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    Integrated Photonics Device Having Integrated Edge Outcouplers
    1.
    发明申请
    Integrated Photonics Device Having Integrated Edge Outcouplers 有权

    公开(公告)号：US20220236503A1

    公开(公告)日：2022-07-28

    申请号：US17575326

    申请日：2022-01-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Jason S. Pelc ,  Mario J. Costello

    IPC: G02B6/42 ,  G01N21/47 ,  G01N21/49

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Laser Integration Techniques
    2.
    发明申请
    Laser Integration Techniques 有权

    公开(公告)号：US20220131340A1

    公开(公告)日：2022-04-28

    申请号：US17519355

    申请日：2021-11-04

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

    IPC: H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345

    Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

    Systems and methods for forming thin bulk junction thermoelectric devices in package
    3.
    发明授权
    Systems and methods for forming thin bulk junction thermoelectric devices in package 有权

    公开(公告)号：US10964873B1

    公开(公告)日：2021-03-30

    申请号：US15873767

    申请日：2018-01-17

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Gregory L. Tice ,  Mario J. Costello ,  Reid A. Black ,  Vijay M. Iyer

    IPC: H01L35/32 ,  H01L35/16 ,  G05D23/19 ,  H01L35/34 ,  H01L35/18

    Abstract: This disclosure relates to an integrated thermoelectric cooler and methods for forming thereof. The integrated thermoelectric cooler can include a plurality of thermoelectric rods located between the detector substrate and a system interposer. The detector substrate and the system interposer can directly contact ends of the thermoelectric rods. The integrated thermoelectric cooler can be formed by forming the plurality of thermoelectric rods on reels, for example, and the plurality of thermoelectric rods can be thinned down to a certain height. The thermoelectric rods can be transferred and bonded to the system substrate. An overmold can be formed around the plurality of thermoelectric rods. The height of the overmold and thermoelectric rods can be thinned down to another height. The thermoelectric rods can be bonded to the detector substrate. In some examples, the overmold can be removed.

    Fuel Cell System Coupled to a Portable Computing Device
    4.
    发明申请
    Fuel Cell System Coupled to a Portable Computing Device 审中-公开
    燃料电池系统耦合到便携式计算设备

    公开(公告)号：US20170047599A1

    公开(公告)日：2017-02-16

    申请号：US15212968

    申请日：2016-07-18

    Applicant: Apple Inc.

    Inventor： Vijay M. Iyer ,  Bradley L. Spare

    IPC: H01M8/04828 ,  H01M10/44 ,  H01M8/04082 ,  G05F1/66 ,  H01M8/0438 ,  H01M8/04537 ,  H01M8/04746 ,  H01M10/46 ,  H01M8/0432

    CPC classification number: H01M8/0491 ,  G05F1/66 ,  H01M8/04201 ,  H01M8/04208 ,  H01M8/04298 ,  H01M8/0432 ,  H01M8/0438 ,  H01M8/04552 ,  H01M8/04656 ,  H01M8/04753 ,  H01M8/04768 ,  H01M8/04917 ,  H01M8/0494 ,  H01M10/44 ,  H01M10/46 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/50

    Abstract: The disclosed embodiments relate to the design of a fuel cell system which is capable of both providing power to and receiving power from a rechargeable battery in a portable computing device. This eliminates the need for a bulky and heavy battery within the fuel cell system, which can significantly reduce the size, weight and cost of the fuel cell system. This fuel cell system includes a fuel cell stack which converts fuel into electrical power. It also includes a controller which controls operation of the fuel cell system. The fuel cell system additionally includes a power link that transfers electrical power between the fuel cell system and the portable computing device, and a communication link that provides communication between the portable computing device and the controller for the fuel cell system. The controller can regulate both the electrical power provided by the fuel cell system to the portable computing device and the electrical power provided by the rechargeable battery to the fuel cell system.

    Abstract translation: 所公开的实施例涉及能够在便携式计算设备中为可再充电电池供电和从其接收功率的燃料电池系统的设计。 这消除了在燃料电池系统内需要庞大且重的电池，这可以显着降低燃料电池系统的尺寸，重量和成本。 该燃料电池系统包括将燃料转换成电力的燃料电池组。 它还包括控制燃料电池系统的操作的控制器。 燃料电池系统还包括在燃料电池系统和便携式计算设备之间传送电力的电源连接器，以及提供便携式计算设备和用于燃料电池系统的控制器之间的通信的通信链路。 控制器可以将由燃料电池系统提供的电能与便携式计算设备以及由可再充电电池提供给燃料电池系统的电力进行调节。

    Laser integration techniques
    6.
    发明授权
    Laser integration techniques 有权

    公开(公告)号：US11171464B1

    公开(公告)日：2021-11-09

    申请号：US16714575

    申请日：2019-12-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Jason Pelc ,  Vijay M. Iyer ,  Alex Goldis

    IPC: H01S5/02355 ,  G02B6/13 ,  H01S5/0234 ,  H01S5/02234 ,  H01S5/02251 ,  H01S5/02345 ,  G02B6/12 ,  H01S5/024

    Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

    Integrated Photonics Device Having Integrated Edge Outcouplers
    7.
    发明申请
    Integrated Photonics Device Having Integrated Edge Outcouplers 有权

    公开(公告)号：US20210033805A1

    公开(公告)日：2021-02-04

    申请号：US16969034

    申请日：2019-02-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Jason S. Pelc ,  Mario J. Costello

    IPC: G02B6/42 ,  G01N21/49 ,  G01N21/47

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Integrated photonics device having integrated edge outcouplers
    9.
    发明授权
    Integrated photonics device having integrated edge outcouplers 有权

    公开(公告)号：US11960131B2

    公开(公告)日：2024-04-16

    申请号：US17575326

    申请日：2022-01-13

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Jason S. Pelc ,  Mario J. Costello

    IPC: G02B6/42 ,  G01N21/47 ,  G01N21/49

    CPC classification number: G02B6/4268 ,  G01N21/4785 ,  G01N21/49 ,  G02B6/4214 ,  G02B6/4251

    Abstract: Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

    Discrete Optical Unit on a Substrate of an Integrated Photonics Chip
    10.
    发明公开
    Discrete Optical Unit on a Substrate of an Integrated Photonics Chip 审中-公开

    公开(公告)号：US20230251420A1

    公开(公告)日：2023-08-10

    申请号：US18134865

    申请日：2023-04-14

    Applicant: Apple Inc.

    Inventor： Michael J. Bishop ,  Vijay M. Iyer ,  Lexie Nicole Schachne ,  Jason Pelc

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/42

    CPC classification number: G02B6/12004 ,  G02B6/122 ,  G02B6/4244 ,  G02B2006/12104 ,  G02B2006/12138

    Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

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