公开(公告)号：US20240012337A1

公开(公告)日：2024-01-11

申请号：US18229984

申请日：2023-08-03

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Mark John MASLOW ,  Koenraad VAN INGEN SCHENAU ,  Patrick WARNAAR ,  Abraham SLACHTER ,  Roy ANUNCIADO ,  Simon Hendrik Celine VAN GORP ,  Frank STAALS ,  Marinus JOCHEMSEN

IPC: G03F7/00 ,  G06T7/00 ,  H01L21/66 ,  G06F30/20

CPC classification number: G03F7/70625 ,  G06T7/0004 ,  H01L22/20 ,  G06F30/20 ,  H01L21/00

Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.

公开(公告)号：US20210149312A1

公开(公告)日：2021-05-20

申请号：US16644206

申请日：2018-08-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo TEL ,  Mark John MASLOW ,  Koenraad VAN INGEN SCHENAU ,  Patrick WARNAAR ,  Abraham SLACHTER ,  Roy ANUNCIADO ,  Simon Hendrik Celine VAN GORP ,  Frank STAALS ,  Marinus JOCHEMSEN

IPC: G03F7/20 ,  H01L21/66 ,  G06T7/00

Abstract: A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.

公开(公告)号：US20220146946A1

公开(公告)日：2022-05-12

申请号：US17437884

申请日：2020-02-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Frank STAALS ,  Simon Hendrik Celine VAN GORP

IPC: G03F7/20

Abstract: A method for configuring an apparatus for providing structures to a layer on a substrate, the method including: obtaining first data including substrate specific data as measured and/or modeled before the providing of the structures to the layer on the substrate; and determining a configuration of the apparatus for at least two different control regimes based on the first data and the use of a common merit function including parameters associated with the at least two control regimes.

公开(公告)号：US20210088917A1

公开(公告)日：2021-03-25

申请号：US16772022

申请日：2018-12-07

Applicant: ASML Netherlands B.V.

Inventor： Cyrus Emil TABERY ,  Simon Hendrik Celine VAN GORP ,  Simon Philip Spencer HASTINGS ,  Brennan PETERSON

IPC: G03F7/20 ,  H01L21/66 ,  H01L23/544

Abstract: A measurement mark is disclosed. According to certain embodiments, the measurement mark includes a set of first test structures developed in a first layer on a substrate, each of the set of first test structures comprising a plurality of first features made of first conducting material. The measurement mark also includes a set of second test structures developed in a second layer adjacent to the first layer, each of the set of second test structures comprising a plurality of second features made of second conducting material. The measurement mark is configured to indicate connectivity between the set of first test structures and associated second test structures in the set of second test structures when imaged using a voltage-contrast imaging method.

公开(公告)号：US20210325788A1

公开(公告)日：2021-10-21

申请号：US17363057

申请日：2021-06-30

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander YPMA ,  Cyrus Emil TABERY ,  Simon Hendrik Celine VAN GORP ,  Chenxi LIN ,  Dag SONNTAG ,  Hakki Ergün CEKLI ,  Ruben ALVAREZ SANCHEZ ,  Shih-Chin LIU ,  Simon Philip Spencer HASTINGS ,  Boris MENCHTCHIKOV ,  Christiaan Theodoor DE RUITER ,  Peter TEN BERGE ,  Michael James LERCEL ,  Wei DUAN ,  Pierre-Yves Jerome Yvan GUITTET

IPC: G03F7/20

Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.

公开(公告)号：US20190324371A1

公开(公告)日：2019-10-24

申请号：US16308835

申请日：2017-06-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Léon Maria Albertus VAN DER LOGT ,  Bart Peter Bert SEGERS ,  Simon Hendrik Celine VAN GORP ,  Carlo Cornelis Maria LUIJTEN ,  Frank STAALS

IPC: G03F7/20

Abstract: A lithographic process is one that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. During the lithographic process, the focus should be controlled. There is disclosed a method for determining a fingerprint of a performance parameter associated with a substrate, such as a focus value to be used during the lithographic process. A reference fingerprint of the performance parameter is determined for a reference substrate. A reference substrate parameter of the reference substrate is determined. A substrate parameter for a substrate, such as a substrate with product structures, is determined. Subsequently, the fingerprint of the performance parameter is determined based on the reference fingerprint, the reference substrate parameter and the substrate parameter. The fingerprint may then be used to control the lithographic process.

公开(公告)号：US20240061353A1

公开(公告)日：2024-02-22

申请号：US18270988

申请日：2021-12-24

Applicant: ASML NETHERLANDS B.V.

Inventor： Simon Hendrik Celine VAN GORP ,  Stephan VAN REENEN

IPC: G03F9/00 ,  G03F7/00

CPC classification number: G03F9/7026 ,  G03F7/70641 ,  G03F7/706845 ,  G03F9/7092

Abstract: A method for determining a focus actuation profile for one or more actuators of a lithographic exposure apparatus in control of a lithographic exposure process for exposure of an exposure area including at least two topographical levels. The method includes determining a continuous single focus actuation profile for the at least two topographical levels from an objective function including a per-level component operable to optimize a focus metric per topographical level for each of the at least two topographical levels.

公开(公告)号：US20220365450A1

公开(公告)日：2022-11-17

申请号：US17623931

申请日：2020-06-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Arie VAN DEN BRINK ,  Simon Hendrik Celine VAN GORP

IPC: G03F7/20 ,  G03F9/00

Abstract: Apparatus and methods for determining a focus error for a lithographic apparatus and/or a difference between first and second metrology data. The first and/or second metrology data includes a plurality of values of a parameter relating to a substrate, the substrate including a plurality of fields including device topology. The apparatus may include a processor configured to execute computer program code to cause the processor to: determine an intra-field component of the parameter; remove the determined intra-field component from the first metrology data to obtain an inter-field component of the first metrology data; and determine the difference between the first metrology data and second metrology data based on the inter-field component and the second metrology data.