公开(公告)号：US20180146725A1

公开(公告)日：2018-05-31

申请号：US15619596

申请日：2017-06-12

Applicant: Jie Yu ,  Zhihui Wang ,  Meng Nie ,  Weibin Xu ,  Haitao Li

Inventor： Jie Yu ,  Zhihui Wang ,  Meng Nie ,  Weibin Xu ,  Haitao Li

IPC: A41D19/04 ,  B29C41/04 ,  B29C41/38 ,  B29C35/02

Abstract: The method comprises of placing the palm side of a glove mold facing up, and raising the fingers portion of glove mold up, in such a way that the glove mold is tilting up at 15°-45° in relative to horizontal position. The first pouring process is carried out by pouring silica gel liquid on the fingers portion of glove mold. Then adjust the glove mold to horizontal position, and rotate the glove mold by using its length as axis. Continue pouring silica gel liquid on the glove mold surface to carry out second pouring process. Let the silica gel liquid to be coated on the whole glove mold surface forming a semi-finished glove. Upon completion, let the glove mold to go through a dripping procedure for dripping treatment. After the dripping treatment, carry out vulcanization and cooling to obtain the corresponding silica gel glove.

公开(公告)号：US08772915B2

公开(公告)日：2014-07-08

申请号：US13174260

申请日：2011-06-30

Applicant: Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

Inventor： Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

IPC: H01L23/48

CPC classification number: H01L23/525 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

Abstract translation: 根据一个示例性实施例，具有管芯上优选接口选择的半导体管芯包括位于半导体管芯的有源表面上的至少两组焊盘，其中至少两组焊盘中的每一个焊盘与其相关联的接口耦合 死了 一组凸块可编程地路由到至少两组焊盘之一，从而选择用于半导体管芯的优选接口。 不优选的接口不被引导到半导体管芯的有源表面上的任何凸点，从而减少了管芯上的突出数。 所述至少两组焊盘中的每一个可以位于所述半导体管芯的有源表面上的相应焊盘环中。 所述至少两组垫可以基本上内嵌布置。

公开(公告)号：US20140146427A1

公开(公告)日：2014-05-29

申请号：US13885686

申请日：2011-10-31

Applicant: Biyao Huang ,  Jianqi Li ,  Guojun Liu ,  Zhihui Wang ,  Nan Quan ,  Xiaofeng Qu ,  Tao Zhao ,  Licheng Wang

Inventor： Biyao Huang ,  Jianqi Li ,  Guojun Liu ,  Zhihui Wang ,  Nan Quan ,  Xiaofeng Qu ,  Tao Zhao ,  Licheng Wang

IPC: H02H3/38

CPC classification number: H02H3/38 ,  H02H1/0061 ,  H02H7/28 ,  H02J3/38 ,  H02J13/0051 ,  H02J2003/388 ,  Y02B90/263 ,  Y02E40/72 ,  Y02E60/723 ,  Y02E60/725 ,  Y02E60/783 ,  Y02P80/14 ,  Y04S10/12 ,  Y04S10/16 ,  Y04S10/20 ,  Y04S40/123

Abstract: This present inversion relates to a detection system and detection method of distributed generation islanding based on power frequency carrier. The system includes a power frequency carrier signal generating device near the terminal power distribution substation, a power frequency carrier signal detection device in distributed power grid; the power frequency carrier signal generating device is connected to the substation bus through a signal coupling transformer; the power frequency carrier signal generating device is connected with signal coupling transformer though phase A, B C live wires and the N middle wire, that results in the signal can be send by anyone signal phase, any two phases parallel way or three phases parallel way. The power frequency carrier signal detection device is connected with the low voltage power network though phase A, B and C live wires and the N middle wire. The system of distributed generation islanding detection based on power frequency carrier has low cost of implementation advantage and the test methods to meet the requirements of relevant standards. The present invention provides an effective method for islanding signal detection of distributed generation and micro-grid signal, anti-islanding protection. There is very high technical and economic performance applying the distribution network under high permeability condition.

