Semiconductor device
    2.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US09202937B2

    公开(公告)日:2015-12-01

    申请号:US13321960

    申请日:2010-05-14

    IPC分类号: H01L29/861 H01L29/40

    摘要: A semiconductor device comprising: a p or p+ doped portion; an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion; an insulating portion provided adjacent the drift portion and at least one of the doped portions in a region where the drift portion and said at least one doped portion meet; and at least one additional portion which is arranged for significantly reducing the variation of the electric field strength in said region when a voltage difference is applied between the doped portions.

    摘要翻译: 一种半导体器件,包括:p或p +掺杂部分; 通过半导体漂移部分从p或p +掺杂部分分离的n或n +掺杂部分; 在所述漂移部分和所述至少一个掺杂部分相遇的区域中邻近所述漂移部分设置的绝缘部分和所述掺杂部分中的至少一个; 以及至少一个附加部分,其被设置为当在掺杂部分之间施加电压差时,显着地减小所述区域中的电场强度的变化。

    HIGH VOLTAGE MOS TRANSISTOR
    4.
    发明申请
    HIGH VOLTAGE MOS TRANSISTOR 审中-公开
    高压MOS晶体管

    公开(公告)号:US20130093015A1

    公开(公告)日:2013-04-18

    申请号:US13581769

    申请日:2010-03-01

    IPC分类号: H01L29/78 H01L29/66

    摘要: A high voltage metal oxide semiconductor (HVMOS) transistor (1) comprises a drift region (8) comprising a material having a mobility which is higher than a mobility of Si. There is also provided a method of manufacturing said transistor, the method comprising forming a drift region comprising a material having a mobility which is higher than a mobility of Silicon. The material can be a Si—Ge strained material. The on- resistance is reduced compared to a transistor with a drift region made of Si, so that the trade-off between breakdown voltage and on-resistance is improved.

    摘要翻译: 高电压金属氧化物半导体(HVMOS)晶体管(1)包括漂移区(8),其包括迁移率高于Si迁移率的材料。 还提供了一种制造所述晶体管的方法,所述方法包括形成漂移区,其包括具有高于硅的迁移率的迁移率的材料。 该材料可以是Si-Ge应变材料。 与具有由Si制成的漂移区域的晶体管相比,导通电阻降低,从而提高了击穿电压和导通电阻之间的折衷。

    SEMICONDUCTOR DEVICE
    6.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号:US20130320485A1

    公开(公告)日:2013-12-05

    申请号:US13483569

    申请日:2012-05-30

    IPC分类号: H01L29/06

    摘要: An SOI or PSOI device including a device structure having a plurality of doped semiconductor regions. One or more of the doped semiconductor regions is in electrical communication with one or more electrical terminals. The device further includes an insulator layer located between a bottom surface of the device structure and a handle wafer. The device has an insulator trench structure located between a side surface of the device structure and a lateral semiconductor region located laterally with respect to the device structure. The insulator layer and the insulator trench structure are configured to insulate the device structure from the handle wafer and the lateral semiconductor region, and the insulator trench structure includes a plurality of insulator trenches.

    摘要翻译: 包括具有多个掺杂半导体区域的器件结构的SOI或PSOI器件。 一个或多个掺杂半导体区域与一个或多个电端子电连通。 该器件还包括位于器件结构的底表面和处理晶片之间的绝缘体层。 该器件具有位于器件结构的侧表面和相对于器件结构横向定位的侧向半导体区域之间的绝缘体沟槽结构。 绝缘体层和绝缘体沟槽结构被配置为使器件结构与处理晶片和横向半导体区域绝缘​​,并且绝缘体沟槽结构包括多个绝缘体沟槽。