公开(公告)号：US20140273354A1

公开(公告)日：2014-09-18

申请号：US13841418

申请日：2013-03-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Sesh RAMASWAMI ,  Chin Hock TOH ,  Niranjan KUMAR

IPC: H01L21/52 ,  H01L21/302

CPC classification number: H01L21/52 ,  H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5384 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/81

Abstract: A method of fabricating a 3D chip stack uses an interposer and an electronic circuit substrate comprising a plurality of electronic circuits. The electrical contacts of the electronic circuit substrate are bonded and electrically coupled to bumps of the interposer. A molding compound is applied over the electronic circuits to form a molded structure. The molded structure is thinned to have a second molded thickness that is less than the first molded thickness, and the interposer is thinned to a second interposer thickness that is less than a first interposer thickness.

Abstract translation: 制造3D芯片堆叠的方法使用包括多个电子电路的插入件和电子电路基板。 电子电路基板的电触点被接合并电耦合到插入器的凸块。 在电子电路上施加模塑料以形成模制结构。 将模制结构变薄以具有小于第一模制厚度的第二模制厚度，并且将插入件变薄到小于第一插入件厚度的第二插入件厚度。

公开(公告)号：US20180374736A1

公开(公告)日：2018-12-27

申请号：US16008569

申请日：2018-06-14

Applicant: Applied Materials, Inc.

Inventor： Niranjan KUMAR ,  Kim Ramkumar VELLORE ,  Douglas H. BURNS ,  Gautam PISHARODY ,  Seshadri RAMASWAMI ,  Douglas A. BUCHBERGER, JR.

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67

Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.

公开(公告)号：US20190237352A1

公开(公告)日：2019-08-01

申请号：US15885120

申请日：2018-01-31

Applicant: APPLIED MATERIALS, INC.

Inventor： Niranjan KUMAR ,  Seshadri RAMASWAMI ,  Shay ASSAF ,  Amikam SADE ,  Andy CONSTANT ,  Maureen BREILING

IPC: H01L21/683 ,  H01L21/67

Abstract: Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.

公开(公告)号：US20180281151A1

公开(公告)日：2018-10-04

申请号：US15474736

申请日：2017-03-30

Applicant: Applied Materials, Inc.

Inventor： Seshadri RAMASWAMI ,  Rajeev BAJAJ ,  Niranjan KUMAR ,  Sriskantharajah THIRUNAVUKARASU ,  Arvind SUNDARRAJAN

IPC: B24B37/32 ,  B24B37/20 ,  B24B41/06

Abstract: Embodiments of the disclosure relate to a system, apparatus and method for polishing thin substrates with high planarity. The apparatus comprises a chemical mechanical polishing head and a plate. The polishing head comprises a bottom surface, a retaining ring, a workpiece-receiving pocket defined between the bottom surface and the retaining ring, and at least one vacuum port adapted to provide a vacuum to the workpiece-receiving pocket through the bottom surface of the polishing head. The plate is disposed in the workpiece-receiving pocket such that the upper side of the plate faces the bottom surface of the polishing head and the lower side of the plate faces away from the bottom surface of the polishing head. The plate has a geometry or a material property configured to allow fluid to pass between the upper side and the lower side of the plate upon application of vacuum in the workpiece-receiving pocket.