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公开(公告)号：US06945690B2
公开(公告)日：2005-09-20
申请号：US10448023
申请日：2003-05-29
CPC分类号： B44D3/12 , B01F11/00 , B01F15/0074 , B01F2215/005 , Y10S366/605
摘要： A holder for mixing a container of paint is disclosed. The system comprising a body having a cover and a base. The system also comprises an aperture in the cover of the body. The system also comprises a cavity in the body and accessible through the aperture and configured to receive the container. The density of the body corresponds to the density of the container of paint. A system for holding and mixing a container of paint having a lid secured to a first body is also disclosed. A system for holding and mixing a first container of paint having a first volume and a second container of paint having a second volume less than the first volume is also disclosed.
摘要翻译： 公开了一种用于混合油漆容器的保持器。 该系统包括具有盖和底座的主体。 该系统还包括在主体的盖中的孔。 该系统还包括在主体中的空腔并且可通过孔径接近并构造成容纳容器。 身体的密度对应于油漆容器的密度。 还公开了一种用于保持和混合具有固定到第一主体的盖的油漆容器的系统。 还公开了一种用于保持和混合具有第一容积的第一容器和具有小于第一容积的第二容积的第二容器的第二容器的系统。
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公开(公告)号：US06945689B2
公开(公告)日：2005-09-20
申请号：US10419054
申请日：2003-04-18
CPC分类号： B01F11/0008 , B01F15/0074 , B01F2215/005 , Y10S366/605
摘要： A system for mixing paint and for holding a container of paint having a cover engaging a body is disclosed. The system comprises a rotary mixer comprising a holder configured for receiving the container. The system also comprises a clamp comprising an arm configured to pivot from a first position to a second position and a plate configured for positioning between a first linear position and a second linear position. The plate in the second linear position maintains the engagement of the cover of the container to the body by compression to inhibit leakage of the paint. A method of mixing paint with a rotary mixer is also disclosed.
摘要翻译： 公开了一种用于混合油漆和用于保持具有与主体接合的盖的油漆容器的系统。 该系统包括旋转混合器，其包括构造成容纳容器的保持器。 该系统还包括夹具，其包括构造成从第一位置枢转到第二位置的臂，以及被配置为定位在第一线性位置和第二线性位置之间的板。 第二直线位置的板通过压缩保持容器的盖与主体的接合，以防止油漆的泄漏。 还公开了一种用旋转混合器混合涂料的方法。
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3.发明授权公开(公告)号：US06507097B1
公开(公告)日：2003-01-14
申请号：US09997860
申请日：2001-11-29
IPC分类号： H01L2302
CPC分类号： H03H9/1092
摘要： A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more of such packages. In one embodiment, the package includes: (1) a device substrate having: (1a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device and (1b) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and (3) a nonmetallic hermetic sealing adhesive, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of the device, the active region proximate a void between the device substrate and the mounting substrate.
摘要翻译： 一种用于热电敏感电子设备的密封封装以及制造这些封装中的一个或多个的方法。 在一个实施例中，封装包括：（1）器件衬底，其具有：（1a）包含构成器件的至少一部分的导电图案的有源区和（1b）围绕有源区的结合区，（2） ）其上具有接合区域的无孔安装基板和（3）位于器件基板的接合区域和安装基板的接合区域之间的非金属气密密封粘合剂，其在基本上低于热电敏感的温度下固化 器件的温度，靠近器件衬底和安装衬底之间的空隙的有源区。
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4.发明授权Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof 有权用于多个接触敏感电子器件的密封封装及其制造方法公开(公告)号：US06649446B1
公开(公告)日：2003-11-18
申请号：US09998368
申请日：2001-11-29
IPC分类号： H01L2144
CPC分类号： H03H9/1085 , H01L21/563 , H01L23/3135 , H01L24/97 , H01L2224/16225 , H01L2224/73203 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01079 , H01L2924/01082 , H03H9/1078
摘要： A method of manufacturing a hermetic package. In one embodiment, the method includes: (1) forming a plurality of contact-sensitive electronic devices on a device substrate, each of the plurality of devices having an active surface, (2) providing a mounting substrate, (3) forming a grid of dam material between the device substrate and the mounting substrate that is pitched as a function of lateral dimensions of the plurality of devices, (4) bringing the device substrate and the mounting substrate together until the active surface of each of the plurality of devices is proximate, but spaced apart from, the mounting substrate, the mounting substrate and the dam material cooperating to form packages for the plurality of devices and (5) dicing the device substrate to separate the packages.
