Chuck, a chuck control system, a lithography apparatus and a method of using a chuck
    5.
    发明授权
    Chuck, a chuck control system, a lithography apparatus and a method of using a chuck 有权
    卡盘,卡盘控制系统,光刻设备和使用卡盘的方法

    公开(公告)号:US09494875B2

    公开(公告)日:2016-11-15

    申请号:US14349900

    申请日:2012-09-19

    Abstract: A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed. In an embodiment, there is provided a chuck (43) for use in holding a patterning device (MA) or a substrate (W) onto a supporting table (MT, WT) of a lithography apparatus (100) by electrostatic force, in which the patterning device is for imparting a radiation beam (B) with a pattern in its cross-section to form a patterned radiation beam, and the substrate is for receiving the patterned radiation beam; said chuck comprising: a dielectric member (45); a temperature conditioning fluid channel (48) formed within the chuck; a drive electrode (40, 42) for applying a potential difference between the drive electrode and the patterning device or substrate across the dielectric member in order to electrostatically attract the patterning device or substrate towards the drive electrode; and a first shield electrode (60) for reducing or preventing the development of an electric field across temperature conditioning fluid in the temperature conditioning fluid channel due to a voltage applied to the drive electrode, in order to reduce or prevent electrolysis in the fluid.

    Abstract translation: 公开了一种卡盘,卡盘控制系统,光刻设备和使用卡盘的方法。 在一个实施例中,提供了一种用于通过静电力将图案形成装置(MA)或基板(W)保持在光刻设备(100)的支撑台(MT,WT)上的卡盘,其中 图案形成装置用于在其横截面中赋予具有图案的辐射束(B)以形成图案化的辐射束,并且该衬底用于接收图案化的辐射束; 所述卡盘包括:电介质构件(45); 形成在卡盘内的温度调节流体通道(48) 用于在驱动电极和图案形成装置或基板之间跨越电介质构件施加电位差的驱动电极(40,42),以便静电地将图案形成装置或衬底吸引到驱动电极; 以及第一屏蔽电极(60),用于由于施加到驱动电极的电压而减少或防止温度调节流体通道中温度调节流体的电场的发展,以便减少或防止流体中的电解。

    Chuck, a Chuck Control System, a Lithography Apparatus and a Method of Using a Chuck
    7.
    发明申请
    Chuck, a Chuck Control System, a Lithography Apparatus and a Method of Using a Chuck 有权
    卡盘,卡盘控制系统,平版印刷设备和使用卡盘的方法

    公开(公告)号:US20140253900A1

    公开(公告)日:2014-09-11

    申请号:US14349900

    申请日:2012-09-19

    Abstract: A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed. In an embodiment, there is provided a chuck (43) for use in holding a patterning device (MA) or a substrate (W) onto a supporting table (MT, WT) of a lithography apparatus (100) by electrostatic force, in which the patterning device is for imparting a radiation beam (B) with a pattern in its cross-section to form a patterned radiation beam, and the substrate is for receiving the patterned radiation beam; said chuck comprising: a dielectric member (45); a temperature conditioning fluid channel (48) formed within the chuck; a drive electrode (40, 42) for applying a potential difference between the drive electrode and the patterning device or substrate across the dielectric member in order to electrostatically attract the patterning device or substrate towards the drive electrode; and a first shield electrode (60) for reducing or preventing the development of an electric field across temperature conditioning fluid in the temperature conditioning fluid channel due to a voltage applied to the drive electrode, in order to reduce or prevent electrolysis in the fluid.

    Abstract translation: 公开了一种卡盘,卡盘控制系统,光刻设备和使用卡盘的方法。 在一个实施例中,提供了一种用于通过静电力将图案形成装置(MA)或基板(W)保持在光刻设备(100)的支撑台(MT,WT)上的卡盘,其中 图案形成装置用于在其横截面中赋予具有图案的辐射束(B)以形成图案化的辐射束,并且该衬底用于接收图案化的辐射束; 所述卡盘包括:电介质构件(45); 形成在卡盘内的温度调节流体通道(48) 用于在驱动电极和图案形成装置或基板之间跨越电介质构件施加电位差的驱动电极(40,42),以便静电地将图案形成装置或衬底吸引到驱动电极; 以及第一屏蔽电极(60),用于由于施加到驱动电极的电压而减少或防止温度调节流体通道中温度调节流体的电场的发展,以便减少或防止流体中的电解。

    Method, apparatus, and system for wafer grounding

    公开(公告)号:US12051562B2

    公开(公告)日:2024-07-30

    申请号:US17753298

    申请日:2020-08-25

    CPC classification number: H01J37/20 H01L21/6833 H01J2237/0044

    Abstract: Systems and methods for wafer grounding and wafer grounding location adjustment are disclosed. A first method may include receiving a first value of an electric characteristic associated with the wafer being grounded by an electric signal; determining a first control parameter using at least the first value; and controlling a characteristic of the electric signal using the first control parameter and the first value. A second method for adjusting a grounding location for a wafer may include terminating an electric connection between the wafer and at least one grounding pin in contact the wafer; adjusting a relative position between the wafer and the grounding pin; and restoring the electric connection between the grounding pin and the wafer. A third method may include causing a grounding pin to penetrate through a coating on the wafer by impact; and establishing an electrical connection between the grounding pin and the wafer.

    High voltage vacuum feedthrough
    10.
    发明授权

    公开(公告)号:US10886093B2

    公开(公告)日:2021-01-05

    申请号:US16703729

    申请日:2019-12-04

    Abstract: A feedthrough for providing an electrical connection is provided. The feedthrough comprises a conductor and a quartz or a glass structure configured to surround at least a portion of the conductor and provide isolation to the conductor. The conductor and the quartz or glass structure may be coaxially arranged. The feedthrough can provide an electrical connection between an inside and outside of a vacuum chamber that contains a sample.

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