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    Service temperature connector and packaging structure of semiconductor device employing the same
    3.
    发明授权
    Service temperature connector and packaging structure of semiconductor device employing the same 失效
    使用其的半导体器件的使用温度连接器和封装结构

    公开(公告)号：US4950173A

    公开(公告)日：1990-08-21

    申请号：US843004

    申请日：1986-03-24

    申请人： Tetsuro Minemura ,  Hisashi Ando ,  Yoshiaki Kita ,  Isao Ikuta

    发明人： Tetsuro Minemura ,  Hisashi Ando ,  Yoshiaki Kita ,  Isao Ikuta

    IPC分类号： B32B15/01 ,  H01R4/58 ,  H01R12/34 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

    CPC分类号： H05K3/326 ,  H01R12/82 ,  H01R12/52 ,  H01R4/58 ,  H05K2201/0308 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K3/306 ,  H05K3/4092

    摘要： The present invention discloses a connector comprising: an insulating substrate having a plurality of through-holes and having a desired first circuit pattern formed on the substrate; female contactors each being formed and fixed around the edge of the through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating substrate having a desired second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature.

    摘要翻译： 本发明公开了一种连接器，包括：绝缘基板，具有多个通孔，并且具有形成在所述基板上的期望的第一电路图案; 每个都形成并固定在通孔的边缘周围的阴接触器，并且具有开口，其开口向内延伸通孔，所述阴接触器电连接到所述第一图案; 以及阳接触器，其包括其上具有期望的第二电路图案的绝缘基板和固定到所述基板并且电连接到所述第二图案的多个阳接触器销，所述引脚各自位于对应于所述第二图案的每个开口的位置 阴接触器，其中所述阴接触器由形状记忆合金的薄膜制成，并且在插入每个阳接触器销之前，给出每个阴接触器的边缘，接触器返回到形状记忆合金的形状记忆体 当所述接触器经受高于马氏体转变温度的温度时关闭开口的位置。

    Thermal printing head
    4.
    发明授权
    Thermal printing head 失效
    热敏打印头

    公开(公告)号：US4907015A

    公开(公告)日：1990-03-06

    申请号：US235530

    申请日：1988-08-24

    申请人： Toshiki Kaneko ,  Yoshiaki Kita ,  Hisashi Andoh ,  Kiyoshi Konno

    发明人： Toshiki Kaneko ,  Yoshiaki Kita ,  Hisashi Andoh ,  Kiyoshi Konno

    IPC分类号： B41J2/335 ,  B41J2/525

    CPC分类号： B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/525

    摘要： A thermal printing head in accordance with the present invention has a substrate formed of an electrical insulator, heating elements formed on the substrate, and conductive layers formed on the part of the heating elements that is adjacent to and on either side of heat generating portions of the heating elements. The resistivity of heating elements is set at a value of not less than 1000 .mu..OMEGA..cm and, simultaneously, the thickness of conductive layers is set at a value of not more than 300 nm. By virtue of this arrangement, it is possible to reduce the distance between the heat generating portions of the head and the printing paper or ink sheet, and the thin conductive layers contribute to minimizing diffusion of the heat. The thermal printing head is therefore capable of efficiently and accurately transferring heat generated by the heat generating portions to the printing paper or ink sheet. The head is suitable for producing half-tone prints and is capable of producing highly gradated prints such as fully-colored prints.

    摘要翻译： 根据本发明的热敏打印头具有由电绝缘体形成的基板，形成在基板上的加热元件和形成在加热元件的部分上的导电层，该导电层邻近发热部分的发热部分 加热元件。 加热元件的电阻率设定为不小于1000μmOMEGA·cm的值，同时导电层的厚度设定为不大于300nm。 通过这种布置，可以减小头部和印刷纸或油墨片的发热部分之间的距离，并且薄导电层有助于最小化热的扩散。 因此，热敏打印头能够有效且准确地将由发热部产生的热传递到打印纸或墨纸。 该头适用于生产半色调印刷品，并且能够生产高度分级的印刷品，如全色印刷品。

    Recording material
    8.
    发明授权
    Recording material 失效
    录音材料

    公开(公告)号：US4726858A

    公开(公告)日：1988-02-23

    申请号：US643293

    申请日：1984-08-22

    申请人： Tetsuro Minemura ,  Hisashi Ando ,  Isao Ikuta ,  Yoshiaki Kita

    发明人： Tetsuro Minemura ,  Hisashi Ando ,  Isao Ikuta ,  Yoshiaki Kita

    IPC分类号： G11B7/243 ,  C22C9/00 ,  C22C5/02 ,  C22C5/06 ,  C22C20/00

    CPC分类号： G11B7/243 ,  G11B2007/24308 ,  Y10S430/146

    摘要： A recording material made of an alloy capable of exhibiting different spectral reflectances at an equal temperature, depending on a heating-cooling cycle to which the alloy is subjected. The alloy can possess in solid state different crystal structures at a first temperature higher than the room temperature and at a second temperature lower than the first temperature but not lower than the room temperature. A part of the surface of the alloy exhibits, as a result of being quenched from the first temperature, a crystal structure which is different from the crystal structure at the second temperature, while the other part possesses the crystal structure at the second temperature, so that these two parts exhibit different spectral reflectances. Using this recording medium, it is possible to record, reproduce and erase information by means of, for example, laser beams.

    摘要翻译： 根据合金所经受的加热 - 冷却循环，由能够在相同温度下显示不同光谱反射率的合金制成的记录材料。 该合金在高于室温的第一温度和低于第一温度但不低于室温的第二温度下可以具有固态不同的晶体结构。 合金表面的一部分由于从第一温度骤冷而显示与第二温度下的晶体结构不同的晶体结构，另一部分在第二温度下具有晶体结构，因此， 这两个部分表现出不同的光谱反射率。 使用该记录介质，可以通过例如激光束来记录，再现和擦除信息。