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公开(公告)号：US07724359B2
公开(公告)日：2010-05-25
申请号：US12154794
申请日：2008-05-27
申请人： Ahmed Nur Amin , Mark Adam Bachman , Frank A. Baiocchi , John Michael DeLucca , John William Osenbach
发明人： Ahmed Nur Amin , Mark Adam Bachman , Frank A. Baiocchi , John Michael DeLucca , John William Osenbach
IPC分类号： G01N21/00
CPC分类号： H01L22/12 , H01L21/4846 , H01L22/20 , H01L23/49866 , H01L24/13 , H01L2224/81444 , H01L2224/85444 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/244
摘要： Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.
摘要翻译： 诸如集成电路和分立功率器件的许多电子实体具有由连续沉积的镍层和诸如金的第二金属形成的接触焊盘。 所得到的焊盘结构用于形成诸如焊接连接的外部电连接。 通过检查镍层的表面以避免过度的小颗粒形成，可避免与这种连接的故障有关的问题。
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公开(公告)号：US20090298286A1
公开(公告)日：2009-12-03
申请号：US12154794
申请日：2008-05-27
申请人： Ahmed Nur Amin , Mark Adam Bachman , Frank A. Baiocchi , John Michael DeLucca , John William Osenbach
发明人： Ahmed Nur Amin , Mark Adam Bachman , Frank A. Baiocchi , John Michael DeLucca , John William Osenbach
IPC分类号： H01L21/44
CPC分类号： H01L22/12 , H01L21/4846 , H01L22/20 , H01L23/49866 , H01L24/13 , H01L2224/81444 , H01L2224/85444 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/244
摘要： Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.
摘要翻译： 诸如集成电路和分立功率器件的许多电子实体具有由连续沉积的镍层和诸如金的第二金属形成的接触焊盘。 所得到的焊盘结构用于形成诸如焊接连接的外部电连接。 通过检查镍层的表面以避免过度的小颗粒形成，可避免与这种连接的故障有关的问题。
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公开(公告)号：US20090273078A1
公开(公告)日：2009-11-05
申请号：US12151108
申请日：2008-05-02
申请人： Ahmed Nur Amin , Mark Adam Bachman , David Lee Crouthamel , John William Osenbach , Brian Thomas Vaccaro
发明人： Ahmed Nur Amin , Mark Adam Bachman , David Lee Crouthamel , John William Osenbach , Brian Thomas Vaccaro
CPC分类号： H05K1/0271 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/1132 , H01L2224/11849 , H01L2224/13016 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/45144 , H01L2224/48624 , H01L2224/48647 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/3436 , H05K2201/0133 , H05K2201/10674 , H01L2924/00014 , H01L2924/01039 , H01L2224/13099 , H01L2924/00
摘要： Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
摘要翻译： 涉及集成电路管芯（例如封装的集成电路）和与电路板电连接的封装模具的组件有时在用于电互连的导电焊盘处机械故障。 这种故障由具有具有特定特征的柔顺区域的下层适当的垫减轻。
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公开(公告)号：US07671436B2
公开(公告)日：2010-03-02
申请号：US12151108
申请日：2008-05-02
申请人： Ahmed Nur Amin , Mark Adam Bachman , David Lee Crouthamel , John William Osenbach , Brian Thomas Vaccaro
发明人： Ahmed Nur Amin , Mark Adam Bachman , David Lee Crouthamel , John William Osenbach , Brian Thomas Vaccaro
IPC分类号： H01L31/00
CPC分类号： H05K1/0271 , H01L23/49811 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/1132 , H01L2224/11849 , H01L2224/13016 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/45144 , H01L2224/48624 , H01L2224/48647 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/3436 , H05K2201/0133 , H05K2201/10674 , H01L2924/00014 , H01L2924/01039 , H01L2224/13099 , H01L2924/00
摘要： Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.
摘要翻译： 涉及集成电路管芯（例如封装的集成电路）和与电路板电连接的封装模具的组件有时在用于电互连的导电焊盘处机械故障。 这种故障由具有具有特定特征的柔顺区域的下层适当的垫减轻。
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