公开(公告)号：US06008099A

公开(公告)日：1999-12-28

申请号：US50689

申请日：1998-03-30

申请人： Akif Sultan ,  Dong-Hyuk Ju

发明人： Akif Sultan ,  Dong-Hyuk Ju

IPC分类号： H01L21/265 ,  H01L21/336

CPC分类号： H01L29/6659 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/26586

摘要： A method of making a lightly doped drain transistor includes the steps of forming a gate electrode (52) and a gate oxide (54) over a semiconductor substrate (56) and forming a drain (70) in a drain region (58) and a source (72) in a source region (60) of the substrate (56). The method further includes generating interstitials (62) near a lateral edge of at least one of the drain (70) and the source (72) and thermally treating the substrate (56). The thermal treatment cause the interstitials (62) to enhance a lateral diffusion (84) of the drain (70) under the gate oxide (54) without substantially impacting a vertical diffusion (82) of the drain (70) or the source (72). The enhanced lateral diffusion (84) results in the formation of at least one of a lightly doped drain extension region (75) and a lightly doped source extension region (76) without an increase in a junction depth of the drain (70) or the source (72). The step of generating interstitials (62) may include the step of implanting at least one of the drain region (58) and the source region (60) of the substrate (56) with a large tilt angle implant which creates the interstitials (62) at a location near the gate oxide (54).

摘要翻译： 一种制造轻掺杂漏极晶体管的方法包括以下步骤：在半导体衬底（56）上形成栅电极（52）和栅极氧化物（54），并在漏区（58）中形成漏极（70） 源极（72）在衬底（56）的源极区（60）中。 所述方法还包括在所述排水口（70）和所述源（72）中的至少一个的侧边缘附近产生间隙（62）并热处理所述衬底（56）。 热处理使间隙（62）增强栅极氧化物（54）下面的漏极（70）的横向扩散（84），而基本上不影响漏极（70）或源极（72）的垂直扩散（82） ）。 增强的横向扩散（84）导致轻掺杂漏极延伸区域（75）和轻掺杂源极延伸区域（76）中的至少一个的形成，而不会增加漏极（70）或 来源（72）。 产生间隙（62）的步骤可以包括用产生间隙（62）的大倾斜角植入物植入衬底（56）的漏区（58）和源区（60）中的至少一个的步骤， 在栅极氧化物（54）附近。

公开(公告)号：US08687417B2

公开(公告)日：2014-04-01

申请号：US11867743

申请日：2007-10-05

申请人： Ruigang Li ,  Jingrong Zhou ,  David Donggang Wu ,  Zhonghai Shi ,  James F. Buller ,  Akif Sultan ,  Fred Hause ,  Donna Michael

发明人： Ruigang Li ,  Jingrong Zhou ,  David Donggang Wu ,  Zhonghai Shi ,  James F. Buller ,  Mark W. Michael ,  Akif Sultan ,  Fred Hause

IPC分类号： G11C11/34 ,  G11C16/04 ,  G11C16/02 ,  G11C16/00

CPC分类号： H01L21/84 ,  H01L27/1203

摘要： A first bias charge is provided to first bias region at a first level of an electronic device, the first bias region directly underlying a first transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the first transistor is based upon the first bias charge. A second bias charge is provided to second bias region at the first level of an electronic device, the second bias region directly underlying a second transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the second transistor is based upon the second bias charge.

摘要翻译： 第一偏置电荷被提供给电子器件的第一电平处的第一偏置区域，直接位于第一晶体管下方的第一偏置区域具有与第一偏置区域电隔离的第二电平的沟道区域。 第一晶体管的电压阈值基于第一偏置电荷。 第二偏置电荷被提供给电子器件的第一电平处的第二偏置区域，第二偏置区域直接位于具有与第一偏置区域电隔离的第二电平的沟道区域的第二晶体管的正下方。 第二晶体管的电压阈值基于第二偏置电荷。

