利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.019 秒)

    Semiconducting resin compositions
    2.
    发明授权
    Semiconducting resin compositions 失效
    半导体树脂组合物

    公开(公告)号：US4412938A

    公开(公告)日：1983-11-01

    申请号：US198922

    申请日：1980-10-20

    申请人： Tetsuji Kakizaki ,  Toshikazu Mizutani

    发明人： Tetsuji Kakizaki ,  Toshikazu Mizutani

    IPC分类号： C08L51/00 ,  C08J3/24 ,  C08K3/04 ,  C08L51/06 ,  H01B1/24 ,  H01B5/16

    CPC分类号： H01B1/24 ,  C08K3/04 ,  C08L51/06 ,  Y10T428/2933

    摘要： A semiconducting resin composition comprises: (A) 100 to 40 parts of a modified ethylene-vinyl acetate copolymer prepared by graft processing of 100 parts of an ethylene-vinyl acetate copolymer of a vinyl acetate content of less than 35 percent with 25 to 200 parts of an aromatic vinyl monomer; (B) 0 to 60 parts of a rubber; and (C) 3 to 150 parts of a carbon black with respect to 100 parts of the above described components (A) and (B), all quantities in "parts" and "percent" being by weight. A composition of this character has excellent characteristics for its use in forming the outer semiconducting layer of polyethylene-insulated cables.

    摘要翻译： 半导体树脂组合物包含：（A）通过将100份乙酸乙烯酯含量小于35％的乙烯 - 乙酸乙烯酯共聚物与25至200份的共聚物接枝加工而制备的改性乙烯 - 乙酸乙烯酯共聚物100至40份 的芳族乙烯基单体; （B）0〜60份橡胶; 和（C）相对于100份上述组分（A）和（B），为3至150份的炭黑，“份”和“百分比”中的所有数量均为重量份。 这种性质的组合物在形成聚乙烯绝缘电缆的外半导体层时具有优异的特性。

    Semiconductive resin composition and process for producing the same
    3.
    发明授权
    Semiconductive resin composition and process for producing the same 失效
    半导体树脂组合物及其制备方法

    公开(公告)号：US5985181A

    公开(公告)日：1999-11-16

    申请号：US20897

    申请日：1998-02-09

    申请人： Yoshie Yoshida ,  Toshikazu Mizutani ,  Masaki Kitagawa ,  Jichio Deguchi

    发明人： Yoshie Yoshida ,  Toshikazu Mizutani ,  Masaki Kitagawa ,  Jichio Deguchi

    IPC分类号： H01B1/24 ,  H01B1/06

    CPC分类号： H01B1/24 ,  Y10T428/2947

    摘要： There is provided a semiconductive resin composition comprising the following components (A), (B), (D) and (E):(A) 5 to 100 parts by weight of a modified ethylene copolymer obtainable by subjecting an ethylene copolymer (a1) and a vinyl monomer (a2) to graft polymerization conditions,(B) 0.5 to 15 parts by weight of an unsaturated silane compound,(D) 10 to 110 parts by weight of carbon black, and(E) 0 to 95 parts by weight of an ethylene copolymer, provided that the amounts of the components shown above are based on 100 parts by weight in total of the components (A) and (E),wherein the component (B) is incorporated into the composition by subjecting the component (B) to melt graft reaction together with the component (A) and/or component (E) in the presence of 0.01 to 2 parts by weight of a radical generator (C),the vinyl monomer (a2) unit is contained in the composition in an amount of 5 to 35% by weight of the total amount of the components (A) and (E), andthe degree of crosslinking of the composition is from 30 to 90% by weight.

