摘要:
A semiconductor apparatus comprising a vertical type semiconductor device having a first conducting type semiconductor substrate, a drain layer formed on the surface of the semiconductor substrate, a drain electrode formed on the surface of the drain layer, a second conducting type base layer selectively formed on the surface of the semiconductor substrate opposite to the drain layer, a first conducting type source layer selectively formed on the surface of the second conducting type base layer, a source electrode formed on the first conducting type source layer and the second conducting type base layer, and a gate electrode formed in contact with the first conducting type source layer, the second conducting type base layer and the semiconductor substrate through a gate insulating film and a lateral semiconductor device having an insulating layer formed in a region of the surface of the semiconductor substrate different from the second conducting type base layer, and a polycrystalline semiconductor layer formed on the insulating layer and having a first conducting type region and a second conducting type region, wherein the first conducting type source layer of the vertical semiconductor device and the first conducting type region of the polycrystalline semiconductor layer are simultaneously formed.
摘要:
A sub-gate electrode is arranged to face, through a gate insulating film, a surface of a first p-type base layer which is interposed between a first n-type source layer and an n-type drift layer, and a surface of a second p-type base layer which is interposed between a second n-type source layer and the n-type drift layer and faces the first p-type base layer. A main gate electrode is arranged to face, through a gate insulating film, a surface of the second p-type base layer which is interposed between the second n-type source layer and the n-type drift layer and does not face the first p-type base layer. Three n-type MOSFETs are constructed such that one n-type channel is to be formed in the first p-type base layer and two n-type channels are to be formed in the second p-type base layer. The three channels are to be formed, so that the channel width is effectively enlarged and the current density is increased. The second p-type base layer has a length of 10 .mu.m or less in the drifting direction.
摘要:
A semiconductor device is disclosed having a thyristor region coupled to a semiconductor switching device and a semiconductor rectifier. During turn-off operation, holes are drained from the p-type base region of the thyristor region through the semiconductor rectifier and to the cathode of the thyristor. During turn-on, electrons are supplied to an n-type emitter region of the thyristor from the cathode electrode through the semiconductor switching device.
摘要:
A sub-gate electrode is arranged to face, through a gate insulating film, a surface of a first p-type base layer which is interposed between a first n-type source layer and an n-type drift layer, and a surface of a second p-type base layer which is interposed between a second n-type source layer and the n-type drift layer and faces the first p-type base layer. A main gate electrode is arranged to face, through a gate insulating film, a surface of the second p-type base layer which is interposed between the second n-type source layer and the n-type drift layer and does not face the first p-type base layer. Three n-type MOSFETs are constructed such that one n-type channel is to be formed in the first p-type base layer and two n-type channels are to be formed in the second p-type base layer. The three channels are to be formed, so that the channel width is effectively enlarged and the current density is increased. The second p-type base layer has a length of 10 .mu.m or less in the drifting direction.
摘要:
An n-type buffer layer and a p-type base layer are formed in the surface of the n.sup.- -type drift layer. A p.sup.+ -type drain layer is formed in the surface of the n-type buffer layer. An n.sup.+ -type source layer and a p.sup.+ -type contact layer are formed in the surface of the p-type base layer. A main gate electrode is arranged to face, through a gate oxide film, a surface of the p-type base layer which is interposed between the n.sup.+ -type source layer and the n.sup.- -type drift layer. An n-type relay layer is formed in the surface of the n.sup.- -type drift layer to face the n.sup.+ -type source layer through the p-type base layer under the main gate electrode. The n-type relay layer extends from the n.sup.- -type drift layer into the p-type base layer. The n-type relay layer decreases the channel resistance.
摘要:
A high breakdown voltage semiconductor device comprising a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.
摘要:
A high breakdown voltage semiconductor apparatus comprises a substrate having an insulating layer formed thereon, a high resistance semiconductor layer of a first conductivity type formed on said insulating layer, a base region of the first conductivity type formed selectively in a surface region of the high resistance semiconductor layer, a drift region of a second conductivity type formed selectively in the surface region of the high resistance semiconductor layer so as not to reach the insulating layer, a source region of the second conductivity type formed in the base region, a drain region formed in the drift region, a gate electrode formed on a region between the source region and the drift region, with a gate insulating film interposed between the gate electrode and the region between the source region and the drift region, a source electrode provided in contact with the base region and the source region, a drain electrode provided in contact with the drain region. The dosage of impurities in the high resistance semiconductor layer is 2.times.10.sup.12 cm.sup.-2 to 3.times.10.sup.12 cm.sup.-2 and the dosage of impurities in the drift layer is 1.times.10.sup.12 cm.sup.-2 to 2.times.10.sup.12 cm.sup.-2.
摘要翻译:一种高耐压电压半导体装置,包括:在其上形成有绝缘层的基板,形成在所述绝缘层上的第一导电类型的高电阻半导体层,所述第一导电类型的基极区选择性地形成在所述高电阻的表面区域中 半导体层,选择性地形成在高电阻半导体层的表面区域中以便不到达绝缘层的第二导电类型的漂移区域,形成在基极区域中的第二导电类型的源极区域,形成的漏极区域 在漂移区域中,形成在源极区域和漂移区域之间的区域上的栅电极,栅极绝缘膜插入在栅极电极和源极区域与漂移区域之间的区域中,源极电极与 所述基极区域和所述源极区域,设置成与所述漏极区域接触的漏极电极。 高电阻半导体层中的杂质用量为2×10 12 cm -2至3×10 12 cm -2,漂移层中的杂质用量为1×10 12 cm -2至2×10 12 cm -2。
摘要:
A high breakdown voltage semiconductor device comprising a first base region of a first conductivity type, a second base region of a second conductivity type, which is formed in a surface region of the first base region, a first gate insulation film formed on an inner wall of a first LOCOS groove formed passing through the second base region to reach the first base region, a first gate electrode formed on the first gate insulation film, a first source region of a first conductivity type, which is formed in a surface region of the second base region around the first LOCOS groove in such a manner as to contact with the first gate insulating film, a first drain region formed in a surface region of the first base region in such a manner as to be spaced apart from the second base region, a source electrode formed on the first source region and on the second base region, and a drain electrode formed on the first drain region.
摘要:
A high breakdown voltage semiconductor device includes a semiconductor substrate, an insulating layer formed on the semiconductor substrate, an active layer formed on the insulating layer and made of a high resistance semiconductor of a first conductivity type, a first impurity region of the first conductivity type formed in the active layer, and a second impurity region of a second conductivity type formed in the active layer and spaced apart from the first impurity region by a predetermined distance. The first impurity region is formed of diffusion layers. The diffusion layers are superimposed one upon another and differ in diffusion depth or diffusion window width, or both.
摘要:
A MOS field-effect transistor includes a semiconductor substrate of a first-conductivity type, a semiconductor layer of the first-conductivity type, a source region of a second-conductivity type, a first drain region of the second-conductivity type, a resurf layer of the second-conductivity type provided in the surface of the semiconductor layer between the source region and the first drain region in contact with the first drain region, and having a lower impurity concentration than the first drain region, a gate insulation film, and a gate electrode provided on the gate insulation film between the source region and resurf layer. A Schottky barrier diode includes a second drain region of the second-conductivity type provided in the surface of the semiconductor layer separate from the first drain region in a direction away from the gate electrode, and a Schottky electrode provided on the semiconductor layer between the first and second drain regions.