摘要:
A semiconductor structure and methods for forming the same are provided. The semiconductor structure includes a first MOS device of a first conductivity type and a second MOS device of a second conductivity type opposite the first conductivity type. The first MOS device includes a first gate dielectric on a semiconductor substrate; a first metal-containing gate electrode layer over the first gate dielectric; and a silicide layer over the first metal-containing gate electrode layer. The second MOS device includes a second gate dielectric on the semiconductor substrate; a second metal-containing gate electrode layer over the second gate dielectric; and a contact etch stop layer having a portion over the second metal-containing gate electrode layer, wherein a region between the portion of the contact etch stop layer and the second metal-containing gate electrode layer is substantially free from silicon.
摘要:
A method of configuring an eddy current detector to measure a thickness of a coating on a substrate includes measuring an impedance of the coated substrate, and establishing an impendence plane plot using a computer. The method may also include determining a rotation angle. The rotation angle may be an angle of rotation of the impedance plane plot that will make the inductive reactance component of the impedance substantially insensitive to substrate electrical conductivity within a coating thickness range. The method may further include establishing a calibration curve that is substantially insensitive to substrate electrical conductivity using the rotation angle. The calibration curve may be a curve that relates the inductive reactance component of the impedance to coating thickness.
摘要:
A semiconductor device is disclosed that includes: a substrate; a first dielectric layer formed over the substrate and formed of a first high-k material, the first high-k material selected from the group consisting of HfO2, HfSiO, HfSiON, HfTaO, HfTiO, HfTiTaO, HfAlON, and HfZrO; a second dielectric layer formed over the first dielectric layer and formed of a second high-k material, the second high-k material being different than the first high-k material and selected from the group consisting of HfO2, HfSiO, HfSiON, HfTaO, HfTiO, HfTiTaO, HfAlON, and HfZrO; and a metal gate formed over the second dielectric layer. The first dielectric layer includes ions selected from the group consisting of N, O, and Si.
摘要:
An LED based omni-directional light engine includes a toroidal lens coupled to a controller circuit board and two or more evenly spaced LEDs mounted to the controller circuit board. The toroidal lens includes an inner surface coated with a layer of reflection materials, an outer surface, and a flat base surface. The controller circuit board is electrically coupled to a power source. The LEDs are located immediately under the flat base surface. The inner surface substantially reflects light beams emitted from the LEDs to the outer surface which refracts the beams to the omni-directions.
摘要:
A measurement system is disclosed for determining a sulfur concentration in a liquid, such as a liquid fuel. The measurement system includes a first electrode that is at least partially coated with zinc oxide and, more specifically, zinc oxide microstructures. The zinc oxide microstructures have a crystal lattice structure that is oriented in the (002) plane. The first electrode may be connected to an electrometer which, in turn, may be connected to a second electrode. The second electrode may be disposed on a common substrate with the first electrode or may be in the form of a plate disposed substantially parallel to the first electrode.
摘要:
The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a high-k dielectric layer over a semiconductor substrate, forming a capping layer over the high-k dielectric layer, forming a metal layer over the capping layer, forming a semiconductor layer over the metal layer, performing an implantation process on the semiconductor layer, the implantation process using a species including F, and forming a gate structure from the plurality of layers including the high-k dielectric layer, capping layer, metal layer, and semiconductor layer.
摘要:
A precision approach path indicator system (PAPI) including multiple LHA indicators and power sources. Each LHA indicator comprises several assembly modules, with each module made up of several red and white LEDs, several collimating lens, one optical combiner, and one projection lens set. From a side view of the module, the red LEDs are placed on top of white LEDs, with a collimating lens in front of each LED. The optical combiner is in front of both the red and white LEDs, slightly above the white LEDs in vertical placement. The optical combiner has a reflective coating on the bottom surface, and a red light filter coating on the projection surface. The combined beam of light is projected out through a projection lens at front of the assembly module.
摘要:
The present disclosure provides a method of fabricating a semiconductor device that includes providing a substrate having a first region and a second region, forming first and second gate stacks in the first and second regions, respectively, the first gate stack including a first dummy gate and the second gate stack including a second dummy gate, removing the first dummy gate in the first gate stack thereby forming a first trench and removing the second dummy gate in the second gate stack thereby forming a second trench, forming a first metal layer in the first trench and in the second trench, removing at least a portion of the first metal layer in the first trench, forming a second metal layer in the remainder of the first trench and in the remainder of the second trench, reflowing the second metal layer, and performing a chemical mechanical polishing (CMP).
摘要:
The present disclosure provides a semiconductor device that includes a semiconductor substrate, a transistor formed in the substrate, the transistor including a high-k gate dielectric formed over the substrate, the high-k gate dielectric having a first length measured from one sidewall to the other sidewall of the high-k gate dielectric, and a metal gate formed over the high-k gate dielectric, the metal gate having a second length measured from one sidewall to the other sidewall of the metal gate, the second length being smaller than the first length.