公开(公告)号：US20080104550A1

公开(公告)日：2008-05-01

申请号：US11537390

申请日：2006-09-29

申请人： Akif Sultan ,  Jian Chen ,  Mark W. Michael ,  Jingrong R. Zhou

发明人： Akif Sultan ,  Jian Chen ,  Mark W. Michael ,  Jingrong R. Zhou

IPC分类号： G06F17/50

CPC分类号： G06F17/5072

摘要： A method includes receiving design data associated with an integrated circuit device. The integrated circuit device includes a first element having a corner defined therein and a second element overlapping the first element. A dimension specified for the first element in the design data is adjusted based on a distance between the second element and the corner. The integrated circuit device is simulated based on the adjusted dimension.

摘要翻译： 一种方法包括接收与集成电路装置相关联的设计数据。 集成电路装置包括具有限定在其中的角部的第一元件和与第一元件重叠的第二元件。 基于第二元件和拐角之间的距离来调整为设计数据中的第一元件指定的尺寸。 基于经调整的尺寸模拟集成电路器件。

公开(公告)号：US06921704B1

公开(公告)日：2005-07-26

申请号：US10700557

申请日：2003-11-05

申请人： David Wu ,  Akif Sultan ,  Bin Yu

发明人： David Wu ,  Akif Sultan ,  Bin Yu

IPC分类号： H01L21/762 ,  H01L21/764 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/76

CPC分类号： H01L21/764 ,  H01L21/76224 ,  H01L21/823481 ,  H01L21/823878

摘要： A method of forming a silicon-on-insulator semiconductor device including providing a substrate and forming a trench in the substrate, wherein the trench includes opposing side walls extending upwardly from a base of the trench. The method also includes depositing at least two insulating layers into the trench to form a shallow trench isolation structure, wherein an innermost of the insulating layers substantially conforms to the base and the two side walls of the trench and an outermost of the insulating layers spans the side walls of the trench so that a gap is formed between the insulating layers in the trench. The gap creates compressive forces within the shallow trench isolation structure, which in turn creates tensile stress within the surrounding substrate to enhance mobility of the device.

摘要翻译： 一种形成绝缘体上半导体器件的方法，包括提供衬底并在衬底中形成沟槽，其中沟槽包括从沟槽的基底向上延伸的相对的侧壁。 该方法还包括将至少两个绝缘层沉积到沟槽中以形成浅沟槽隔离结构，其中绝缘层的最内层基本上与基底一致并且沟槽的两个侧壁和绝缘层的最外层横跨 沟槽的侧壁，使得在沟槽中的绝缘层之间形成间隙。 间隙在浅沟槽隔离结构内产生压缩力，这反过来在周围的衬底内产生拉伸应力，以增强器件的移动性。

公开(公告)号：US06777281B1

公开(公告)日：2004-08-17

申请号：US10214361

申请日：2002-08-08

申请人： Daniel Kadosh ,  Scott D. Luning ,  Akif Sultan ,  David Wu

发明人： Daniel Kadosh ,  Scott D. Luning ,  Akif Sultan ,  David Wu

IPC分类号： H01L218238

CPC分类号： H01L29/6659 ,  H01L21/3115 ,  H01L21/31155 ,  H01L21/823814 ,  H01L29/6656

摘要： A method of manufacturing a semiconductor device, comprising steps of: (a) providing a semi conductor substrate including at least one dopant species-containing region extending to a surface of the substrate; (b) forming a thin liner oxide layer on the surface of the substrate; and (c) incorporating in the thin line oxide layer at least one species which substantially prevents, or at least reduces, segregation therein of the dopant species arising from movement thereinto from the at least one dopant species-containing region.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：（a）提供半导体衬底，其包括至少一个延伸到衬底表面的含掺杂物种的区域;（b）在衬底的表面上形成薄的衬里氧化物层 基材; 和（c）在细线氧化物层中并入至少一种物质，其至少一种物质，其基本上防止或至少减少其中从至少一种含掺杂物种的区域移动而引起的掺杂物质的偏析。

