between the two surfaces in directions generally transverse to the axis of the two gas jets.
摘要翻译： 为了通过焊料将工件的两个表面焊接在一起，并且不使用助焊剂，装置包括用于将工件和焊料预热到接近但小于焊料熔合温度的温度的装置，以及用于引导两个射流 的热的非氧化性气体从其相对侧并沿着直线轴向朝向预成型件。 热气体熔化焊料并导致熔化的焊料在两个表面之间的流动方向大致横向于两个气体射流的轴线。
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公开(公告)号：US5304460A
公开(公告)日：1994-04-19
申请号：US954190
申请日：1992-09-30
申请人： Joe A. Fulton , Hung N. Nguyen
发明人： Joe A. Fulton , Hung N. Nguyen
IPC分类号： H01L21/60 , H01L21/68 , H01L23/12 , H01L23/498 , H01R43/00 , H05K3/32 , G03C5/00 , H01L21/70
CPC分类号： H01L21/6835 , H01L23/49827 , H01L2924/0002 , Y10T29/49144
摘要： A first conductor array (24, FIG. 5) of an electronic device (21) such as an integrated circuit is interconnected to a second conductor array (25) of a first substrate (22) by, first, using photolithographic masking and etching to make an array of substantially uniformly spaced apertures (15, FIG. 2) in a mask (11). The mask is located over a second substrate (12), and the apertures are used to form an array of substantially uniformly spaced metal particles (19). The metal particles are joined with insulative material (11) to form a layer of anisotropic conductive material (20), and the anisotropic conductive material layer is removed from the second substrate. The conductors (24) in the first conductor array of the electronic device are registered with conductors (25) of the second conductor array of the first substrate (22), and the layer of anisotropic conductive materials is compressed between the first and second conductor arrays. This causes individual particles of the layer of anisotropic conductive material to make simultaneous contact with conductors of the first (24) and second (25) conductor arrays so as to interconnect the electronic device to the conductors of the first substrate. The insulative material (11) may be an adhesive, in which case it permanently bonds the device (21) to the substrate (22), or alternatively, the anisotropic conductive material (20) may only temporarily interconnect the electronic device with the first substrate as is required for testing of the device.
摘要翻译： 诸如集成电路的电子器件（21）的第一导体阵列（24，图5）通过首先使用光刻掩模和蚀刻与第一衬底（22）的第二导体阵列（25）互连 在掩模（11）中形成基本上均匀间隔开的孔（图2中的15）的阵列。 掩模位于第二基底（12）上方，并且孔用于形成基本均匀间隔的金属颗粒（19）的阵列。 金属颗粒与绝缘材料（11）接合以形成各向异性导电材料层（20），并且从第二基板去除各向异性导电材料层。 电子设备的第一导体阵列中的导体（24）与第一基板（22）的第二导体阵列的导体（25）配准，并且各向异性导电材料层在第一和第二导体阵列之间被压缩 。 这导致各向异性导电材料层的单个颗粒与第一（24）和第二（25）导体阵列的导体同时接触，以将电子器件互连到第一衬底的导体。 绝缘材料（11）可以是粘合剂，在这种情况下，其将装置（21）永久地结合到基板（22），或者备选地，各向异性导电材料（20）可以仅暂时将电子装置与第一基板 这是测试设备所需要的。
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公开(公告)号：US5155302A
公开(公告)日：1992-10-13
申请号：US720067
申请日：1991-06-24
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
IPC分类号： H01L21/60 , H01L23/492 , H01L23/498 , H01R13/24
CPC分类号： H01R13/2414 , H01L23/4922 , H01L23/49827 , H01R12/714 , H01L2924/0002
摘要： External connections are made in an electronic device (11) having on an upper surface an array of contact pads (12) by providing successively over the electronic device a first anisotropic member (13), a first flat insulator member (14) having on an upper surface a first conductor pattern (29), a second flat anisotropic conductor member (15), and a second flat insulator member (17) having on an upper surface a second conductor pattern (30). The two flat insulator members contain an array of conductive vias (25, 26) extending between opposite surfaces. The first anistropic conductor member (13) and a first array of conductive vias (25) extending through the first insulative member (14) interconnects a first plurality of contact pads (12) on the electronic device (11) to the first conductor pattern (29) which includes a peripheral array of contact pads (32) to which external connections are made. Means for interconnecting a second plurality of the contact pads on the electronic device to the second conductor pattern (30) comprise the second flat anisotropic conductor member (15) and a second array of conductive vias (26) extending through the second insulator member (17), the first array of conductive vias (25) and the first anisotropic conductor member (13).
