Method for producing metallic ruthenium thin film by atomic layer deposition

    公开(公告)号:US11408069B2

    公开(公告)日:2022-08-09

    申请号:US17291446

    申请日:2019-10-28

    申请人: ADEKA CORPORATION

    IPC分类号: C23C16/455 C23C16/18

    摘要: A method of the present invention for producing a metallic ruthenium thin film on a substrate by atomic layer deposition includes: (A) a step of introducing a feedstock gas containing a specific ruthenium compound into a treatment atmosphere, and allowing the ruthenium compound to deposit on the substrate; and a step of introducing a reactive gas containing a specific compound into the treatment atmosphere, and allowing the reactive gas to react with the specific ruthenium compound deposited on the substrate.