公开(公告)号：US11862525B2

公开(公告)日：2024-01-02

申请号：US17695757

申请日：2022-03-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu Lin ,  Pei-Yu Wang ,  Chung-Wei Hsu

IPC: H01L23/10 ,  H01L23/00 ,  H01L23/053 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04 ,  G01L19/14

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L23/04 ,  H01L23/053 ,  H01L24/48 ,  H01L33/486 ,  G01L19/14 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1659 ,  H01L2924/16195 ,  H01L2924/17151 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US11276616B2

公开(公告)日：2022-03-15

申请号：US16851006

申请日：2020-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu Lin ,  Pei-Yu Wang ,  Chung-Wei Hsu

IPC: H01L21/50 ,  H01L23/053 ,  H01L23/10 ,  H01L23/00 ,  H01L33/48 ,  H01L23/04 ,  G01L19/14

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US09911877B2

公开(公告)日：2018-03-06

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Chia Yun Hsu ,  Tsung-Yu Lin

IPC: H01L31/0232 ,  F21V8/00 ,  G01J1/02 ,  G01J1/04 ,  H01L31/12 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.

公开(公告)号：US12261089B2

公开(公告)日：2025-03-25

申请号：US18402661

申请日：2024-01-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu Lin ,  Pei-Yu Wang ,  Chung-Wei Hsu

IPC: H01L23/10 ,  H01L21/50 ,  H01L23/00 ,  H01L23/04 ,  H01L23/053 ,  H01L33/48 ,  G01L19/14

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.

公开(公告)号：US10658255B2

公开(公告)日：2020-05-19

申请号：US15844276

申请日：2017-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yu Lin ,  Pei-Yu Wang ,  Chung-Wei Hsu

IPC: H01L23/053 ,  H01L23/10 ,  H01L23/00 ,  H01L21/50 ,  H01L33/48 ,  H01L23/04 ,  G01L19/14

Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.