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    Molded chip package with anchor structures
    6.
    发明授权
    Molded chip package with anchor structures 有权

    公开(公告)号：US11367628B2

    公开(公告)日：2022-06-21

    申请号：US16513450

    申请日：2019-07-16

    Applicant: ADVANCED MICRO DEVICES, INC.

    Inventor： Priyal Shah ,  Milind S. Bhagavat ,  Brett P. Wilkerson ,  Lei Fu ,  Rahul Agarwal

    IPC: H01L21/56 ,  H01L23/31

    Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.

    Semiconductor chip with reduced pitch conductive pillars
    8.
    发明授权
    Semiconductor chip with reduced pitch conductive pillars 有权

    公开(公告)号：US10943880B2

    公开(公告)日：2021-03-09

    申请号：US16414389

    申请日：2019-05-16

    Applicant: ADVANCED MICRO DEVICES, INC.

    Inventor： Priyal Shah ,  Milind S. Bhagavat ,  Lei Fu

    IPC: H01L23/00

    Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.

    FAN-OUT PACKAGE WITH REINFORCING RIVETS
    9.
    发明申请
    FAN-OUT PACKAGE WITH REINFORCING RIVETS 有权

    公开(公告)号：US20210057352A1

    公开(公告)日：2021-02-25

    申请号：US16544021

    申请日：2019-08-19

    Applicant: ADVANCED MICRO DEVICES, INC.

    Inventor： Rahul Agarwal ,  Milind S. Bhagavat ,  Priyal Shah ,  Chia-Hao Cheng ,  Brett P. Wilkerson ,  Lei Fu

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

    Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package is provided that includes a fan-out redistribution layer (RDL) structure that has plural stacked polymer layers, plural metallization layers, plural conductive vias interconnecting adjacent metallization layers of the metallization layers, and plural rivets configured to resist delamination of one or more of the polymer layers. Each of the plural rivets includes a first head, a second head and a shank connected between the first head and the second head. The first head is part of one of the metallization layers. The shank includes at least one of the conductive vias and at least one part of another of the metallization layers.

    MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
    10.
    发明申请
    MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES 有权

    公开(公告)号：US20210020459A1

    公开(公告)日：2021-01-21

    申请号：US16513450

    申请日：2019-07-16

    Applicant: ADVANCED MICRO DEVICES, INC.

    Inventor： Priyal Shah ,  Milind S. Bhagavat ,  Brett P. Wilkerson ,  Lei Fu ,  Rahul Agarwal

    IPC: H01L21/56 ,  H01L23/31

    Abstract: Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.

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