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公开(公告)号:US07033866B2
公开(公告)日:2006-04-25
申请号:US11043224
申请日:2005-01-26
申请人: Wai Wong Chow , Zhi-Gang Bai , Clem H. Brown
发明人: Wai Wong Chow , Zhi-Gang Bai , Clem H. Brown
IPC分类号: H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
摘要翻译: 用于半导体器件的引线框架(20)包括具有限定空腔(16)的周边的第一引线框架部分(12)和从周边向内延伸的多个引线(14)和第一厚度。 第二引线框架部分(18)附接到第一引线框架部分(16)。 第二引线框架部分(18)具有容纳在第一引线框架部分(12)的空腔(16)内的管芯焊盘(20)。 第二引线框架部分(18)具有大于第一引线框架部分(12)的厚度的第二厚度。 这种双量规引线框架尤其适用于其中管芯焊盘用作散热器的大功率器件。
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公开(公告)号:US20090098686A1
公开(公告)日:2009-04-16
申请号:US12126943
申请日:2008-05-26
申请人: Xue-song Xu , Zhi-gang Bai , Nan Xu , Jin-zhong Yao
发明人: Xue-song Xu , Zhi-gang Bai , Nan Xu , Jin-zhong Yao
IPC分类号: H01L21/02
CPC分类号: H01L23/49861 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
摘要翻译: 形成具有增加的支架的预成型引线框的方法包括以下步骤:将第一带附着到引线框的第一侧,将第二带附接到引线框的第二侧。 带状引线框架放置在模具中,并开始第一模具化合物流。 模具化合物的第一流动填充第一带和模具的上模追逐之间的空间。 然后开始模具化合物的第二流程。 模具化合物的第二流动填充了管芯焊盘和引线框架的引线之间的空间。 然后将第一和第二带从引线框架移除。 提供了改进的支架,因为第一带被模具化合物的第一流动压下。
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公开(公告)号:US20080283980A1
公开(公告)日:2008-11-20
申请号:US12099794
申请日:2008-04-09
申请人: Wei Gao , Zhi-Gang Bai , Li-Wei Liu , Zhi-Jie Wang , Yuan Zang , Hong Zhu
发明人: Wei Gao , Zhi-Gang Bai , Li-Wei Liu , Zhi-Jie Wang , Yuan Zang , Hong Zhu
IPC分类号: H01L23/495 , H01R43/00 , H01L21/60
CPC分类号: H01L23/49541 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/49109 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , Y10T29/49204 , H01L2924/00014 , H01L2924/00012
摘要: A lead frame (10) for a quad flat non-leaded semiconductor package (606), includes a tie bar (12), a first group of leads (22) extending a first length from the tie bar (12) in a transverse direction (Y), and a second group of leads (24) extending a second length from the tie bar (12) in the transverse direction (Y). The second length is greater than the first length, and leads from the first and second group of leads (22, 24) alternate in a longitudinal direction (X) along the tie bar (12) so that the first and second groups of leads are staggered. The second group of leads (24) is displaced from the first group of leads (22) in a Z-direction (Z) perpendicular to both the transverse (Y) and longitudinal (X) directions. The leads of the first and second groups of leads (22, 24) each have a respective contact terminal (26 and 28) at their distal ends. The contact terminals (26 and 28) each have a contact face (40 and 42) in a contact plane (44).
摘要翻译: 用于四边形扁平非铅半导体封装(606)的引线框架(10)包括连接杆(12),在横向方向上从连接杆(12)延伸第一长度的第一组引线(22) (Y)和从所述连杆(12)沿横向(Y)延伸的第二长度的第二组引线(24)。 第二长度大于第一长度,并且来自第一和第二组引线(22,24)的引线沿着连接杆(12)在纵向(X)上交替,使得第一和第二组引线是 交错。 第二组引线(24)在垂直于横向(Y)和纵向(X)方向的Z方向(Z)上从第一组引线(22)移位。 第一和第二组引线(22,24)的引线各自在其远端具有相应的接触端子(26和28)。 接触端子(26和28)各自在接触平面(44)中具有接触面(40和42)。
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公开(公告)号:US20080042246A1
公开(公告)日:2008-02-21
申请号:US11856239
申请日:2007-09-17
申请人: Vasile Thompson , Zhi-Gang Bai
发明人: Vasile Thompson , Zhi-Gang Bai
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/49524 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/371 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37164 , H01L2224/37599 , H01L2224/40245 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad.
