公开(公告)号：US6018211A

公开(公告)日：2000-01-25

申请号：US921499

申请日：1997-09-02

申请人： Akihiro Kanaboshi ,  Masato Sugimoto ,  Yutaka Taguchi ,  Kazuo Eda

发明人： Akihiro Kanaboshi ,  Masato Sugimoto ,  Yutaka Taguchi ,  Kazuo Eda

IPC分类号： H03H9/05 ,  H01L41/08

CPC分类号： H03H9/1092

摘要： A surface acoustic wave device is manufactured by directly or indirectly bonding a lid to a substrate having a surface acoustic wave element to seal the element under the lid. The lid is made of at least one material selected from the group comprising lithium niobate, lithium tantalete, lithium borate, glass and quartz. The substrate is made of at least one material selected from the group comprising quartz, lithium niobate, lithium tantalete and lithium borate.

摘要翻译： 通过将盖直接或间接地接合到具有表面声波元件的基板上来密封盖下的元件来制造表面声波装置。 该盖由选自铌酸锂，钽酸锂，硼酸锂，玻璃和石英的组中的至少一种材料制成。 衬底由选自石英，铌酸锂，钽酸锂和硼酸锂的组中的至少一种材料制成。

公开(公告)号：US5747857A

公开(公告)日：1998-05-05

申请号：US182561

申请日：1994-01-18

申请人： Kazuo Eda ,  Yutaka Taguchi ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura

发明人： Kazuo Eda ,  Yutaka Taguchi ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura

IPC分类号： H01L27/20 ,  H03B5/04 ,  H03B5/36 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/19 ,  H03H9/54 ,  H03H9/56 ,  H01L41/10 ,  H01L41/08

CPC分类号： H01L27/20 ,  H03B5/368 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/0542 ,  H03H9/1021 ,  H03H9/174 ,  H03H9/19 ,  H03H9/545 ,  H03H9/562 ,  H03H9/564 ,  H03B5/04

摘要： Integrated circuits utilizing piezoelectric elements can be advantageously constructed by bonding elements together via direct bonds. Such integrated circuits include an electro-acoustic hybrid integrated circuit such as a voltage controlled oscillator wherein a semiconductor substrate having an active element is bonded through direct bonding to a surface acoustic wave resonator or a quartz oscillator as an electro-acoustic element. A quartz device can also be provided which includes a quartz plate, excitation electrodes on opposite surfaces, and a holding member made of a material having a thermal expansion coefficient substantially equal to that of the quartz plate. The holding member is connected to the quartz plate by direct bonding without using any adhesives. Because the thermal expansion coefficients of the quartz plate and the holding member are equal, no thermal stress occurs in the bonding area. As a result, virtually no stress is applied to the quartz plate and the frequency-temperature characteristic can be improved. A piezoelectric filter according to the invention includes an oscillatory piezoelectric plate made of quartz, lithium tantalate, lithium niobate or lithium borate and having an oscillatory portion; a glass plate to which the piezoelectric plate is directly bonded; and first and second oscillatory electrode members which are provided on opposite faces of the oscillatory portion, respectively, such that at least one of the oscillatory electrode members is divided into a plurality of counter electrodes.

摘要翻译： 利用压电元件的集成电路可以有利地通过直接结合将元件结合在一起而构成。 这种集成电路包括诸如压控振荡器的电声混合集成电路，其中具有有源元件的半导体衬底通过直接接合结合到表面声波谐振器或作为电声元件的石英振荡器。 还可以提供石英装置，其包括石英板，相对表面上的激励电极以及由具有基本上等于石英板的热膨胀系数的材料制成的保持构件。 保持构件通过直接接合而不使用任何粘合剂连接到石英板。 由于石英板和保持构件的热膨胀系数相等，所以在接合区域中不产生热应力。 结果，几乎没有对石英板施加应力，并且可以提高频率 - 温度特性。 根据本发明的压电滤波器包括由石英，钽酸锂，铌酸锂或硼酸锂制成并具有振荡部分的振荡压电板; 压电板直接接合的玻璃板; 以及第一和第二振荡电极部件，其分别设置在所述振荡部分的相对面上，使得所述振荡电极部件中的至少一个被分成多个对置电极。