Abstract translation: 本反演涉及基于功率载波的分布式发电孤岛的检测系统和检测方法。 该系统包括终端配电站附近的功率载频信号发生装置，分布式电网中的工频载波信号检测装置， 电力载波信号发生装置通过信号耦合变压器连接到变电站总线; 电力载波信号发生装置通过A相，B C线和N线连接信号耦合变压器，使信号可以由任何信号相，任意两相并联或三相并联发送。 工频载波信号检测装置通过A，B，C线和N线连接低压电网。 基于电力载波的分布式孤岛检测系统具有较低的实施成本优势和符合相关标准要求的测试方法。 本发明提供了分散式发电和微电网信号孤岛信号检测的有效方法，防孤岛保护。 在高渗透条件下应用配送网络具有非常高的技术和经济性能。

公开(公告)号：US07982294B2

公开(公告)日：2011-07-19

申请号：US11724135

申请日：2007-03-14

Applicant: Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

Inventor： Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

IPC: H01L23/02

CPC classification number: H01L23/525 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

Abstract translation: 根据一个示例性实施例，具有管芯上优选接口选择的半导体管芯包括位于半导体管芯的有源表面上的至少两组焊盘，其中至少两组焊盘中的每一个焊盘与其相关联的接口耦合 死了 一组凸块可编程地路由到至少两组焊盘之一，从而选择用于半导体管芯的优选接口。 不优选的接口不被引导到半导体管芯的有源表面上的任何凸起，从而减少了管芯上的突出数。 所述至少两组焊盘中的每一个可以位于所述半导体管芯的有源表面上的相应焊盘环中。 所述至少两组垫可以基本上内嵌布置。

公开(公告)号：US20080224307A1

公开(公告)日：2008-09-18

申请号：US11724135

申请日：2007-03-14

Applicant: Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

Inventor： Tarek Kaylani ,  Zhihui Wang ,  Kenneth Kindsfater ,  Balasubramanian Annamalai ,  Jeff Echtenkamp

IPC: H01L23/48

CPC classification number: H01L23/525 ,  H01L2924/0002 ,  H01L2924/00

Abstract: According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline.

Abstract translation: 根据一个示例性实施例，具有管芯上优选接口选择的半导体管芯包括位于半导体管芯的有源表面上的至少两组焊盘，其中至少两组焊盘中的每一个焊盘与其相关联的接口耦合 死了 一组凸块可编程地路由到至少两组焊盘之一，从而选择用于半导体管芯的优选接口。 不优选的接口不被引导到半导体管芯的有源表面上的任何凸点，从而减少了管芯上的突出数。 所述至少两组焊盘中的每一个可以位于所述半导体管芯的有源表面上的相应焊盘环中。 所述至少两组垫可以基本上内嵌布置。

公开(公告)号：US20150144013A1

公开(公告)日：2015-05-28

申请号：US14550766

申请日：2014-11-21

Applicant: Gao Liu ,  Vince Battaglia ,  Zhihui Wang

Inventor： Gao Liu ,  Vince Battaglia ,  Zhihui Wang

IPC: H01M4/04

CPC classification number: H01M4/0435 ,  B29C43/24 ,  B30B3/04 ,  H01M4/139

Abstract: An embodiment of the invention describes an calendaring apparatus comprising a roller press comprising a first roller and a second roller, a static electricity generator, a motor drive system in communication with the first roller and the second roller to impart rotation to first roller and the second roller, wherein the static electricity generator imparts a static charge to a surface of the first roller, and a material holding tray for holding a material in communication with the first roller.

Abstract translation: 本发明的一个实施例描述了一种压延装置，包括一个辊压机，包括第一辊和第二辊，静电发生器，与第一辊和第二辊连通的电动机驱动系统，以使第一辊和第二辊转动 辊，其中静电发生器向第一辊的表面施加静电荷，以及用于保持与第一辊连通的材料的材料保持盘。

公开(公告)号：US08365403B2

公开(公告)日：2013-02-05

申请号：US13276645

申请日：2011-10-19

Applicant: Tao Zhang ,  Zhihui Wang

Inventor： Tao Zhang ,  Zhihui Wang

IPC: H01R43/00 ,  H05K13/00

CPC classification number: H05K3/4092 ,  H05K1/117 ,  H05K2201/0949 ,  H05K2201/09754 ,  H05K2201/09781 ,  H05K2201/1034 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169

Abstract: A method for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract translation: 公开了一种为图形卡提供替代电源的方法。 具体地说，本发明的一个实施例提出了一种方法，其包括以下步骤：根据工业标准总线接口将一组金手指放置在印刷电路板上，将导线定位在印刷电路板的中间层中， 将导线的第一端附接到特定的金指，以及将替代电源附接到电线的第二端，其中电线的第二端是在印刷电路板外部突出的电镀触点。

公开(公告)号：US08045330B2

公开(公告)日：2011-10-25

申请号：US11955317

申请日：2007-12-12

Applicant: Tao Zhang ,  Zhihui Wang

Inventor： Tao Zhang ,  Zhihui Wang

IPC: H05K1/14

CPC classification number: H05K3/4092 ,  H05K1/117 ,  H05K2201/0949 ,  H05K2201/09754 ,  H05K2201/09781 ,  H05K2201/1034 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169

