公开(公告)号：USRE35109E

公开(公告)日：1995-12-05

申请号：US1613

申请日：1993-01-07

申请人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

发明人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L29/46 ,  H01L29/62 ,  H01L29/64

CPC分类号： H01L23/49537 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49589 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10S257/916

摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

摘要翻译： 在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出 并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

公开(公告)号：US4984059A

公开(公告)日：1991-01-08

申请号：US539781

申请日：1983-10-07

申请人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

发明人： Akihiro Kubota ,  Rikio Sugiura ,  Tsuyoshi Aoki ,  Michio Ono

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L23/49537 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49503 ,  H01L23/49589 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10S257/916

摘要： In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.

摘要翻译： 在内部引线与模制塑料体中的半导体芯片重叠的塑料模制半导体器件中，芯片的宽度可以接近塑料体的宽度，而不会使内部引线的高电阻降低到拉出 并且内引线的布局可以是不受限制的，因为内引线可能占据芯片上方的区域。

公开(公告)号：US4801997A

公开(公告)日：1989-01-31

申请号：US185301

申请日：1988-04-19

申请人： Michio Ono ,  Akihiro Kubota ,  Tsuyoshi Aoki ,  Osamu Inoue ,  Rikio Sugiura

发明人： Michio Ono ,  Akihiro Kubota ,  Tsuyoshi Aoki ,  Osamu Inoue ,  Rikio Sugiura

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L23/49541 ,  H01L2224/48091 ,  H01L2224/48247

摘要： Lead frame for mounting a semiconductor chip and improving the packing density of devices such as a plastic chip carrier type IC is disclosed. A portion of inner leads, located parallel to the chip stage and the edge of a molded case is made as thin as possible and held by inner lead supporting bars to tie bars until the molding process is finished. After molding process is finished, these bars supporting the leads and stage are cut away. Packing density is improved an amount ranging from 20% to 30%.

摘要翻译： 公开了用于安装半导体芯片的引线框架和提高诸如塑料芯片载体型IC的器件的封装密度。 将内引线的一部分平行于芯片台和模制外壳的边缘制成尽可能薄，并由内引线支撑杆固定到连杆上，直到模制过程完成。 成型工艺完成后，将这些支撑导线和平台的条子切掉。 包装密度提高了20％〜30％。

公开(公告)号：US4698660A

公开(公告)日：1987-10-06

申请号：US833535

申请日：1986-02-12

申请人： Akihiro Kubota ,  Tsuyoshi Aoki ,  Michio Ono ,  Rikio Sugiura

发明人： Akihiro Kubota ,  Tsuyoshi Aoki ,  Michio Ono ,  Rikio Sugiura

IPC分类号： H01L23/50 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K3/3426 ,  H01L23/3107 ,  H01L23/49555 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y02P70/613

摘要： A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.

摘要翻译： 树脂封装半导体封装器件包括多个槽，它们在由树脂模制封装的主体的主表面和侧表面限定的边缘部分中彼此隔开预定距离，该沟槽对应于 多个外部引线。 外部引线被折叠，外部引线的尖端位于槽中，并且外部引线的中间部分位于封装的主表面上方，使得在外部引线的中间部分之间保持预定的间隔距离 线索和包装。

公开(公告)号：US5929513A

公开(公告)日：1999-07-27

申请号：US886013

申请日：1997-06-30

申请人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

发明人： Yuichi Asano ,  Akihiro Kubota ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/28 ,  H01L23/10

CPC分类号： H01L23/4334 ,  H01L23/49548 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011

摘要： The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

摘要翻译： 本发明涉及一种半导体器件，其中引线框架的内部引线电连接到半导体芯片，其制造方法和其中使用的引线框架。 本发明的目的在于提高小型多针式半导体装置的引线框架的强度和散热效率。 在引线框架的内引线中形成薄板部分。 薄板部分固定在散热器上。 半导体芯片安装在散热器上。 半导体芯片通过导线结合到内引线的薄板部分。

公开(公告)号：US5834831A

公开(公告)日：1998-11-10

申请号：US609840

申请日：1996-03-01

申请人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

发明人： Akihiro Kubota ,  Yuichi Asano ,  Koichi Sibasaki ,  Kazuhiro Yonetake ,  Tsuyoshi Aoki ,  Akira Takashima

