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公开(公告)号：US20210107116A1
公开(公告)日：2021-04-15
申请号：US17114633
申请日：2020-12-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh Jagdish KHANNA , Jason G. FUNG , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Gregory E. MENK , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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2.发明申请公开(公告)号：US20170203408A1
公开(公告)日：2017-07-20
申请号：US15287665
申请日：2016-10-06
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
CPC classification number: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US20230294239A1
公开(公告)日：2023-09-21
申请号：US18202013
申请日：2023-05-25
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Ankit VORA , Boyi FU , Venkat HARIHARAN , Mayu YAMAMURA , Mario CORNEJO , Igor ABRAMSON , Mo YANG , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10
CPC classification number: B24B37/24 , C08F283/008 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L2031/736
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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公开(公告)号：US20230052048A1
公开(公告)日：2023-02-16
申请号：US17946547
申请日：2022-09-16
Applicant: Applied Materials, Inc.
Inventor： Ashavani KUMAR , Ashwin CHOCKALINGAM , Sivapackia GANAPATHIAPPAN , Rajeev BAJAJ , Boyi FU , Daniel REDFIELD , Nag B. PATIBANDLA , Mario Dagio CORNEJO , Amritanshu SINHA , Yan ZHAO , Ranga Rao ARNEPALLI , Fred C. REDEKER
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US20190181019A1
公开(公告)日：2019-06-13
申请号：US16276866
申请日：2019-02-15
Applicant: Applied Materials, Inc.
Inventor： Han-Wen CHEN , Steven VERHAVERBEKE , Roman GOUK , Guan Huei SEE , Yu GU , Arvind SUNDARRAJAN , Kyuil CHO , Colin Costano NEIKIRK , Boyi FU
IPC: H01L21/56 , H01L23/31 , H01L23/538 , H01L23/13 , H01L23/00 , H01L21/48 , H01L21/311 , H01L21/027 , H01L21/02 , G03F7/00
Abstract: Embodiments of the present disclosure generally describe methods for minimizing the occurrence and the extent of die shift during the formation of a reconstituted substrate in fan-out wafer level packaging processes and reconstituted substrates formed therefrom. Die shift is a process defect that occurs when a die (device) moves from its intended position within a reconstituted substrate during the formation thereof. Generally, the reconstituted substrates disclosed herein include a device immobilization layer and/or a plurality of device immobilization beads over and/or adjacent to a plurality of singular devices (individual dies), and a cured epoxy molding compound formed there over. The device immobilization layer and/or the plurality of device immobilization beads immobilize the plurality of singular devices and prevents them from shifting on the carrier substrate during the molding process.
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Patent Agency Ranking
公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20210347005A1
公开(公告)日：2021-11-11
申请号：US17382194
申请日：2021-07-21
Applicant: Applied Materials, Inc.
Inventor： Boyi FU , Sivapackia GANAPATHIAPPAN , Daniel REDFIELD , Rajeev BAJAJ , Ashwin CHOCKALINGAM , Dominic J. BENVEGNU , Mario Dagio CORNEJO , Mayu YAMAMURA , Nag B. PATIBANDLA , Ankit VORA
Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.
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公开(公告)号：US20200055161A1
公开(公告)日：2020-02-20
申请号：US16661400
申请日：2019-10-23
Applicant: Applied Materials, Inc.
Inventor： Ashwin CHOCKALINGHAM , Mahendra C. ORILALL , Mayu YAMAMURA , Boyi FU , Rajeev BAJAJ , Daniel REDFIELD
IPC: B24B37/20 , B24B37/26 , B24B37/24 , H01L21/306
Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
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公开(公告)号：US20190047112A1
公开(公告)日：2019-02-14
申请号：US16050442
申请日：2018-07-31
Applicant: Applied Materials, Inc.
Inventor： Boyi FU , Sivapackia GANAPATHIAPPAN , Daniel REDFIELD , Rajeev BAJAJ , Ashwin CHOCKALINGAM , Dominic J. BENVEGNU , Mario Dagio CORNEJO , Mayu YAMAMURA , Nag B. PATIBANDLA , Ankit VORA
IPC: B24B37/20
Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
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10.发明申请公开(公告)号：US20170120416A1
公开(公告)日：2017-05-04
申请号：US15298766
申请日：2016-10-20
Applicant: Applied Materials, Inc.
Inventor： Ashwin CHOCKALINGAM , Mahendra C. ORILALL , Mayu YAMAMURA , Boyi FU , Rajeev BAJAJ , Daniel REDFIELD
IPC: B24B37/20 , H01L21/306
CPC classification number: B24B37/20 , H01L21/30625
Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
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