Abstract: A method and apparatus for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract translation: 公开了一种为图形卡提供替代电源的方法和装置。 具体地说，本发明的一个实施例提出了一种方法，其包括以下步骤：根据工业标准总线接口将一组金手指放置在印刷电路板上，将导线定位在印刷电路板的中间层中， 将导线的第一端附接到特定的金指，以及将替代电源附接到电线的第二端，其中电线的第二端是在印刷电路板外部突出的电镀触点。

公开(公告)号：US07181310B2

公开(公告)日：2007-02-20

申请号：US10894603

申请日：2004-07-19

Applicant: Kuo Jung Huang ,  Chung-Shan Cheng ,  Zejun Dai ,  XiaoBing Gao ,  Jin Song Li ,  ZhiHui Wang ,  Wei Shao ,  Shengzhong Yi

Inventor： Kuo Jung Huang ,  Chung-Shan Cheng ,  Zejun Dai ,  XiaoBing Gao ,  Jin Song Li ,  ZhiHui Wang ,  Wei Shao ,  Shengzhong Yi

IPC: G06F19/00

CPC classification number: G05B19/4097 ,  G05B2219/32422 ,  G05B2219/35005 ,  G05B2219/36354 ,  G05B2219/36358 ,  G05B2219/45137 ,  Y02P90/205

Abstract: An apparatus (2) for automatically laying out punching tools on a turret is used in a computer-aided manufacturing system for sheet-metal punching. The system includes a server (1), a database (3), and client computers (7). The apparatus resides in the server, and is used for receiving drawings from the client computers to obtain information on workpieces, selecting punching tools in accordance with sizes and shapes of each type of drawing entity of the workpieces and in accordance with materials of the workpieces and machining allowances set by users, selecting a corresponding tool station on the turret for each of the selected punching tools in accordance with a type of the turret and specifications of the selected punching tool, mounting each punching tool on the corresponding tool station, selecting an optimum manufacturing path for each punching tool, and recording punching tool layout information. A related method is also provided.

Abstract translation: 在用于金属板冲压的计算机辅助制造系统中使用用于在转台上自动布置冲压工具的装置（2）。 该系统包括服务器（1），数据库（3）和客户计算机（7）。 该装置位于服务器中，用于从客户端计算机接收图形以获得关于工件的信息，根据工件的各种绘图实体的尺寸和形状选择冲压工具，并根据工件的材料和 用户设置的加工余量，根据转台的类型和所选冲压工具的规格，为每个所选冲压工具在转台上选择相应的工具站，将每个冲压工具安装在相应的工具台上，选择最佳 每个冲压工具的制造路径，以及记录冲孔工具布局信息。 还提供了相关的方法。

公开(公告)号：US20050027378A1

公开(公告)日：2005-02-03

申请号：US10902915

申请日：2004-07-30

Applicant: Kuo Huang ,  Chung Cheng ,  Zejun Dai ,  Xiaobing Gao ,  Jin Li ,  ZhiHui Wang ,  Wei Shao ,  Shengzhong Yi

Inventor： Kuo Huang ,  Chung Cheng ,  Zejun Dai ,  Xiaobing Gao ,  Jin Li ,  ZhiHui Wang ,  Wei Shao ,  Shengzhong Yi

IPC: G05B11/01 ,  G05B13/02 ,  G05B19/02 ,  G05B19/402 ,  G06F17/50 ,  G06F19/00

CPC classification number: G05B19/402 ,  G05B2219/36284 ,  G05B2219/45131 ,  G05B2219/50016

Abstract: An apparatus and method for turret optimizing is used in a computer-aided manufacturing system for sheet-metal punching. The system includes a server (1), a database (3), and a number of client computers (7). The apparatus (2) resides in the server, and includes a punching tool layout information obtaining module (10), a manufacturing path setting module (20), a reference punching tool selecting module (30), a fixed punching tool determining module (40), a co-radius optimizing module (50), and an included angle calculating module (60). The apparatus is used for obtaining punching tool layout information, optimizing sequences of punching tools' locations on a turret, and recording turret information.

Abstract translation: 一种用于钣金冲压的计算机辅助制造系统中使用转塔优化的装置和方法。 该系统包括服务器（1），数据库（3）和多个客户计算机（7）。 设备（2）位于服务器中，包括冲压工具布局信息获取模块（10），制造路径设置模块（20），参考冲压工具选择模块（30），固定冲压工具确定模块 ），共半径优化模块（50）和夹角计算模块（60）。 该装置用于获得冲压工具布局信息，优化冲压工具在转台上的位置的顺序以及记录转塔信息。