公开(公告)号：US5666706A

公开(公告)日：1997-09-16

申请号：US438966

申请日：1995-05-11

申请人： Yoshihiro Tomita ,  Akihiro Kanaboshi ,  Yutaka Taguchi ,  Kazuo Eda

发明人： Yoshihiro Tomita ,  Akihiro Kanaboshi ,  Yutaka Taguchi ,  Kazuo Eda

IPC分类号： H03H3/02 ,  H03H9/05 ,  H01L41/22

CPC分类号： H03H9/172 ,  H03H3/02 ,  Y10T29/42 ,  Y10T29/49812

摘要： A piezoelectric acoustic wave device includes a substrate and a piezoelectric plate. The piezoelectric plate includes a resonating part, and has a top electrode at least on the top surface of the resonating part. The substrate and the piezoelectric plate are directly bonded at an area where they are in contact with each other by a chemical bond such as a covalent bond and an ionic bond. A depression is formed in at least one of the substrate and the piezoelectric plate. The method of manufacturing the piezoelectric acoustic wave device includes the steps of forming a depression in at least one of the substrate and the piezoelectric plate, filling the depression with an intermediate support layer, cleaning the surfaces of the substrate and the piezoelectric plate to directly bond to each other by a chemical bond, forming electrodes, and removing the intermediate support layer.

摘要翻译： 压电声波装置包括基板和压电板。 压电板包括谐振部分，并且至少在谐振部分的顶表面上具有顶电极。 基板和压电板通过诸如共价键和离子键的化学键彼此接触的区域直接结合。 在基板和压电板中的至少一个上形成凹陷。 制造压电声波装置的方法包括以下步骤：在至少一个基板和压电板中形成凹陷，用中间支撑层填充凹陷，清洁基板和压电板的表面直接键合 通过化学键彼此形成电极，并除去中间支撑层。

公开(公告)号：US5668057A

公开(公告)日：1997-09-16

申请号：US473932

申请日：1995-06-07

申请人： Kazuo Eda ,  Yutaka Taguchi ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura

发明人： Kazuo Eda ,  Yutaka Taguchi ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura

IPC分类号： H01L27/20 ,  H03B5/04 ,  H03B5/36 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/17 ,  H03H9/19 ,  H03H9/54 ,  H03H9/56 ,  H01L21/60

CPC分类号： H03H9/19 ,  H01L27/20 ,  H03B5/368 ,  H03H3/02 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/0542 ,  H03H9/1021 ,  H03H9/174 ,  H03H9/545 ,  H03H9/562 ,  H03H9/564 ,  H01L2224/48091 ,  H01L2924/1305 ,  H03B5/04

摘要： Integrated circuits utilizing piezoelectric elements can be advantageously constructed by bonding elements together via direct bonds. Such integrated circuits include an electro-acoustic hybrid integrated circuit such as a voltage controlled oscillator wherein a semiconductor substrate having an active element is bonded through direct bonding to a surface acoustic wave resonator or a quartz oscillator as an electro-acoustic element. A quartz device can also be provided which includes a quartz plate, excitation electrodes on opposite surfaces, and a holding member made of a material having a thermal expansion coefficient substantially equal to that of the quartz plate. The holding member is connected to the quartz plate by direct bonding without using any adhesives. Because the thermal expansion coefficients of the quartz plate and the holding member are equal, no thermal stress occurs in the bonding area. As a result, virtually no stress is applied to the quartz plate and the frequency-temperature characteristic can be improved. A piezoelectric filter according to the invention includes an oscillatory piezoelectric plate made of quartz, lithium tantalate, lithium niobate or lithium borate and having an oscillatory portion; a glass plate to which the piezoelectric plate is directly bonded; and first and second oscillatory electrode members which are provided on opposite faces of the oscillatory portion, respectively, such that at least one of the oscillatory electrode members is divided into a plurality of counter electrodes.

