摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
A method of fabricating a semiconductor device which has a cell array with non-volatile memory transistors and a peripheral circuit including a first transistor and a second transistor as driven by a lower voltage than the first transistor is disclosed. The method includes the steps of forming over a semiconductor substrate a first gate dielectric film for use in the first transistor, selectively etching the first gate dielectric film in the cell array region to expose the substrate, forming over the exposed substrate a second gate dielectric film which is for use as a tunnel dielectric film of the memory transistors, forming a first gate electrode material film over the first and second gate dielectric films, selectively etching the first gate electrode material film and its underlying first gate dielectric film in the second transistor region, forming over the exposed substrate a third gate dielectric film which is for use in the second transistor, forming a second gate electrode material film over the third gate dielectric film, and forming gates of the respective transistors while letting the gates at least partly include the first and second gate electrode material films.
摘要:
A semiconductor device comprises: a semiconductor substrate; a plurality of first diffusion layers having a low impurity density, the first diffusion layers being formed on the surface of the semiconductor substrate; a plurality of second diffusion layers having a high impurity density, the second diffusion layers being formed on the surface of the semiconductor substrate; a plurality of first contacts, each of which contacts the first diffusion layers and each of which is formed of a semiconductor; and a plurality of second contacts, each of which contacts the second diffusion layers and each of which is formed of a metal.
摘要:
A semiconductor device comprises: a semiconductor substrate; a plurality of first diffusion layers having a low impurity density, the first diffusion layers being formed on the surface of the semiconductor substrate; a plurality of second diffusion layers having a high impurity density, the second diffusion layers being formed on the surface of the semiconductor substrate; a plurality of first contacts, each of which contacts the first diffusion layers and each of which is formed of a semiconductor; and a plurality of second contacts, each of which contacts the second diffusion layers and each of which is formed of a metal.
摘要:
A trench isolation region is formed in a surface region of a semiconductor substrate to form a MOS type element region. A mask layer having an opening portion is formed on the semiconductor layer, the opening portion continuously ranging on the entire surface of the MOS type element region and on part of the trench isolation region provided around the MOS type element region. A first impurity ion is implanted into the entire surface via the mask layer to form a peak of the impurity profile is situated in the semiconductor layer under the bottom surface of the shallow trench isolation region. A second impurity ion is implanted into the entire surface via the mask layer to form a peak of the impurity profile is situated on the midway of the depth direction of the trench isolation region. Then, the first and second impurity ions are activated.
摘要:
A first well of the same conductivity type as that of a semiconductor substrate and a second well of a conductivity type opposite to that of the semiconductor substrate, are formed in the semiconductor substrate. The second well isolates the semiconductor substrate and the first well from each other. Phosphorus ions for forming the bottom of the second well are implanted into the semiconductor substrate more deeply than boron ions for forming the first well. The depths to which these ions are implanted can be varied by acceleration energy of the ions. If the ions are so implanted, the total sum of impurities constituting the second well can be decreased within the surface area of the first well.
摘要:
A differential amplifier comprises an n-channel MOS transistor to the gate of which an input voltage VIN1 is fed, and an n-channel MOS transistor to the gate of which an input voltage VIN2 is fed. A p-channel MOS transistor arranged in such a manner that, to the source thereof, a power source voltage Vcc is fed, and the gate and drain thereof are connected to the drain of the MOS transistor, and a p-channel MOS transistor arranged in such a manner that the gate thereof is connected to the drain of the MOS transistor, the drain thereof is connected to the drain of the MOS transistor, and the voltage at this drain is outputted as an output voltage VOUT, and the output current I of a constant-current source is set so that the transistors constituting a differential amplifier may operate in a weak inversion zone.
摘要:
A semiconductor device includes a semiconductor substrate, an element isolation insulating film dividing an upper portion of the substrate into a plurality of first active regions, a source layer and a drain layer, a gate electrode, a gate insulating film, a first punch-through stopper layer, and a second punch-through stopper layer. The source layer and the drain layer are formed in spaced to each other in an upper portion of each of the first active regions. The first punch-through stopper layer is formed in a region of the first active region directly below the source layer and the second punch-through stopper layer is formed in a region of the first active region directly below the drain layer. The first punch-through stopper layer and the second punch-through stopper layer each has an effective impurity concentration higher than the semiconductor substrate. The first punch-through stopper layer and the source layer are separated in the channel region. The second punch-through stopper layer and the drain layer are separated in the channel region.