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公开(公告)号：US08772083B2
公开(公告)日：2014-07-08
申请号：US13229687
申请日：2011-09-10
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3142 , H01L23/49894 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81401 , H01L2224/81815 , H01L2224/83104 , H01L2224/83385 , H01L2224/83862 , H01L2224/92125 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2924/0665 , H01L2224/05552
摘要： Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.
摘要翻译： 公开了用于接收半导体芯片的各种基板或电路板及其处理方法。 一方面，提供了一种制造方法，其包括在位于基板的侧面上的焊料掩模中形成第一开口。 第一个开口不延伸到一边。 在向侧面延伸的焊料掩模中形成第二开口。 第一个开口可以作为底部填充锚点。
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公开(公告)号：US20130062786A1
公开(公告)日：2013-03-14
申请号：US13229687
申请日：2011-09-10
申请人： Andrew KW Leung , Roden R. Topacio , Yu-Ling Hsieh , Yip Seng Low
发明人： Andrew KW Leung , Roden R. Topacio , Yu-Ling Hsieh , Yip Seng Low
CPC分类号： H01L23/49811 , H01L21/563 , H01L23/3142 , H01L23/49894 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/13022 , H01L2224/131 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81401 , H01L2224/81815 , H01L2224/83104 , H01L2224/83385 , H01L2224/83862 , H01L2224/92125 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2224/16225 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2924/0665 , H01L2224/05552
摘要： Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend to the side. A second opening is formed in the solder mask that extends to the side. The first opening may serve as an underfill anchor site.
摘要翻译： 公开了用于接收半导体芯片的各种基板或电路板及其处理方法。 一方面，提供了一种制造方法，其包括在位于基板的侧面上的焊料掩模中形成第一开口。 第一个开口不延伸到一边。 在向侧面延伸的焊料掩模中形成第二开口。 第一个开口可以作为底部填充锚点。
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公开(公告)号：US20110299259A1
公开(公告)日：2011-12-08
申请号：US12794535
申请日：2010-06-04
申请人： Yu-Ling Hsieh , I-Tseng Lee , Yi-Hsiu Liu , Jen-Yi Tsai , Cheng-hua Fan
发明人： Yu-Ling Hsieh , I-Tseng Lee , Yi-Hsiu Liu , Jen-Yi Tsai , Cheng-hua Fan
CPC分类号： H05K3/4007 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H05K3/108 , H05K3/287 , H05K2203/0508 , H05K2203/0574 , H05K2203/1476 , H01L2924/00
摘要： Various circuit board interconnect conductor structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is disclosed that includes forming a conductor post on a side of a circuit board. The conductor post includes an end projecting away from the side of the circuit board. A solder mask is applied to the side of the circuit board to cover the conductor post. A thickness of the solder mask is reduced so that a portion of the conductor post projects beyond the solder mask.
摘要翻译： 公开了各种电路板互连导体结构及其制造方法。 一方面，公开了一种制造方法，其包括在电路板的一侧形成导体柱。 导体柱包括从电路板的侧面突出的端部。 在电路板的一侧施加焊接掩模以覆盖导体柱。 焊接掩模的厚度减小，使得导体柱的一部分突出超过焊接掩模。
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