    摘要翻译： 提供了包含以下组分（A），（B），（D）和（E）的半导体树脂组合物：（A）5至100重量份通过使乙烯共聚物（a1） 乙烯基单体（a2），接枝聚合条件，（B）0.5〜15重量份的不饱和硅烷化合物，（D）10〜110重量份的炭黑，（E）0〜95重量份 的乙烯共聚物，条件是上述组分的量基于组分（A）和（E）的总计100重量份，其中组分（B）通过使组分（B） B）在0.01〜2重量份自由基发生剂（C）的存在下，与成分（A）和/或成分（E）一起熔融接枝反应，组合物中含有乙烯基单体（a2）单元 （A）和（E）的总量的5〜35重量％，交联度 组合物的着色为30至90重量％。

    Thermoplastic resin compositions having excellent antistatic properties
    4.
    发明授权
    Thermoplastic resin compositions having excellent antistatic properties 失效
    具有优异抗静电性能的热塑性树脂组合物

    公开(公告)号：US5834559A

    公开(公告)日：1998-11-10

    申请号：US584392

    申请日：1996-01-11

    申请人： Jichio Deguchi ,  Toshikazu Mizutani

    发明人： Jichio Deguchi ,  Toshikazu Mizutani

    IPC分类号： C08L23/10 ,  C08L23/16 ,  C08L53/02 ,  C08L77/00 ,  C08L23/12 ,  C08L33/24

    CPC分类号： C08L23/10 ,  C08L23/16 ,  C08L53/02 ,  C08L77/00 ,  Y10S524/913

    摘要： A thermoplastic resin composition having excellent antistatic properties comprising 100 parts by weight of the following component (A), 3 to 30 parts by weight of the following component (B) and 5 to 40 parts by weight of the following component (C): component (A): a crystalline propylene resin having a melt flow rate (MFR) of 1 to 80 g/10 min; component (B): a thermoplastic elastomer selected from (b.sup.1) olefin copolymer elastomers having a Mooney viscosity (ML.sub.1+4 (100.degree. C.)) of 10 to 85, and (b.sup.2) hydrogenated products of a block copolymer of styrene or a derivative thereof and a conjugated diene, containing 15 to 50% by weight of styrene or a derivative thereof, having a weight-average molecular weight of 50,000 to 220,000; and component (C): an acrylamide copolymer.

    摘要翻译： 具有优异的抗静电性的热塑性树脂组合物，其包含100重量份的以下组分（A），3至30重量份的以下组分（B）和5至40重量份的以下组分（C）：组分 （A）：熔体流动速率（MFR）为1〜80g / 10分钟的结晶丙烯树脂; 组分（B）：选自（b1）门尼粘度（ML1 + 4（100℃））的烯烃共聚物弹性体为10〜85的热塑性弹性体，（b2）苯乙烯或 衍生物和共轭二烯，其含有15〜50重量％的苯乙烯或其衍生物，其重均分子量为50,000〜220,000; 和组分（C）：丙烯酰胺共聚物。

    Cases for memory disks having excellent antistatic properties
    6.
    发明授权
    Cases for memory disks having excellent antistatic properties 失效
    具有优异抗静电性能的记忆盘案例

    公开(公告)号：US5945481A

    公开(公告)日：1999-08-31

    申请号：US891708

    申请日：1997-07-09

    申请人： Toshikazu Mizutani ,  Jichio Deguchi

    发明人： Toshikazu Mizutani ,  Jichio Deguchi

    IPC分类号： B65D1/00 ,  B65D85/57 ,  C08F210/02 ,  C08L23/10 ,  C08L23/16 ,  C08L53/00 ,  C08L77/00 ,  G11B33/04 ,  C08L33/26

    CPC分类号： G11B33/0444 ,  C08L23/10 ,  C08L23/142 ,  C08L2205/03 ,  C08L23/16 ,  C08L33/26 ,  C08L53/00 ,  C08L77/00

    摘要： A case for memory disks having excellent antistatic properties, which comprises a thermoplastic resin composition comprising 100 parts by weight of the following component (A), 3 to 30 parts by weight of the following component (B) and 5 to 40 parts by weight of the following component (C):component (A): a crystalline propylene resin having a melt flow rate (MFR) of 1 to 80 g/10 min;component (B): a thermoplastic elastomer selected from (b.sup.1) olefin copolymer elastomers having a Mooney viscosity (ML.sub.1+4 (100.degree. C.)) of 10 to 85, and (b.sup.2) hydrogenated products of a block copolymer of styrene or a derivative thereof and a conjugated diene, containing 15 to 50% by weight of styrene or a derivative thereof, having a weight-average molecular weight of 50,000 to 220,000; andcomponent (C): an acrylamide copolymer.