摘要翻译: 提供了一种包括引线框,模具和夹子的半导体器件。 引线框架有一个标志和一个电源垫。 模具与标志相连。 夹子包括模具保持部分和垫部分。 模具联接到模具保持部分,并且垫部分从模具保持部分延伸。 焊盘部分耦合到电源焊盘。
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公开(公告)号:US20060267161A1
公开(公告)日:2006-11-30
申请号:US11142077
申请日:2005-05-31
申请人: Vasile Thompson , Zhi-Gang Bai
发明人: Vasile Thompson , Zhi-Gang Bai
IPC分类号: H01L23/495
CPC分类号: H01L23/49575 , H01L23/49524 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/371 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37164 , H01L2224/37599 , H01L2224/40245 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad. Methods for forming the semiconductor device are provided as well.
摘要翻译: 提供了一种包括引线框,模具和夹子的半导体器件。 引线框架有一个标志和一个电源垫。 模具与标志相连。 夹子包括模具保持部分和垫部分。 模具联接到模具保持部分,并且垫部分从模具保持部分延伸。 焊盘部分耦合到电源焊盘。 还提供了形成半导体器件的方法。
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公开(公告)号:US06917097B2
公开(公告)日:2005-07-12
申请号:US10644160
申请日:2003-08-20
申请人: Wai Wong Chow , Zhi-Gang Bai , Clem H. Brown
发明人: Wai Wong Chow , Zhi-Gang Bai , Clem H. Brown
IPC分类号: H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
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公开(公告)号:US20050121756A1
公开(公告)日:2005-06-09
申请号:US11043224
申请日:2005-01-26
申请人: Wai Chow , Zhi-Gang Bai , Clem Brown
发明人: Wai Chow , Zhi-Gang Bai , Clem Brown
IPC分类号: H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
摘要翻译: 用于半导体器件的引线框架(20)包括具有限定空腔(16)的周边的第一引线框架部分(12)和从周边向内延伸的多个引线(14)和第一厚度。 第二引线框架部分(18)附接到第一引线框架部分(16)。 第二引线框架部分(18)具有容纳在第一引线框架部分(12)的空腔(16)内的管芯焊盘(20)。 第二引线框架部分(18)具有大于第一引线框架部分(12)的厚度的第二厚度。 这种双量规引线框架尤其适用于其中管芯焊盘用作散热器的大功率器件。
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公开(公告)号:US20050012183A1
公开(公告)日:2005-01-20
申请号:US10644160
申请日:2003-08-20
申请人: Wai Chow , Zhi-Gang Bai , Clem Brown
发明人: Wai Chow , Zhi-Gang Bai , Clem Brown
IPC分类号: H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
摘要翻译: 用于半导体器件的引线框架(20)包括具有限定空腔(16)的周边的第一引线框架部分(12)和从周边向内延伸的多个引线(14)和第一厚度。 第二引线框架部分(18)附接到第一引线框架部分(16)。 第二引线框架部分(18)具有容纳在第一引线框架部分(12)的空腔(16)内的管芯焊盘(20)。 第二引线框架部分(18)具有大于第一引线框架部分(12)的厚度的第二厚度。 这种双量规引线框架尤其适用于其中管芯焊盘用作散热器的大功率器件。
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公开(公告)号:US07723163B2
公开(公告)日:2010-05-25
申请号:US12126943
申请日:2008-05-26
申请人: Xue-song Xu , Zhi-gang Bai , Nan Xu , Jin-zhong Yao
发明人: Xue-song Xu , Zhi-gang Bai , Nan Xu , Jin-zhong Yao
IPC分类号: H01L21/00
CPC分类号: H01L23/49861 , H01L21/568 , H01L23/3107 , H01L23/49548 , H01L23/49558 , H01L24/48 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.
摘要翻译: 形成具有增加的支架的预成型引线框的方法包括以下步骤:将第一带附着到引线框的第一侧,将第二带附接到引线框的第二侧。 带状引线框架放置在模具中,并开始第一模具化合物流。 模具化合物的第一流动填充第一带和模具的上模追逐之间的空间。 然后开始模具化合物的第二流程。 模具化合物的第二流动填充了管芯焊盘和引线框架的引线之间的空间。 然后将第一和第二带从引线框架移除。 提供了改进的支架,因为第一带被模具化合物的第一流动压下。
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公开(公告)号:US07683465B2
公开(公告)日:2010-03-23
申请号:US11856239
申请日:2007-09-17
IPC分类号: H01L23/48
CPC分类号: H01L23/49575 , H01L23/49524 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/371 , H01L2224/37144 , H01L2224/37147 , H01L2224/37155 , H01L2224/37164 , H01L2224/37599 , H01L2224/40245 , H01L2224/48095 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad.
摘要翻译: 提供了一种包括引线框,模具和夹子的半导体器件。 引线框架有一个标志和一个电源垫。 模具与标志相连。 夹子包括模具保持部分和垫部分。 模具联接到模具保持部分,并且垫部分从模具保持部分延伸。 焊盘部分耦合到电源焊盘。
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