公开(公告)号：US20170367180A1

公开(公告)日：2017-12-21

申请号：US15184662

申请日：2016-06-16

申请人： ALCATEL-LUCENT CANADA INC.

发明人： James M. SCHRIEL ,  Alex L. CHAN ,  Paul J. BROWN

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K1/18

CPC分类号： H05K1/0296 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/181 ,  H05K3/0005 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/611

摘要： Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

公开(公告)号：US20170237349A1

公开(公告)日：2017-08-17

申请号：US15042889

申请日：2016-02-12

申请人： ALCATEL-LUCENT CANADA INC.

发明人： Rami LABIB ,  James M. SCHRIEL

IPC分类号： H02M3/158 ,  H02M1/084

CPC分类号： H02M3/158 ,  H02M3/1584 ,  H02M2001/0009 ,  H02M2003/1586

摘要： A multi phase power supply system includes a plurality of power controllers, each power controller configured to control a DC-DC power converter, a plurality of compensation loops configured to receive outputs from the DC-DC power converters and input feedback to the plurality of power controllers, wherein the plurality of power controllers are configured to operate the power converters phase shifted from one another to decrease a reaction time to load disturbances on a power rail.

公开(公告)号：US20180242447A1

公开(公告)日：2018-08-23

申请号：US15961098

申请日：2018-04-24

申请人： ALCATEL-LUCENT CANADA INC.

发明人： James M. SCHRIEL ,  Alex L. CHAN ,  Paul J. BROWN

IPC分类号： H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/00

CPC分类号： H05K1/0296 ,  H05K1/111 ,  H05K1/113 ,  H05K1/114 ,  H05K1/181 ,  H05K3/0005 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/611

摘要： Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a discrete array component including a pattern formed on the PCB which is a merger of a set of via pads and a discrete array component; wherein the pattern is generated by a pin mapping between the discrete array component and a via grid array on the PCB; and wherein the pattern is formed of a metal etched during a manufacturing process of the PCB.

公开(公告)号：US20170280569A1

公开(公告)日：2017-09-28

申请号：US15082682

申请日：2016-03-28

申请人： ALCATEL-LUCENT CANADA INC.

发明人： James M. SCHRIEL ,  Alex L. CHAN ,  Paul J. BROWN

IPC分类号： H05K3/34 ,  G06F17/50 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11

CPC分类号： H05K3/3436 ,  G06F17/5072 ,  G06F2217/38 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0005 ,  H05K3/225 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/0445 ,  H05K2203/176 ,  Y02P70/611 ,  Y02P70/613

摘要： Various exemplary embodiments relate to a printed circuit board (PCB) for electrically connecting a surface mount component including: a plurality of metal pads on the surface of one side of the PCB corresponding to connection points on the component, wherein at least a portion of the plurality of metal pads have stubs which extend outside the boundary of the surface mount component when the surface mount component is mounted to the PCB; and wherein the stubs have sufficient thermal conductivity to facilitate at least one of the set of dismounting and reattaching of the surface mount component.