HELICAL PLUG FOR REDUCTION OR PREVENTION OF ARCING IN A SUBSTRATE SUPPORT

    公开(公告)号:US20210242063A1

    公开(公告)日:2021-08-05

    申请号:US16777877

    申请日:2020-01-30

    Abstract: Embodiments of a plug for use in an electrostatic chuck are provided herein. In some embodiments, a plug for use in an electrostatic chuck includes a polymer sleeve having a central opening; and a core disposed in the central opening of the polymer sleeve, the core having a central protrusion and a peripheral ledge, wherein an outer surface of the core includes a helical channel extending from a lower surface of the core towards the peripheral ledge to at least partially define a gas flow path through the plug, and wherein the peripheral ledge is disposed between an upper surface of the polymer sleeve and the lower surface of the core.

    METHODS AND APPARATUS FOR PLASMA LINERS WITH HIGH FLUID CONDUCTANCE

    公开(公告)号:US20200066493A1

    公开(公告)日:2020-02-27

    申请号:US16448536

    申请日:2019-06-21

    Abstract: Methods and apparatus for confining plasma in a process chamber. In some embodiments, the apparatus includes a first liner with a first set of openings, the first liner configured to surround a substrate support when installed and a second liner with a second set of openings, the second liner configured to surround the substrate support under the first liner when installed, wherein the first set of openings and the second set of openings are configured to be offset from each other when installed in the process chamber to prevent a line-of-sight through the first liner and the second liner from a top down viewpoint, and wherein the first liner and the second liner are configured to be spaced apart vertically when installed in the process chamber to allow high fluid conductance through the first set of openings and the second set of openings.

    TEMPERATURE CONTROLLED SECONDARY ELECTRODE FOR ION CONTROL AT SUBSTRATE EDGE

    公开(公告)号:US20210134554A1

    公开(公告)日:2021-05-06

    申请号:US16674982

    申请日:2019-11-05

    Abstract: Embodiments of process kits for use in substrate processing chambers are provided herein. In some embodiments, a process kit for use in a substrate processing chamber includes an annular electrode configured to surround an electrostatic chuck, wherein the annular electrode includes an upper portion bonded to a lower portion and an annular channel disposed at an interface between the upper portion and the lower portion; wherein the annular electrode includes a first channel extending from a lower surface of the lower portion to the annular channel and a second channel extending from the lower surface of the lower portion to the annular channel; wherein the annular electrode is configured to flow a coolant from the first channel to the second channel via the annular channel to cool the annular electrode; and wherein the annular electrode includes at least one of a dielectric coating or a ceramic cap to reduce or prevent arcing between the annular electrode and the electrostatic chuck.

    SHOWERHEAD HAVING A DETACHABLE HIGH RESISTIVITY GAS DISTRIBUTION PLATE
    7.
    发明申请
    SHOWERHEAD HAVING A DETACHABLE HIGH RESISTIVITY GAS DISTRIBUTION PLATE 有权
    具有可拆卸高电阻气体分布板的淋浴器

    公开(公告)号:US20160005571A1

    公开(公告)日:2016-01-07

    申请号:US14729736

    申请日:2015-06-03

    CPC classification number: H01J37/3244 H01J37/32807 H01J37/3288

    Abstract: Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a semiconductor processing chamber may include a base having a first side and a second side opposing the first side; a gas distribution plate disposed proximate the second side of the base, wherein the gas distribution plate is formed from a material having an electrical resistivity between about 60 ohm-cm to 90 ohm-cm; a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the base; and a thermal gasket disposed in a gap between the base and gas distribution plate.

    Abstract translation: 具有可拆卸气体分配板的喷头的实施例在此提供。 在一些实施例中,用于半导体处理室的喷头可以包括具有与第一侧相对的第一侧和第二侧的基部; 设置在所述基座的第二侧附近的气体分配板,其中所述气体分配板由具有约60ohm-cm至90ohm-cm之间的电阻率的材料形成; 围绕所述气体分配板的周缘设置的夹具,以将所述气体分配板可移除地联接到所述基座; 以及设置在基座和气体分配板之间的间隙中的热垫圈。

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