IPC分类号： H01L23/433 ,  H01L23/495 ,  H01L23/50

CPC分类号： H01L24/49 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L24/45 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011

摘要： A thin semiconductor device in which a strength of a lead frame and a heat dissipation efficiency can be improved. The semiconductor device has a semiconductor chip, a lead having an inner lead and an a outer lead continuing to the inner lead, said inner lead having a thin plate portion thinner than the other portion therof, said thin plate portion being electrically connected to said semiconductor chip through a wire and said outer lead serving as an outer connecting terminal, and a sealing resin sealing said semiconductor chip and at least a part of said lead, wherin said inner lead of said lead is positioned on said semiconductor chip.

摘要翻译： 可以提高引线框架的强度和散热效率的薄型半导体器件。 半导体器件具有半导体芯片，具有内引线和连接到内引线的外引线的引线，所述内引线具有比其它部分栅极更薄的薄板部分，所述薄板部分电连接到所述半导体 并且所述外引线用作外连接端子，密封树脂密封所述半导体芯片，并且所述引线的至少一部分，所述引线的所述内引线位于所述半导体芯片上。

公开(公告)号：US06771307B2

公开(公告)日：2004-08-03

申请号：US09797103

申请日：2001-03-01

申请人： Mitsuji Waki ,  Tadashi Nishio ,  Akihiro Kubota ,  Masaki Higurashi

发明人： Mitsuji Waki ,  Tadashi Nishio ,  Akihiro Kubota ,  Masaki Higurashi

IPC分类号： H04N1700

CPC分类号： H04N9/3147

摘要： In an image calibration device 10, a calibration pattern is projected onto a screen 4 from each projector 3 under control of a personal computer or other calibration device 10a, pictures are taken by a digital camera or other image pick-up device 11, and the results are supplied to the calibration device 10a. The calibration device 10a uses the supplied picture data to calculate parameters in order to perform picture positioning, color adjustment, brightness adjustment and other adjustments and corrections, and based on the calculation results transforms the original picture data, generates and supplies signals indicating projection conditions to each of the projectors 3, and performs image calibration control of the pictures projected by each projector 3. Here at the time of taking pictures, by installing on the image pick-up device 11 a shielding member 12 formed into a tetragonal pyramid shape, the light-receiving part of the image pick-up device 11 and the screen are completely shielded from ambient external light. By this means, the measurement precision of the image pick-up device 11 is improved, and accurate and reliable image calibration is performed.

摘要翻译： 在图像校准装置10中，在个人计算机或其他校准装置10a的控制下，将校准图案投影到来自每个投影仪3的屏幕4上，图像由数码相机或其他图像拾取装置11拍摄，并且 结果被提供给校准装置10a。 校准装置10a使用所提供的图像数据来计算参数以执行图像定位，颜色调整，亮度调整和其他调整和校正，并且基于计算结果，转换原始图像数据，生成并提供指示投影条件的信号 每个投影仪3，并且对每个投影仪3投射的图像执行图像校准控制。这里，在拍摄时，通过在摄像装置11上安装形成四边形棱锥形的遮光构件12， 图像拾取装置11的光接收部分和屏幕完​​全屏蔽环境外部光。 通过这种方式，提高了图像拾取装置11的测量精度，并且执行了精确和可靠的图像校准。

公开(公告)号：US06595819B1

公开(公告)日：2003-07-22

申请号：US09572426

申请日：2000-05-16

申请人： Toshihiro Kitahara ,  Hiroshi Hashi ,  Akihiro Kubota ,  Susumu Kobayashi ,  Hidetoshi Yamada

发明人： Toshihiro Kitahara ,  Hiroshi Hashi ,  Akihiro Kubota ,  Susumu Kobayashi ,  Hidetoshi Yamada

IPC分类号： H01J924

CPC分类号： H01J9/242 ,  B29C37/0053 ,  B29C41/006 ,  B29C41/20 ,  H01J2211/36

摘要： This invention provides equipment for fabricating partitioning ribs of a plasma display device. The equipment comprises a head, a driver, an X position sensor and a Y position sensor, a laser displacement sensor for detecting the distance of the head from a glass plate or substrate, a motor and a motor driver for moving the head relative to the glass plate, and a CPU for controlling various circuits. The head has nozzle members for ejecting partitioning rib grains by an electrostatic ejection method or ink jet technology to form partitioning ribs. The driver controls the volume of the partitioning rib grains ejected from the head. The X and Y position sensors detect the position of the head relative to the glass plate within a plane.