    摘要翻译： 一种具有优异抗静电性能的记忆盘的壳体，其包含热塑性树脂组合物，其包含100重量份的以下组分（A），3至30重量份的以下组分（B）和5至40重量份的 以下成分（C）：成分（A）：熔体流动速率（MFR）为1〜80g / 10分钟的结晶丙烯树脂; 组分（B）：选自（b1）门尼粘度（ML1 + 4（100℃））的烯烃共聚物弹性体为10〜85的热塑性弹性体，（b2）苯乙烯或 衍生物和共轭二烯，其含有15〜50重量％的苯乙烯或其衍生物，其重均分子量为50,000〜220,000; 和组分（C）：丙烯酰胺共聚物。

    Female terminal
    8.
    发明授权
    Female terminal 失效
    女性终端

    公开(公告)号：US5975963A

    公开(公告)日：1999-11-02

    申请号：US91904

    申请日：1998-06-26

    申请人： Mitsutoshi Higuchi ,  Toshikazu Mizutani ,  Satoru Imaeda ,  Yasuo Miyake ,  Takehiko Niwa ,  Haruo Shimura

    发明人： Mitsutoshi Higuchi ,  Toshikazu Mizutani ,  Satoru Imaeda ,  Yasuo Miyake ,  Takehiko Niwa ,  Haruo Shimura

    IPC分类号： H05K1/18 ,  H01R4/02 ,  H01R12/55 ,  H01R12/58 ,  H01R13/11 ,  H01R13/115 ,  H01R11/22

    CPC分类号： H01R4/028 ,  H01R12/58 ,  H01R13/11 ,  H01R13/113

    摘要： A female terminal has a structure that does not allow molten solder to close a pipe section into which male terminal is inserted. Notched recessed sections (9) are oppositely formed at the lower ends of the side faces (3a and 3a) of a female terminal (1). The female terminal (1) is locked by horizontally opening locking legs (7) protruded from the rear surface of a printed wiring board (11) from an inserting hole (12). In such a state, the rear surface of the board is dipped in molten solder (21). When the board (11), is pulled up from the molten solder (12), the solder (21) closing the pipe section (2) in a bridge-like form is turned to droplets and drops from the recessed section (9), because the wettability of the pipe section (2) with the solder (21) is lowered and the adhesion is weakened due to the recessed sections (9). The remaining molten solder (21) attaches to the peripheral edge of the end of the pipe section (2) other than the recessed sections (9) due to the surface tension and solidifies.

    摘要翻译： PCT No.PCT / JP96 / 03827 Sec。 371日期：1998年6月26日 102（e）日期1998年6月26日PCT 1996年12月24日PCT公布。 出版物WO97 / 24910 日期1997年7月10日母端子具有不允许熔融焊料封闭插入阳端子的管段的结构。 在凹形端子（1）的侧面（3a和3a）的下端形成有凹口的凹部（9）。 通过从插入孔（12）水平打开从印刷电路板（11）的后表面突出的锁定腿（7），阴端子（1）被锁定。 在这种状态下，将板的后表面浸入熔融焊料（21）中。 当板（11）从熔融焊料（12）拉起时，将管状部分（2）以桥状形式封闭的焊料（21）从凹部（9）转向液滴和滴落， 因为具有焊料（21）的管部（2）的润湿性降低，并且由于凹部（9）而导致的粘接力减弱。 剩余的熔融焊料（21）由于表面张力而附着到除了凹部（9）之外的管部（2）的端部的周边边缘并固化。

    Semiconductive resin composition
    9.
    发明授权
    Semiconductive resin composition 失效
    半导体树脂组合物

    公开(公告)号：US4696765A

    公开(公告)日：1987-09-29

    申请号：US663593

    申请日：1984-10-18

    申请人： Tetsuji Kakizaki ,  Toshikazu Mizutani ,  Hiroshi Yui

    发明人： Tetsuji Kakizaki ,  Toshikazu Mizutani ,  Hiroshi Yui

    IPC分类号： C08K3/04 ,  C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L23/04 ,  C08L31/04 ,  C08L33/00 ,  C08L33/02 ,  C08L101/00 ,  C09C1/48 ,  H01B1/20 ,  H01B1/24 ,  H01B1/06