公开(公告)号：US06727136B1

公开(公告)日：2004-04-27

申请号：US10273291

申请日：2002-10-18

申请人： James F. Buller ,  Derick J. Wristers ,  David Wu ,  Akif Sultan

发明人： James F. Buller ,  Derick J. Wristers ,  David Wu ,  Akif Sultan

IPC分类号： H01L21336

CPC分类号： H01L29/6659 ,  H01L21/823418 ,  H01L21/823814 ,  H01L29/1054 ,  H01L29/7833

摘要： A method of manufacturing a semiconductor device, comprising sequential steps of: (a) providing a semiconductor substrate including a pre-selected thickness strained lattice layer of a first semiconductor material at an upper surface thereof and an underlying layer of a second semiconductor material; and (b) introducing a dopant-containing species of one conductivity type into at least one pre-selected portion of the strained lattice layer of first semiconductor material to form a dopant-containing region therein with a junction at a depth substantially equal to the pre-selected thickness, wherein the second semiconductor material of the underlying layer inhibits diffusion thereinto of the dopant-containing species from the strained lattice layer, thereby controlling/limiting the depth of the junction to substantially the pre-selected thickness of the strained lattice layer.

摘要翻译： 一种制造半导体器件的方法，包括以下顺序的步骤：（a）提供半导体衬底，该半导体衬底在其上表面包括预先选定的第一半导体材料的应变晶格层和第二半导体材料的下层; 和（b）将含有一种导电类型的含掺杂剂的物质引入到第一半导体材料的应变晶格层的至少一个预先选择的部分中，以在其中形成含有掺杂剂的区域，其中接合部的深度基本上等于预先 - 选择的厚度，其中下层的第二半导体材料抑制来自应变晶格层的含掺杂剂物质的扩散，从而将结的深度控制/限制到基本上预应变晶格层的预选厚度。

公开(公告)号：US5970353A

公开(公告)日：1999-10-19

申请号：US050730

申请日：1998-03-30

申请人： Akif Sultan

发明人： Akif Sultan

IPC分类号： H01L21/265 ,  H01L21/336 ,  H01L29/78

CPC分类号： H01L29/6659 ,  H01L29/6656 ,  H01L29/7836 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/26586

摘要： A method of reducing an effective channel length of a lightly doped drain transistor (50), includes the steps of forming a gate electrode (52) and a gate oxide (54) over a semiconductor substrate (56) and implanting a drain region (58) of the substrate (56) with a sub-amorphous large tilt angle implant to thereby supply interstitials (62) at a location under the gate oxide (54). The method also includes forming a lightly doped drain extension region (66) in the drain region (58) of the substrate (56) and forming a drain (70) in the drain region (58) and forming a source extension region (67) and a source (72) in a source region (60) of the substrate (56). Lastly, the method includes thermally treating the substrate (56), wherein the interstitials (62) enhance a lateral diffusion (84) under the gate oxide (54) without substantially impacting a vertical diffusion (86) of the extension regions (66, 67), thereby reducing the effective channel length without an increase in a junction depth of the drain (70) and the drain extension region (66) or the source (72) and the source extension region (67).

公开(公告)号：US07598161B2

公开(公告)日：2009-10-06

申请号：US11861534

申请日：2007-09-26

申请人： Jingrong Zhou ,  Mark Michael ,  Donna Michael, legal representative ,  David Wu ,  James F. Buller ,  Akif Sultan

发明人： Jingrong Zhou ,  Mark Michael ,  David Wu ,  James F. Buller ,  Akif Sultan

IPC分类号： H01L21/425

CPC分类号： H01L21/26513 ,  H01L21/26586 ,  H01L21/823807 ,  H01L29/1083

摘要： The halo implant technique described herein employs a halo implant mask that creates a halo implant shadowing effect during halo dopant bombardment. A first transistor device structure and a second transistor device structure are formed on a wafer such that they are orthogonally oriented to each other. A common halo implant mask is created with features that prevent halo implantation of the diffusion region of the second transistor device structure during halo implantation of the diffusion region of the first transistor device structure, and with features that prevent halo implantation of the diffusion region of the first transistor device structure during halo implantation of the diffusion region of the second transistor device structure. The orthogonal orientation of the transistor device structures and the pattern of the halo implant mask obviates the need to create multiple implant masks to achieve different threshold voltages for the transistor device structures.