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公开(公告)号：US5477933A
公开(公告)日：1995-12-26
申请号：US327959
申请日：1994-10-24
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
CPC分类号： H01L23/49816 , H01L23/49827 , H01L23/49833 , H05K1/141 , H05K3/3436 , H01L2224/16 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H05K2201/049 , H05K2201/10378 , H05K2201/10734 , H05K3/368 , Y02P70/613
摘要： An electronic device (11) has on one surface a first ball grid array (12) having a first area. The first ball grid array is bonded to a first intermediate interconnection member (13) having on an opposite surface a second ball grid array having the same number of solder balls (23) as the first array, but of a significantly larger area than that of the first array. Each of the solder balls (23) of the second ball grid array is connected by a connection comprising a conductive via ( 18, 19) extending through the first interconnection member (13) to one of the solder balls of the first ball grid array.
摘要翻译： 电子设备（11）在一个表面上具有具有第一区域的第一球栅阵列（12）。 第一球栅阵列结合到第一中间互连构件（13），第一中间互连构件（13）在相对表面上具有与第一阵列相同数量的焊球（23）的第二球栅阵列，但是具有比 第一个数组。 第二球栅阵列的每个焊球（23）通过包括延伸穿过第一互连构件（13）的导电通孔（18,19）连接到第一球栅阵列的焊球之一的连接来连接。
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公开(公告)号：US5383118A
公开(公告)日：1995-01-17
申请号：US948543
申请日：1992-09-23
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
CPC分类号： G02B7/005 , G02B6/4221
摘要： First and second devices, such as a laser (11) and an optical fiber (12), are aligned by first positioning the laser on an x-y-z table (13) (such a table is capable of responding to electrical signals to make precise movements in mutually orthogonal x,y and z directions). The laser beam is imaged onto a machine vision camera (19) which develops signals representing the image of the laser beam and directs them to a computer (16). The computer analyzes the signal, calculates the center of the image, and determines from such calculation any deviations in the x and y directions of the position of the laser from its desired alignment position. Next, the optical fiber (12) is imaged on a machine vision camera (17). Signals from the camera representative of the image of the optical fiber end are directed to the computer (16) which calculates the center of the image and determines any deviation from its desired position. Finally, the x-y-z table is moved such that the laser is in approximate alignment with the optical fiber end, and signals from the computer are used to make fine adjustments of the position of the x-y-z table to compensate for the deviations of the laser from its assigned position and deviations of the optical fiber end from its assigned position.
摘要翻译： 通过首先将激光定位在xyz台（13）上（诸如激光器（11）和光纤（12））来对准第一和第二装置（这样的表格能够响应于电信号来进行精确的移动 相互正交的x，y和z方向）。 激光束被成像到机器视觉摄像机（19）上，该摄像机产生表示激光束的图像的信号并将其引导到计算机（16）。 计算机分析信号，计算图像的中心，并从这样的计算中确定激光器的位置的x和y方向与其期望的对准位置之间的任何偏差。 接下来，将光纤（12）成像在机器视觉摄像机（17）上。 来自代表光纤端的图像的相机的信号被引导到计算图像的中心的计算机（16），并且确定与其期望位置的任何偏差。 最后，移动xyz表使得激光与光纤端大致对齐，并且来自计算机的信号用于对xyz表的位置进行微调，以补偿激光与其分配的偏差 光纤端部与其指定位置的位置和偏差。
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公开(公告)号：US5194105A
公开(公告)日：1993-03-16
申请号：US752140
申请日：1991-08-29
申请人： Hung N. Nguyen
发明人： Hung N. Nguyen
CPC分类号： G02B6/362 , B23K20/02 , B23K33/00 , G02B6/32 , G02B6/4236 , G02B7/027 , G02B6/3636 , G02B6/4226 , Y10S269/903 , Y10T279/11
摘要： Apparatus (11) is robotically operated to pick up an optical element such as a ball lens (12) or an optical fiber, place it in a groove or depression (13) of a substrate (14), and apply pressure to it so that it is bonded to the substrate. The tool comprises a retracting element holder (17) surrounding a bonding tool (16). A vacuum channel (18) communicates with the element holder so that, by the application of a vacuum, it can pick up an optical element. The tool then moves the element to place it, for example, in a depression (13) of a substrate, whereupon the vacuum is released, thereby to allow the element to nest between opposing sidewalls of the depression. The retracting holder element is simultaneously retracted vertically upwardly so as to expose a bonding surface of the bonding tool. After the element has nested in the groove, the bonding tool contacts the element and forces it against opposite sidewalls to effect a thermo-compression bond of the optical element with the sidewalls.
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