摘要翻译： 本发明提供了一种用于制造等离子体显示装置的分隔肋的设备。 该设备包括头部，驾驶员，X位置传感器和Y位置传感器，用于检测头部与玻璃板或衬底的距离的激光位移传感器，用于相对于头部移动头部的电动机和电动机驱动器 玻璃板和用于控制各种电路的CPU。 头部具有用于通过静电喷射方法或喷墨技术喷射分隔肋颗粒以形成分隔肋的喷嘴构件。 驱动器控制从头部排出的分隔肋颗粒的体积。 X和Y位置传感器检测头部相对于玻璃板在平面内的位置。

公开(公告)号：US20050219378A1

公开(公告)日：2005-10-06

申请号：US11089775

申请日：2005-03-25

申请人： Akihiro Kubota ,  Shinzo Matsui

发明人： Akihiro Kubota ,  Shinzo Matsui

IPC分类号： H04N5/232 ,  H04N5/228 ,  H04N7/01

CPC分类号： H04N7/0135 ,  H04N7/0105 ,  H04N7/0112

摘要： This imaging device includes an imaging element, a field rate conversion processing section, and a frame rate conversion processing section. The imaging element converts an image of a photoelectric subject photographically, and outputs a picture image signal which consists of frames at a first frame rate. The field rate conversion processing section converts the picture image signal at the first frame rate into a television signal at a second frame rate which is smaller than the first frame rate. The frame rate conversion processing section converts the picture image signal at the first frame rate into a cinema film signal at a third frame rate which is smaller than the first frame rate, and which is different from the second frame rate.

摘要翻译： 该成像装置包括成像元件，场速率转换处理部分和帧速率转换处理部分。 成像元件照相机转换光电对象的图像，并以第一帧速率输出由帧组成的图像信号。 场速转换处理部分以比第一帧速率低的第二帧速率将第一帧速率的图像信号转换成电视信号。 帧速率转换处理部分将第一帧速率的图像信号以比第一帧速率小的第三帧速率转换成电影胶片信号，并且与第二帧率不同。

公开(公告)号：US06856211B2

公开(公告)日：2005-02-15

申请号：US10441906

申请日：2003-05-20

申请人： Fumio Yamada ,  Toshiaki Kitamura ,  Hiroyuki Kobayashi ,  Koichi Rokuyama ,  Akihiro Kubota ,  Shigeru Kasai ,  Takashi Ogino ,  Yuki Osada

发明人： Fumio Yamada ,  Toshiaki Kitamura ,  Hiroyuki Kobayashi ,  Koichi Rokuyama ,  Akihiro Kubota ,  Shigeru Kasai ,  Takashi Ogino ,  Yuki Osada

IPC分类号： H01R13/646 ,  H03H7/38 ,  H01Q1/50

CPC分类号： H01R24/542 ,  H01R24/44 ,  H01R2103/00

摘要： A coaxial type impedance matching device includes a matching device body including an external conductor and an internal conductor arranged in the external conductor, an input side dielectric disposed in the matching device body and including a first dielectric and a second dielectric, and an output side dielectric disposed in the matching device body and including a third dielectric and a fourth dielectric. Distance between opposed surfaces of the first dielectric and the second dielectric is a predetermined distance, which is in a range of Nλ/4−λ/6 to Nλ/4−λ/6, where λ represents a guide wavelength of an input signal in the matching device body and N represents odd number. Distance between opposed surfaces of the third dielectric and the fourth dielectric is the predetermined distance.

摘要翻译： 同轴型阻抗匹配装置包括匹配装置主体，其包括外部导体和布置在外部导体中的内部导体，输入侧电介质设置在匹配装置主体中并且包括第一电介质和第二电介质，以及输出侧电介质 设置在匹配装置主体中并且包括第三电介质和第四电介质。 第一电介质和第二电介质的相对表面之间的距离为Nλ/ 4-λ/ 6至Nλ/ 4-λ/ 6的范围内的预定距离，其中λ表示输入信号的引导波长 匹配装置主体，N表示奇数。 第三电介质和第四电介质的相对表面之间的距离为预定距离。