摘要翻译： 本文描述的光晕植入技术采用在光晕掺杂剂轰击期间产生晕轮植入物阴影效应的光晕注入掩模。 第一晶体管器件结构和第二晶体管器件结构形成在晶片上，使得它们彼此正交地取向。 创建了常见的光晕注入掩模，其特征在于，在第一晶体管器件结构的扩散区域的晕圈注入期间防止第二晶体管器件结构的扩散区域的光晕注入，并且具有防止第 在第二晶体管器件结构的扩散区的晕圈注入期间的第一晶体管器件结构。 晶体管器件结构的正交取向和光晕注入掩模的图案消除了创建多个注入掩模以实现晶体管器件结构的不同阈值电压的需要。

公开(公告)号：US20090090969A1

公开(公告)日：2009-04-09

申请号：US11867743

申请日：2007-10-05

申请人： Ruigang Li ,  Jingrong Zhou ,  David Donggang Wu ,  Zhonghai Shi ,  James F. Buller ,  Mark W. Michael ,  Donna Michael ,  Akif Sultan ,  Fred Hause

发明人： Ruigang Li ,  Jingrong Zhou ,  David Donggang Wu ,  Zhonghai Shi ,  James F. Buller ,  Mark W. Michael ,  Donna Michael ,  Akif Sultan ,  Fred Hause

IPC分类号： H01L27/12 ,  H01L21/84

CPC分类号： H01L21/84 ,  H01L27/1203

摘要： A first bias charge is provided to first bias region at a first level of an electronic device, the first bias region directly underlying a first transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the first transistor is based upon the first bias charge. A second bias charge is provided to second bias region at the first level of an electronic device, the second bias region directly underlying a second transistor having a channel region at a second level that is electrically isolated from the first bias region. A voltage threshold of the second transistor is based upon the second bias charge.

摘要翻译： 第一偏置电荷被提供给电子器件的第一电平处的第一偏置区域，直接位于第一晶体管下方的第一偏置区域具有与第一偏置区域电隔离的第二电平的沟道区域。 第一晶体管的电压阈值基于第一偏置电荷。 第二偏置电荷被提供给电子器件的第一电平处的第二偏置区域，第二偏置区域直接位于具有与第一偏置区域电隔离的第二电平的沟道区域的第二晶体管的正下方。 第二晶体管的电压阈值基于第二偏置电荷。

公开(公告)号：US06365516B1

公开(公告)日：2002-04-02

申请号：US09483081

申请日：2000-01-14

申请人： Austin Frenkel ,  Akif Sultan ,  Paul Besser

发明人： Austin Frenkel ,  Akif Sultan ,  Paul Besser

IPC分类号： H01L2144

CPC分类号： H01L21/0206 ,  H01L21/28518

摘要： Various methods of fabricating a silicide structure are provided. In one aspect, a method of fabricating a circuit structure on a silicon surface is provided that includes exposing the silicon surface to a plasma ambient containing hydrogen and an inert gas, and depositing a metallic material capable of forming silicide on the silicon surface. The metallic material is heated to form a metal silicide on the silicon surface. The method provides for low sheet resistance silicide structures by eliminating native oxide films without the risk of spacer material backsputtering.

摘要翻译： 提供了制造硅化物结构的各种方法。 一方面，提供一种在硅表面上制造电路结构的方法，其包括将硅表面暴露于含有氢气和惰性气体的等离子体环境中，以及在硅表面上沉积能够形成硅化物的金属材料。 金属材料被加热以在硅表面上形成金属硅化物。 该方法通过消除天然氧化物膜而不会产生间隔材料反溅镀的风险，从而提供低电阻硅化物结构。