摘要翻译： 利用压电元件的集成电路可以有利地通过直接结合将元件结合在一起而构成。 这种集成电路包括诸如压控振荡器的电声混合集成电路，其中具有有源元件的半导体衬底通过直接接合结合到表面声波谐振器或作为电声元件的石英振荡器。 还可以提供石英装置，其包括石英板，相对表面上的激励电极以及由具有基本上等于石英板的热膨胀系数的材料制成的保持构件。 保持构件通过直接接合而不使用任何粘合剂连接到石英板。 由于石英板和保持构件的热膨胀系数相等，所以在接合区域中不产生热应力。 结果，几乎没有对石英板施加应力，并且可以提高频率 - 温度特性。 根据本发明的压电滤波器包括由石英，钽酸锂，铌酸锂或硼酸锂制成并具有振荡部分的振荡压电板; 压电板直接接合的玻璃板; 以及第一和第二振荡电极部件，其分别设置在所述振荡部分的相对面上，使得所述振荡电极部件中的至少一个被分成多个对置电极。

公开(公告)号：US5647932A

公开(公告)日：1997-07-15

申请号：US601539

申请日：1996-02-14

申请人： Yutaka Taguchi ,  Kazuo Eda ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura ,  Yoshihiro Tomita

发明人： Yutaka Taguchi ,  Kazuo Eda ,  Akihiro Kanaboshi ,  Tetsuyoshi Ogura ,  Yoshihiro Tomita

IPC分类号： H03H3/02 ,  H01L21/30 ,  H01L21/304 ,  H01L21/306

CPC分类号： H03H3/02 ,  Y10S148/012 ,  Y10S148/135

摘要： The following steps are performed when processing electronic components such as piezoelectric devices. At Step 1 inter-atom bond is created between a functional member such as a quartz crystal plate and a first substrate, and the functional member and the quartz crystal plate are directly joined together. At Step 2, the functional member and a second substrate are fixed together with an adhesive agent or by a direct bond. At Step 3, the first substrate is removed chemically or mechanically, with said functional member and said second substrate still being joined together. A step of polishing said functional member for the adjustment of thickness thereof may be done between Step 1 and Step 2. For example, a silicon dioxide thin film may be provided between the functional member and the first substrate. Since no adhesive layer exists between the functional member and the first substrate, this improves the degree of plane of the functional member when joined to the first substrate. Therefore, functional member thickness accuracy becomes extremely high and mass productivity is also improved.

摘要翻译： 在处理诸如压电装置的电子部件时执行以下步骤。 在步骤1中，在诸如石英晶体板的功能部件和第一基板之间产生原子间键合，并且功能部件和石英晶体板直接接合在一起。 在步骤2中，功能部件和第二基板通过粘合剂或直接粘合固定在一起。 在步骤3中，第一衬底被化学或机械地移除，所述功能构件和所述第二衬底仍然连接在一起。 可以在步骤1和步骤2之间进行用于调整其厚度的抛光所述功能部件的步骤。例如，可以在功能部件和第一基板之间设置二氧化硅薄膜。 由于在功能部件和第一基板之间不存在粘接层，因此能够提高与第一基板接合时的功能部件的平面度。 因此，功能元件厚度精度变得非常高，并且也提高了批量生产率。

公开(公告)号：US5847626A

公开(公告)日：1998-12-08

申请号：US655049

申请日：1996-05-29

申请人： Yutaka Taguchi ,  Kazuo Eda ,  Shun-ichi Seki ,  Keiji Onishi

发明人： Yutaka Taguchi ,  Kazuo Eda ,  Shun-ichi Seki ,  Keiji Onishi

IPC分类号： H03H9/00 ,  H03H9/64 ,  H03H9/52

CPC分类号： H03H9/0028

摘要： A balanced-type surface acoustic wave filter is provided which can attain a balanced-type of high frequency circuit without connecting a balance-unbalanced conversion circuit. A substrate of tantalic acid lithium substrate with 36 degrees rotation, Y cut, and X propagation is used, and aluminium is used for electrode to form resonators. Then, two resonators in a serial arm and two resonators in a parallel arm are connected in the form of symmetry and lattice to form a balanced-type surface acoustic wave filter. In this configuration, antiresonance frequency in the serial arms and resonance frequency in the parallel arms are substantially equal to each other.

