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公开(公告)号：US10061363B2
公开(公告)日：2018-08-28
申请号：US14846526
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US09612632B2
公开(公告)日：2017-04-04
申请号：US13874260
申请日：2013-04-30
Applicant: Apple Inc.
Inventor： Vikas K. Sinha , Phillip S. Satterfield , Vinh H. Diep , Daniele De Iuliis
Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.
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公开(公告)号：US20170071074A1
公开(公告)日：2017-03-09
申请号：US14846526
申请日：2015-09-04
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
CPC classification number: G06F1/20 , G06F1/1656 , H05K1/0206 , H05K1/0209 , H05K7/20436 , H05K9/0049 , H05K2201/066 , H05K2201/0715 , H05K2201/10416
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
Abstract translation: 电子设备具有具有发热部件（例如POP或SOC），散热器和EMI屏蔽结构的PCB。 组合结构可以包括位于POP / SOC顶部上方并与POP / SOC顶部热接触的顶部散热器/ EMI屏蔽件，位于POP / SOC底部下方并与POP / SOC底部热接触的底部散热器/ EMI屏蔽件，以及导热 部件位于PCB上，横向覆盖大部分POP / SOC侧面，并且与顶部和底部散热器热接触。 POP / SOC的所得热路径包括一个通过其顶部到顶部的散热器，另一个通过其底部到底部散热器，而另一个通过其侧面通过导热部件到达顶部和底部散热器 。 导热部件可以是一体地形成在PCB上的金属马蹄形垫。
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公开(公告)号：US20140321046A1
公开(公告)日：2014-10-30
申请号：US13874260
申请日：2013-04-30
Applicant: APPLE INC.
Inventor： Vikas K. Sinha , Phillip S. Satterfield , Vinh H. Diep , Daniele De Iuliis
Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.
Abstract translation: 电子设备可以具有对角地安装在壳体内的硬盘驱动器。 电磁干扰屏蔽结构可能包围硬盘驱动器。 屏蔽结构可以包括导电弹性体结构。 印刷电路板可以与硬盘驱动器对角地平行安装。 印刷电路板上的连接器可以以非零角度与印刷电路板成角度，并且可以用滑动件和锁定连接器保持构件保持抵靠壳体。 加速度计可以检测设备何时翻转，以便控制电路可以保护硬盘驱动器。 风扇可能导致空气在设备的一侧向上流动，并在设备的另一侧向下流动。 外壳可以放置在具有倾斜通风孔和整体弹性脚的外壳支撑结构上。
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公开(公告)号：US10034411B2
公开(公告)日：2018-07-24
申请号：US15199460
申请日：2016-06-30
Applicant: Apple Inc.
Inventor： Eric R. Prather , Clark E. Waterfall , Reuben J. Williams , Vinh H. Diep
IPC: H05K7/20 , F28D15/02 , H01L23/427 , F28F1/12 , H01L23/467
Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
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Patent Agency Ranking
公开(公告)号：US10963024B2
公开(公告)日：2021-03-30
申请号：US16042804
申请日：2018-07-23
Applicant: Apple Inc.
Inventor： Jonathan A. Matheson , Vinh H. Diep , Brian L. Chuang , Judith C. Segura , Frank F. Liang , Leanne Bach Lien T. Ly , Kevin Z. Lo , Po W. Chiu , Lukose Ninan , Chong Li
Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.
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公开(公告)号：US10653034B2
公开(公告)日：2020-05-12
申请号：US16040083
申请日：2018-07-19
Applicant: Apple Inc.
Inventor： Eric R. Prather , Clark E. Waterfall , Reuben J. Williams , Vinh H. Diep
IPC: H05K7/20 , H01L23/427 , F28D15/02 , F28F1/12 , H01L23/467
Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
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8.发明申请Electronic Device With Component Shielding Structures and Input-Output Connectors 有权具有组件屏蔽结构和输入输出连接器的电子设备公开(公告)号：US20140321045A1
公开(公告)日：2014-10-30
申请号：US13874164
申请日：2013-04-30
Applicant: APPLE INC.
Inventor： Vikas K. Sinha , Phillip S. Satterfield , Vinh H. Diep , Daniele De Iuliis
CPC classification number: H05K9/0015 , G06F1/1656 , G06F1/182 , G06F1/187 , G11B33/08 , G11B33/124 , G11B33/1493 , H05K9/0007 , H05K9/003 , H05K9/0043
Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.
Abstract translation: 电子设备可以具有对角地安装在壳体内的硬盘驱动器。 电磁干扰屏蔽结构可能包围硬盘驱动器。 屏蔽结构可以包括导电弹性体结构。 印刷电路板可以与硬盘驱动器对角地平行安装。 印刷电路板上的连接器可以以非零角度与印刷电路板成角度，并且可以用滑动件和锁定连接器保持构件保持抵靠壳体。 加速度计可以检测设备何时翻转，以便控制电路可以保护硬盘驱动器。 风扇可能导致空气在设备的一侧向上流动，并在设备的另一侧向下流动。 外壳可以放置在具有倾斜通风孔和整体弹性脚的外壳支撑结构上。
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公开(公告)号：US11297732B2
公开(公告)日：2022-04-05
申请号：US16867405
申请日：2020-05-05
Applicant: Apple Inc.
Inventor： Eric R. Prather , Clark E. Waterfall , Reuben J. Williams , Vinh H. Diep
IPC: H05K7/20 , F28D15/02 , H01L23/427 , H01L23/467 , F28F1/12
Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
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公开(公告)号：US20210059071A1
公开(公告)日：2021-02-25
申请号：US16867405
申请日：2020-05-05
Applicant: Apple Inc.
Inventor： Eric R. Prather , Clark E. Waterfall , Reuben J. Williams , Vinh H. Diep
IPC: H05K7/20 , F28D15/02 , H01L23/427
Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
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