摘要翻译： 一种密封包装的制造方法。 在一个实施例中，该方法包括：（1）在器件衬底上形成多个接触敏感电子器件，所述多个器件中的每个器件具有有源表面，（2）提供安装衬底，（3）形成栅格 在所述器件基板和所述安装基板之间设置作为所述多个器件的横向尺寸的函数的坝材料，（4）将所述器件基板和所述安装基板一起放置在一起，直到所述多个器件中的每一个器件的有源表面为 与安装基板接近但间隔开，安装基板和坝材料配合以形成用于多个装置的包装件，以及（5）将装置基板切割以分离包装。
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公开(公告)号：US20100286811A1
公开(公告)日：2010-11-11
申请号：US12835009
申请日：2010-07-13
申请人： Christopher E. Jones , Niyaz Khusnatdinov , Stephen C. Johnson , Philip D. Schumaker , Pankaj B. Lad
发明人： Christopher E. Jones , Niyaz Khusnatdinov , Stephen C. Johnson , Philip D. Schumaker , Pankaj B. Lad
IPC分类号： G06F17/00
CPC分类号： G03F7/0002 , B29C43/003 , B29C43/021 , B29C43/58 , B29C2043/025 , B29C2043/5825 , B29C2043/5891 , B82Y10/00 , B82Y40/00
摘要： In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.
摘要翻译： 在纳米压印光刻中，重要的是检测在衬底上形成的残留层的厚度不均匀性。 补偿这种不均匀性，使得可以形成均匀的残留层。 通过计算校正的液滴图案来进行补偿。
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6.发明授权Hermetic package for surface acoustic wave device having exposed device substrate contacts and method of manufacturing the same 失效具有暴露的器件衬底触点的表面声波器件的密封封装及其制造方法公开(公告)号：US06639150B1
公开(公告)日：2003-10-28
申请号：US10003157
申请日：2002-04-23
IPC分类号： H05K506
CPC分类号： H03H9/1092 , H01L2224/73204 , H03H9/059
摘要： A hermetic package for an electronic device, such as a surface acoustic wave (SAW) device and a method of manufacturing the same. In one embodiment, the package includes: (1) a device substrate having: (a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device, (b) a contact region surrounding the active region and containing bond pads that are electrically coupled to the pattern and (c) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and a footprint smaller than a footprint of the device substrate and (3) a bonding agent, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that bonds the device substrate to the mounting substrate to enclose the active region proximate a void between the device substrate and the mounting substrate, the contact region remaining exposed.
摘要翻译： 一种用于诸如表面声波（SAW）器件的电子器件的密封封装及其制造方法。 在一个实施例中，封装包括：（1）器件衬底，其具有：（a）包含构成器件的至少一部分的导电图案的有源区，（b）围绕有源区并包含键的接触区 电耦合到图案的焊盘和（c）围绕有源区域的接合区域，（2）无孔安装衬底，其上具有接合区域，并且占地面积小于器件衬底的覆盖区域;（3） 所述接合剂位于所述器件基板的接合区域和所述安装基板的接合区域之间，将所述器件基板粘合到所述安装基板，以将所述有源区域包围在所述器件基板和所述安装基板之间的空隙附近，所述接触区域 剩余暴露
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7.发明授权公开(公告)号：US06621379B1
公开(公告)日：2003-09-16
申请号：US09997971
申请日：2001-11-29
IPC分类号： H03H964
CPC分类号： H03H9/1092 , H03H3/08 , H03H9/1057 , Y10T29/42
摘要： The present invention provides a surface acoustic wave (SAW) circuit package including: (1) a substantially planar piezoelectric substrate having an active surface, (2) an electronic circuit located over the active surface, (3) an encapsulant substrate having a bonding surface and (4) a bonding material interposing and creating a hermetic seal between the active surface and the bonding surface and around a void between the piezoelectric substrate and the encapsulant substrate. In one embodiment, the void has lateral dimensions at least equaling a footprint of the electronic circuit.
摘要翻译： 本发明提供一种表面声波（SAW）电路封装，包括：（1）具有活性表面的基本上平面的压电基片，（2）位于有源表面上方的电子电路，（3）密封衬底， 以及（4）粘合材料，其介于活性表面和接合表面之间并且围绕压电基板和密封剂基板之间的空隙形成气密密封。 在一个实施例中，空隙的横向尺寸至少等于电子电路的覆盖区。
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