公开(公告)号：US10001713B2

公开(公告)日：2018-06-19

申请号：US14762452

申请日：2014-02-05

申请人： ASML Holding N.V. ,  ASML Netherlands B.V.

发明人： Santiago E. Del Puerto ,  Matthew Lipson ,  Kenneth C. Henderson ,  Raymond Wilhelmus Louis LaFarre ,  Louis John Markoya ,  Tammo Uitterdijk ,  Johannes Petrus Martinus Bernardus Vermeulen ,  Antonius Franciscus Johannes De Groot ,  Ronald Van Der Wilk

IPC分类号： G03B27/52 ,  G03F7/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC分类号： G03F7/70875 ,  G03F7/70708 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6875

摘要： A support such as a clamp (310) is configured to releasably hold a patterning device such as a reticle (300) to secure it and prevent heat-induced deformation of it. For example, an electrostatic clamp includes a first substrate (312) having opposing first (313) and second (315) surfaces, a plurality of burls (316) located on the first surface and configured to contact the reticle, a second substrate (314) having opposing first (317) and second (319) surfaces. The first surface of the second substrate is coupled to the second surface of the first substrate. A plurality of cooling elements (318) are located between the first surface of the second substrate and the second surface of the first substrate. The cooling elements are configured to cause electrons to travel from the second surface of the first substrate to the first surface of the second substrate. Each cooling element is substantially aligned with a respective burl.

公开(公告)号：US09798251B2

公开(公告)日：2017-10-24

申请号：US14772721

申请日：2014-02-26

申请人： ASML Netherlands B.V.

发明人： Raymond Wilhelmus Louis LaFarre ,  Satish Achanta ,  Matteo Filippi ,  Yogesh Karade ,  Antonius Johannes Maria Nellissen ,  Ronald Van Der Wilk ,  Hendrikus Christoffel Maria Van Doremalen ,  Wilhelmus Jacobus Johannes Welters

IPC分类号： G03B27/58 ,  G03F7/20

CPC分类号： G03F7/70716 ,  G03F7/70708

摘要： A method of manufacturing an object holder for use in a lithographic apparatus, the object holder including one or more electrically functional components, the method including: using a composite structure including a carrier sheet different from a main body of the object holder and a layered structure including one or a plurality of layers and formed on the carrier sheet; connecting the composite structure to a surface of the main body such that the layered structure is between the carrier sheet and the surface of the main body; and removing the carrier sheet from the composite structure, leaving the layered structure connected to the main body.

公开(公告)号：US12055862B2

公开(公告)日：2024-08-06

申请号：US17952067

申请日：2022-09-23

申请人： ASML NETHERLANDS B.V.

发明人： Raymond Wilhelmus Louis LaFarre ,  Nicolaas Ten Kate ,  Nina Vladimirovna Dziomkina ,  Yogesh Pramod Karade

IPC分类号： G03F7/20 ,  C23C16/44 ,  G03F7/00 ,  H01L21/687

CPC分类号： G03F7/70716 ,  C23C16/44 ,  G03F7/70341 ,  G03F7/707 ,  G03F7/70975 ,  H01L21/6875 ,  Y10T29/49

摘要： A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of an electronic component such as a thin film electronic component. The planarization layer may be provided in multiple sub layers. The planarization layer may smooth over roughness caused by removal of material from a blank to form burls on the substrate holder.

公开(公告)号：US10192772B2

公开(公告)日：2019-01-29

申请号：US15766740

申请日：2016-09-08

申请人： ASML NETHERLANDS B.V.

发明人： Satish Achanta ,  Tiannan Guan ,  Raymond Wilhelmus Louis LaFarre ,  Ilya Malakhovsky ,  Bas Johannes Petrus Roset ,  Siegfried Alexander Tromp ,  Johannes Petrus Martinus Bernardus Vermeulen

IPC分类号： G03F7/20 ,  H01L21/687 ,  H01L21/683 ,  G03F7/00

摘要： A substrate table to support a substrate, the substrate table including a main body, burls extending from the main body and having first upper ends that define a support surface to support the substrate, and support pins having second upper ends. The support pins are movable between a retracted position and an extended position. The support pins are arranged to support the substrate in the extended position. The support pins are arranged to be switched to a first stiffness mode and a second stiffness mode. In the first stiffness mode, the support pins have a first stiffness in a direction parallel to the support surface. In the second stiffness mode, the support pins have a second stiffness in the direction parallel to the support surface. The first stiffness is different from the second stiffness.