    CPC分类号： H01B1/24 ,  C08K3/04

    摘要： A semiconductive resin composition used in power cables having excellent properties is disclosed, which comprises 100 parts by weight of a base resin of at least one member selected from the group consisting of a low-density polyethylene, an ethylene/vinyl acetate copolymer having a vinyl acetate content of 25% by weight or less and an ethylene/(meth)acrylate copolymer having a (meth)acrylate content of 20% by weight or less, and 6 to 25 parts by weight of electroconductive carbon black having a DBP-absorption number of 220 to 340 ml/100 g and an impurity metal residue of 0.2% by weight or less.

    摘要翻译： 公开了一种用于具有优异性能的电力电缆中使用的半导体树脂组合物，其包含100重量份选自低密度聚乙烯，乙烯/乙酸乙烯酯共聚物中的至少一种的基础树脂，其具有乙烯基 乙酸酯含量为25重量％以下，和（甲基）丙烯酸酯含量为20重量％以下的乙烯/（甲基）丙烯酸酯共聚物和6〜25重量份具有DBP吸收数的导电炭黑 为220〜340ml / 100g，杂质金属残渣为0.2重量％以下。

    Thermoplastic fluorine-containing resin blend composition
    10.
    发明授权
    Thermoplastic fluorine-containing resin blend composition 失效
    热塑性含氟树脂共混组合物

    公开(公告)号：US4575533A

    公开(公告)日：1986-03-11

    申请号：US730149

    申请日：1985-05-03

    申请人： Shinji Horie ,  Tetsuji Kakizaki ,  Toshikazu Mizutani

    发明人： Shinji Horie ,  Tetsuji Kakizaki ,  Toshikazu Mizutani

    IPC分类号： C08L1/00 ,  C08L23/00 ,  C08L27/00 ,  C08L27/12 ,  C08L51/00 ,  C08L51/02 ,  C08L51/06 ,  C08L57/00 ,  C08L101/00 ,  C08L101/04 ,  C08L27/14 ,  C08L27/16

    CPC分类号： C08L27/12 ,  C08L51/06

    摘要： 1. A thermoplastic fluorine-containing resin blend composition comprising(a) from 5 to 95% by weight of a thermoplastic fluorine-containing resin, and(b) from 95 to 5% by weight of at least one modified ethylene polymer selected from the group consisting of the following components (i) and (ii).(i) A modified ethylene polymer obtained by subjecting an ethylene polymer and an alkyl acrylate to graft reaction conditions, wherein the total alkyl acrylate content including the alkyl acrylate which has been previously contained is from 5 to 70% by weight based on the weight of the modified ethylene polymer;(ii) A modified ethylene polymer obtained by subjecting an ethylene polymer having a crystallinity of from 4 to 50% and vinyl acetate to graft reaction conditions, wherein the total vinyl acetate content including the vinyl acetate which has been previously contained is from 5 to 70% by weight based on the weight of the modified ethylene polymer and the boiling xylene insoluble content is 10% by weight or less based on the weight of the modified ethylene polymer.

    摘要翻译： 1.一种热塑性含氟树脂共混组合物，其包含（a）5至95重量％的热塑性含氟树脂，和（b）95至5重量％的至少一种改性乙烯聚合物，其选自 组由以下组分（i）和（ii）组成。 （i）通过使乙烯聚合物和丙烯酸烷基酯进行接枝反应条件而获得的改性乙烯聚合物，其中包含以前含有的丙烯酸烷基酯的总烷基酯含量为5-70重量％ 改性乙烯聚合物; （ii）通过使结晶度为4〜50％的乙烯聚合物和乙酸乙烯酯进行接枝反应而得到的改性乙烯聚合物，其中包含先前含有的乙酸乙烯酯的总乙酸乙烯酯含量为5〜70 相对于改性乙烯聚合物的重量，基于改性乙烯聚合物的重量和沸点二甲苯不溶成分的重量％为10重量％以下。