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公开(公告)号:US09653620B2
公开(公告)日:2017-05-16
申请号:US14932538
申请日:2015-11-04
申请人: Alexander Dietrich Hölke , Deb Kumar Pal , Kia Yaw Kee , Yang Hao
发明人: Alexander Dietrich Hölke , Deb Kumar Pal , Kia Yaw Kee , Yang Hao
IPC分类号: H01L29/868 , H01L29/40 , H01L29/861
CPC分类号: H01L29/868 , H01L29/405 , H01L29/407 , H01L29/8611
摘要: A semiconductor device including a p or p+ doped portion and an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion. The device further includes an insulating portion provided adjacent the drift portion and at least one of the doped portions in a region where the drift portion and the at least one doped portion meet. The device further includes at least one additional portion, wherein the at least one additional portion is located such that, when the doped portions and the at least one additional portion are biased, the electrical potential lines leave the semiconductor drift portion homogeneously.
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公开(公告)号:US09202937B2
公开(公告)日:2015-12-01
申请号:US13321960
申请日:2010-05-14
申请人: Alexander Dietrich Hölke , Deb Kumar Pal , Kia Yaw Kee , Hao Yang
发明人: Alexander Dietrich Hölke , Deb Kumar Pal , Kia Yaw Kee , Hao Yang
IPC分类号: H01L29/861 , H01L29/40
CPC分类号: H01L29/868 , H01L29/405 , H01L29/407 , H01L29/8611
摘要: A semiconductor device comprising: a p or p+ doped portion; an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion; an insulating portion provided adjacent the drift portion and at least one of the doped portions in a region where the drift portion and said at least one doped portion meet; and at least one additional portion which is arranged for significantly reducing the variation of the electric field strength in said region when a voltage difference is applied between the doped portions.
摘要翻译: 一种半导体器件,包括:p或p +掺杂部分; 通过半导体漂移部分从p或p +掺杂部分分离的n或n +掺杂部分; 在所述漂移部分和所述至少一个掺杂部分相遇的区域中邻近所述漂移部分设置的绝缘部分和所述掺杂部分中的至少一个; 以及至少一个附加部分,其被设置为当在掺杂部分之间施加电压差时,显着地减小所述区域中的电场强度的变化。
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公开(公告)号:US08970016B2
公开(公告)日:2015-03-03
申请号:US13486614
申请日:2012-06-01
申请人: Marina Antoniou , Florin Udrea , Elizabeth Kho Ching Tee , Steven John Pilkington , Deb Kumar Pal , Alexander Dietrich Hölke
发明人: Marina Antoniou , Florin Udrea , Elizabeth Kho Ching Tee , Steven John Pilkington , Deb Kumar Pal , Alexander Dietrich Hölke
IPC分类号: H01L29/02
CPC分类号: H01L29/402 , H01L21/761 , H01L29/0634 , H01L29/0692 , H01L29/404 , H01L29/7823 , H01L29/861
摘要: A semiconductor device including a p or p+ doped portion and an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion. The device further includes at least one termination portion provided adjacent to the drift portion. The at least one termination portion comprises a Super Junction structure.
摘要翻译: 一种包括p或p +掺杂部分和通过半导体漂移部分从p或p +掺杂部分分离的n或n +掺杂部分的半导体器件。 该装置还包括邻近漂移部分设置的至少一个终端部分。 所述至少一个终端部分包括超结结构。
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公开(公告)号:US20130093015A1
公开(公告)日:2013-04-18
申请号:US13581769
申请日:2010-03-01
CPC分类号: H01L29/7816 , H01L21/26506 , H01L29/165 , H01L29/66659 , H01L29/66681 , H01L29/7835 , H01L29/7848
摘要: A high voltage metal oxide semiconductor (HVMOS) transistor (1) comprises a drift region (8) comprising a material having a mobility which is higher than a mobility of Si. There is also provided a method of manufacturing said transistor, the method comprising forming a drift region comprising a material having a mobility which is higher than a mobility of Silicon. The material can be a Si—Ge strained material. The on- resistance is reduced compared to a transistor with a drift region made of Si, so that the trade-off between breakdown voltage and on-resistance is improved.
摘要翻译: 高电压金属氧化物半导体(HVMOS)晶体管(1)包括漂移区(8),其包括迁移率高于Si迁移率的材料。 还提供了一种制造所述晶体管的方法,所述方法包括形成漂移区,其包括具有高于硅的迁移率的迁移率的材料。 该材料可以是Si-Ge应变材料。 与具有由Si制成的漂移区域的晶体管相比,导通电阻降低,从而提高了击穿电压和导通电阻之间的折衷。
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公开(公告)号:US20130320511A1
公开(公告)日:2013-12-05
申请号:US13486614
申请日:2012-06-01
申请人: Elizabeth Kho Ching Tee , Alexander Dietrich Hölke , Steven John Pilkington , Deb Kumar Pal , Marina Antoniou , Florin Udrea
发明人: Elizabeth Kho Ching Tee , Alexander Dietrich Hölke , Steven John Pilkington , Deb Kumar Pal , Marina Antoniou , Florin Udrea
IPC分类号: H01L29/02
CPC分类号: H01L29/402 , H01L21/761 , H01L29/0634 , H01L29/0692 , H01L29/404 , H01L29/7823 , H01L29/861
摘要: A semiconductor device including a p or p+ doped portion and an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion. The device further includes at least one termination portion provided adjacent to the drift portion. The at least one termination portion comprises a Super Junction structure.
摘要翻译: 一种包括p或p +掺杂部分和通过半导体漂移部分从p或p +掺杂部分分离的n或n +掺杂部分的半导体器件。 该装置还包括邻近漂移部分设置的至少一个终端部分。 所述至少一个终端部分包括超结结构。
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公开(公告)号:US20130320485A1
公开(公告)日:2013-12-05
申请号:US13483569
申请日:2012-05-30
IPC分类号: H01L29/06
CPC分类号: H01L29/861 , H01L21/76283 , H01L27/1203 , H01L29/0634 , H01L29/0653 , H01L29/7317 , H01L29/7322 , H01L29/7394 , H01L29/7824 , H01L29/7833
摘要: An SOI or PSOI device including a device structure having a plurality of doped semiconductor regions. One or more of the doped semiconductor regions is in electrical communication with one or more electrical terminals. The device further includes an insulator layer located between a bottom surface of the device structure and a handle wafer. The device has an insulator trench structure located between a side surface of the device structure and a lateral semiconductor region located laterally with respect to the device structure. The insulator layer and the insulator trench structure are configured to insulate the device structure from the handle wafer and the lateral semiconductor region, and the insulator trench structure includes a plurality of insulator trenches.
摘要翻译: 包括具有多个掺杂半导体区域的器件结构的SOI或PSOI器件。 一个或多个掺杂半导体区域与一个或多个电端子电连通。 该器件还包括位于器件结构的底表面和处理晶片之间的绝缘体层。 该器件具有位于器件结构的侧表面和相对于器件结构横向定位的侧向半导体区域之间的绝缘体沟槽结构。 绝缘体层和绝缘体沟槽结构被配置为使器件结构与处理晶片和横向半导体区域绝缘,并且绝缘体沟槽结构包括多个绝缘体沟槽。
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