摘要翻译： 提供一种平衡型表面声波滤波器，其可以在不连接平衡不平衡转换电路的情况下获得平衡型高频电路。 使用具有36度旋转，Y切割和X传播的钽酸锂衬底的衬底，并且使用铝用于电极以形成谐振器。 然后，串联臂中的两个谐振器和并联臂中的两个谐振器以对称和格子的形式连接以形成平衡型表面声波滤波器。 在这种结构中，串联臂中的反谐振频率和并联臂中的共振频率基本相等。

公开(公告)号：US5506552A

公开(公告)日：1996-04-09

申请号：US334673

申请日：1994-11-04

申请人： Shun-ichi Seki ,  Kazuo Eda ,  Yutaka Taguchi ,  Keiji Onishi

发明人： Shun-ichi Seki ,  Kazuo Eda ,  Yutaka Taguchi ,  Keiji Onishi

IPC分类号： H03H9/64

CPC分类号： H03H9/6483

摘要： In a surface acoustic wave (SAW) filter, on a 36.degree. Y-cut X-propagation lithium tantalate substrate, series branch SAW resonators, which are connected in series between an input terminal and an output terminal, and parallel branch SAW resonators, which are connected between respective pairs of the series branch resonators by wirings and which are grounded, are provided. Two series branch resonators and one parallel branch resonator are connected in a T shape, so as to form a fundamental unit. In the SAW filter, three fundamental units are serially connected. An interdigital transducer (IDT) included in each resonator is made of a metal film containing aluminum as the main component. The thickness of the metal film is in the range of 8% to 10% of the electrode pitch of the IDT of the parallel branch resonator.

摘要翻译： 在表面声波（SAW）滤波器中，在36°Y切割的X传播的钽酸锂衬底上串联连接在输入端子和输出端子之间的分支SAW谐振器以及并联支路SAW谐振器，其中 通过布线连接在各对串联支路谐振器之间并且被接地。 两个串联支路谐振器和一个并联支路谐振器以T形连接起来形成基本单元。 在SAW滤波器中，三个基本单元串联。 包含在每个谐振器中的叉指式换能器（IDT）由以铝为主要成分的金属膜制成。 金属膜的厚度在并联支路谐振器的IDT的电极间距的8％〜10％的范围内。

公开(公告)号：US5485052A

公开(公告)日：1996-01-16

申请号：US366390

申请日：1994-12-29

申请人： Shunichi Seki ,  Kazuo Eda ,  Yutaka Taguchi ,  Keiji Onishi

发明人： Shunichi Seki ,  Kazuo Eda ,  Yutaka Taguchi ,  Keiji Onishi

IPC分类号： H03H9/02 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64 ,  H01L41/08

CPC分类号： H03H9/02559 ,  H03H9/1455 ,  H03H9/6426

摘要： A three electrode type SAW longitudinal coupling filter includes a piezoelectric substrate having an electromechanical coupling factor (K.sup.2) higher than 10% and, three sets in total of input electrodes and output electrodes. Each of the electrodes includes a plurality of a electrode fingers of comb shape and are formed on the piezoelectric substrate. Reflectors are disposed at opposite sides of the input electrodes and output electrodes. The number of pairs of electrode fingers of the input electrodes is differentiated from the number of pairs of electrode fingers of the output electrodes. By the above arrangement, a large pass-band width can be obtained with small ripples and with an increase of the attenuation amount outside the band region.

