-
公开(公告)号:US20050121756A1
公开(公告)日:2005-06-09
申请号:US11043224
申请日:2005-01-26
申请人: Wai Chow , Zhi-Gang Bai , Clem Brown
发明人: Wai Chow , Zhi-Gang Bai , Clem Brown
IPC分类号: H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
摘要翻译: 用于半导体器件的引线框架(20)包括具有限定空腔(16)的周边的第一引线框架部分(12)和从周边向内延伸的多个引线(14)和第一厚度。 第二引线框架部分(18)附接到第一引线框架部分(16)。 第二引线框架部分(18)具有容纳在第一引线框架部分(12)的空腔(16)内的管芯焊盘(20)。 第二引线框架部分(18)具有大于第一引线框架部分(12)的厚度的第二厚度。 这种双量规引线框架尤其适用于其中管芯焊盘用作散热器的大功率器件。
-
公开(公告)号:US20050012183A1
公开(公告)日:2005-01-20
申请号:US10644160
申请日:2003-08-20
申请人: Wai Chow , Zhi-Gang Bai , Clem Brown
发明人: Wai Chow , Zhi-Gang Bai , Clem Brown
IPC分类号: H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L23/3107 , H01L23/49537 , H01L23/49548 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/78 , H01L2224/05554 , H01L2224/2919 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45565 , H01L2224/45599 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/83101 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20755 , H01L2924/2076 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2224/4569 , H01L2924/01004 , H01L2924/00011 , H01L2924/0665 , H01L2924/00012 , H01L2924/00
摘要: A leadframe (20) for a semiconductor device includes a first leadframe portion (12) having a perimeter that defines a cavity (16) and a plurality of leads (14) extending inwardly from the perimeter and a first thickness. A second leadframe portion (18) is attached to the first leadframe portion (16). The second leadframe portion (18) has a die paddle (20) received within the cavity (16) of the first leadframe portion (12). The second leadframe portion (18) has a second thickness that is greater than a thickness of the first leadframe portion (12). Such a dual gauge leadframe is suitable especially for high power devices in which the die paddle acts as a heat sink.
摘要翻译: 用于半导体器件的引线框架(20)包括具有限定空腔(16)的周边的第一引线框架部分(12)和从周边向内延伸的多个引线(14)和第一厚度。 第二引线框架部分(18)附接到第一引线框架部分(16)。 第二引线框架部分(18)具有容纳在第一引线框架部分(12)的空腔(16)内的管芯焊盘(20)。 第二引线框架部分(18)具有大于第一引线框架部分(12)的厚度的第二厚度。 这种双量规引线框架尤其适用于其中管芯焊盘用作散热器的大功率器件。
-
公开(公告)号:US20050156291A1
公开(公告)日:2005-07-21
申请号:US11043547
申请日:2005-01-26
申请人: Hei Shiu , Wai Chow , Qing-Chun He
发明人: Hei Shiu , Wai Chow , Qing-Chun He
IPC分类号: H01L21/56 , H01L23/31 , H01L23/495
CPC分类号: H01L24/97 , H01L21/566 , H01L23/3107 , H01L23/4952 , H01L23/49537 , H01L23/49548 , H01L2224/05568 , H01L2224/05573 , H01L2224/16245 , H01L2224/81001 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2924/00 , H01L2224/05599
摘要: A semiconductor device (10) includes a first leadframe (18) having a perimeter (20) that defines a cavity (22) and leads (14) extending inwardly from the perimeter, and a second leadframe (32) having top and bottom surfaces and a die paddle surrounding a die receiving area (36). An integrated circuit (12) is placed within the die receiving area of the second leadframe. The IC has bonding pads (44) located on a peripheral portion of its top surface. The second leadframe and the IC are in facing relation with the first leadframe such that the leads of the first leadframe are electrically connected to respective ones of the bonding pads. A mold compound (50) is injected between the first and second leadframes and covers the second leadframe top surface and a central area of the first surface of the IC. At least the bottom surfaces of the leads are exposed.
摘要翻译: 半导体器件(10)包括具有限定空腔(22)和从周边向内延伸的引线(14)的周边(20)的第一引线框架(18)和具有顶表面和底表面的第二引线框架(32) 围绕模具接收区域(36)的模具板。 集成电路(12)被放置在第二引线框架的管芯接收区域内。 IC具有位于其顶表面的周边部分上的接合焊盘(44)。 第二引线框和IC与第一引线框面对关系,使得第一引线框的引线电连接到相应的焊盘。 模具化合物(50)被注入到第一和第二引线框架之间并覆盖IC的第一表面的第二引线框架顶表面和中心区域。 至少引线的底面露出。
-
公开(公告)号:US20050146001A1
公开(公告)日:2005-07-07
申请号:US10752159
申请日:2004-01-06
IPC分类号: H01L21/44 , H01L21/48 , H01L23/02 , H01L23/495 , H01L31/0203
CPC分类号: H01L31/0203 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
摘要翻译: 图像传感器装置包括传感器IC电连接到的第一QFN型引线框架。 提供了用于保持透镜的第二引线框架。 第三引线框架位于第一引线框架和第二引线框架之间,以便将IC与透镜适当地间隔开。 多个传感器设备通过使用引线框面板同时组装。
-
公开(公告)号:US20050156301A1
公开(公告)日:2005-07-21
申请号:US11082078
申请日:2005-03-16
IPC分类号: H01L21/44 , H01L21/48 , H01L23/02 , H01L23/495 , H01L31/0203
CPC分类号: H01L31/0203 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要: An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.
-
公开(公告)号:US20050124147A1
公开(公告)日:2005-06-09
申请号:US10731831
申请日:2003-12-09
CPC分类号: H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/488 , H01L24/05 , H01L24/06 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/056 , H01L2224/05644 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48247 , H01L2224/48465 , H01L2224/48644 , H01L2224/48844 , H01L2224/49171 , H01L2224/4943 , H01L2224/73265 , H01L2224/8314 , H01L2224/83194 , H01L2224/8385 , H01L2224/85207 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10162 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/157 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/13111 , H01L2924/00011
摘要: A method of packaging an integrated circuit die (12) includes the steps of forming an array of soft conductive balls (14) in a fixture (30) and flattening opposing sides of the balls. The flattened balls are then transferred from the fixture to a mold masking tape (36). A first side of the IC die is attached to the balls with a die attach adhesive (16) and then wire bonding pads (20) on the die are electrically connected directly to respective balls with wires (22). An encapsulant (24) is formed over the die, the electrical connections, and a top portion of the formed balls. The tape is removed and adjacent, encapsulated dice are separated via saw singulation. The result is an encapsulated IC having a bottom side with exposed balls.
摘要翻译: 封装集成电路管芯(12)的方法包括以下步骤:在夹具(30)中形成软导电球(14)的阵列,并使球的相对侧平坦化。 然后将扁平的球从固定装置转移到模塑胶带(36)。 IC芯片的第一侧通过芯片附接粘合剂(16)附着到球上,然后在芯片上的引线键合焊盘(20)通过导线(22)直接电连接到相应的球。 密封剂(24)形成在模具上,电连接和形成的球的顶部。 胶带被去除并相邻,胶囊通过锯切分离分离。 结果是具有底部具有裸露球的封装IC。
-
-
-
-
-