摘要:
In a bit line contact section, a contact hole is formed through a silicon oxide film, and a contact plug made of a polysilicon film doped with impurities is buried in the contact hole. The silicon oxide film is formed with a wiring groove overlapping the contact hole. A bit line made of a metal film is buried in the wiring groove. The contact plug extends through the bit line, and has its upper surface substantially coplanar with an upper surface of the bit line. The contact plug is in contact with the bit line only on its side surfaces.
摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
A method for manufacturing a nonvolatile semiconductor memory device having a step of forming a first gate electrode on a peripheral circuit portion and a second gate electrode on a memory cell portion, a step of introducing impurity into the peripheral circuit portion and memory cell portion, a step of forming a first insulating film above at least the memory cell portion, and a step of annealing the semiconductor substrate into which the impurity has been introduced. The first gate electrode has a first gate length. The second gate electrode has a second gate length shorter than the first gate length.
摘要:
A nonvolatile semiconductor memory device includes comprises: an element isolation region being in contact with a first element region, an insulating film covering a memory cell, a peripheral transistor and the element isolation region, an inter-level insulating film provided on the surface of the insulating film, and a contact hole provided in the inter-level insulating film and the insulating film. The inter-level insulating film contains an insulator different from the insulating film. The contact hole reaches at least one of source and drain diffusion layers of the memory cell and overlaps the element isolation region. The insulating film contains an insulator different from the element isolation region and the insulating film is harder for an oxidizing agent to pass therethrough than a silicon oxide film. A surface of the insulating film is oxidized.
摘要:
A nonvolatile semiconductor memory device includes memory cell transistors, peripheral transistors, first post-oxidation films provided on the gate electrode of all of the memory cell transistors, second post-oxidation films provided on the gate electrode of all of the peripheral transistors, first insulating films provided on the first post-oxidation films and covering a side surface of the gate electrode of all of the memory cell transistors and second insulating films provided on the second post-oxidation films and covering a side surface of the gate electrode of all of the peripheral transistors. The first and second insulating films are harder for an oxidizing agent to pass therethrough than a silicon oxide film, and the first and second insulating films are oxidized.
摘要:
A method for manufacturing a nonvolatile semiconductor memory device having a step of forming a first gate electrode on a peripheral circuit portion and a second gate electrode on a memory cell portion, a step of introducing impurity into the peripheral circuit portion and memory cell portion, a step of forming a first insulating film above at least the memory cell portion, and a step of annealing the semiconductor substrate into which the impurity has been introduced. The first gate electrode has a first gate length. The second gate electrode has a second gate length shorter than the first gate length.
摘要:
A nonvolatile semiconductor memory device includes erasable and programmable memory cell transistors, a selection transistor, a peripheral transistor, first post-oxidation films each provided on a gate electrode of all of the plurality of erasable and programmable memory cell transistors, a second post-oxidation film provided on a gate electrode of the selection transistor, a third post-oxidation film provided on a gate electrode of the peripheral transistor, and an insulating film covering the memory cell transistors, the selection transistor, and the peripheral transistor. The insulating film is harder for an oxidizing agent to pass through than a silicon oxide film. The insulating film has an oxidized region. The insulating film includes a silicon nitride film. The oxidized region is provided in a surface of the silicon nitride film.
摘要:
A semiconductor device exhibits a stable driving force and high performance reliability. The semiconductor device has at least one transistor having a gate insulating film formed on a element region in a semiconductor substrate, a gate electrode formed on the gate insulating film, and a diffused layer in element regions on both sides of the gate electrode. The device also has a barrier insulating film formed so as to cover the transistor and the diffused layer. The height from a surface of the semiconductor substrate to the barrier insulating film is greater than the height from the surface, of the interface between the gate insulating film and the gate electrode.
摘要:
One or more embodiments of the present disclosure provide methods, devices, and systems for operating non-volatile multilevel memory cells. One method embodiment includes programming a memory cell to one of a number of different threshold voltage (Vt) levels, each level corresponding to a program state. The method includes programming a reference cell to a Vt level at least as great as an uppermost Vt level of the number of different Vt levels, performing a read operation on the reference cell, and determining a number of read reference voltages used to determine a particular program state of the memory cell based on the read operation performed on the reference cell.