摘要翻译： 三电极型SAW纵向耦合滤波器包括具有高于10％的机电耦合系数（K2）的压电基片，以及输入电极和输出电极总共三组。 每个电极包括多个梳形电极指并形成在压电基片上。 反射器设置在输入电极和输出电极的相对侧。 输入电极的电极指的对数与输出电极的电极指的数量不同。 通过上述布置，可以获得具有小波纹的大的通带宽度，并且在带区域外增加衰减量。

公开(公告)号：US6154940A

公开(公告)日：2000-12-05

申请号：US90489

申请日：1998-06-03

申请人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

发明人： Keiji Onishi ,  Hideki Iwaki ,  Shun-ichi Seki ,  Yutaka Taguchi ,  Tsukasa Shiraishi ,  Yoshihiro Bessho ,  Osamu Kawasaki ,  Kazuo Eda

IPC分类号： H03H3/08 ,  H03H9/10 ,  H04R17/00

CPC分类号： H03H9/0509 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1071 ,  H03H9/1085 ,  H03H9/1092 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/09701 ,  H01L2924/16152 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49146

摘要： The present invention relates to an electronic part used for mobile communications apparatuses and the like, and more particularly to an electronic part, such as an acoustic surface-wave device, a piezoelectric ceramic device or the like, which requires an oscillation space near the surface of the functional device chip thereof, and a method of production thereof. With this method, a space retainer for forming a sealed space at the functional portion of the chip can be hermetically sealed and have high moisture resistance, and the process of forming the space retainer can be carried out easily.The electronic part of the present invention comprises a functional device chip, a space retainer for forming a sealed space at the functional portion of the chip, a circuit substrate to which the chip is secured, electrode interconnection portions for establishing electric connection between the chip and the circuit substrate, and a sealing resin for covering and sealing at least the space retainer, wherein the space retainer comprises a support layer made of a synthetic resin film, provided with an opening enclosing the functional portion and joined onto the main surface, and a cover formed and joined onto the support layer so as to cover the functional portion and form a sealed space between the cover and the functional portion.

摘要翻译： 本发明涉及用于移动通信设备等的电子部件，更具体地涉及需要在表面附近的振荡空间的诸如声表面波器件，压电陶瓷器件等的电子部件 的功能元件芯片及其制造方法。 利用这种方法，在芯片的功能部分处形成密封空间的空间保持器可以被气密地密封并且具有高的耐湿性，并且可以容易地进行形成空间保持器的工艺。 本发明的电子部件包括功能元件芯片，用于在芯片的功能部分形成密封空间的空间保持器，固定有芯片的电路基板，用于建立芯片与芯片之间的电连接的电极互连部分 电路基板和用于至少覆盖和密封空间保持器的密封树脂，其中，所述空间保持器包括由合成树脂膜制成的支撑层，所述支撑层设置有封闭所述功能部分并且接合到所述主表面上的开口，以及 盖形成并接合到支撑层上以覆盖功能部分并在盖和功能部分之间形成密封空间。

公开(公告)号：US6107899A

公开(公告)日：2000-08-22

申请号：US955298

申请日：1997-10-21

申请人： Yutaka Taguchi ,  Kazuo Eda ,  Keiji Onishi ,  Shunichi Seki

发明人： Yutaka Taguchi ,  Kazuo Eda ,  Keiji Onishi ,  Shunichi Seki

IPC分类号： H03H9/05 ,  H03H9/10 ,  H03H9/64

CPC分类号： H03H9/1071 ,  H03H9/6436 ,  H03H9/6483

摘要： A high-frequency surface acoustic wave filter is such that a plurality of comb electrodes are formed on a piezoelectric substrate, and said high-frequency surface acoustic wave filter has:said piezoelectric substrate;an input terminal;an output terminal; andat least two ground terminals provided on said piezoelectric substrate,wherein said ground terminals are neither connected on said piezoelectric substrate nor connected in a package containing said piezoelectric substrate.

摘要翻译： 高频表面声波滤波器是在压电基板上形成多个梳状电极，所述高频声表面波滤波器具有：所述压电基板; 输入端; 输出端子; 以及设置在所述压电基板上的至少两个接地端子，其中所述接地端子既不连接在所述压电基板上，也不连接在包含所述压电基板的封装中。