-
公开(公告)号：US5507872A
公开(公告)日：1996-04-16
申请号：US343151
申请日：1994-11-22
申请人： Annette B. Antenucci , Michael Berger , Judy E. Lambert , David T. Naugle , Stephen A. Olson , Jae M. Park , Thomas Rednour , Benoit Ventimiglia , Richard J. Weckesser
发明人： Annette B. Antenucci , Michael Berger , Judy E. Lambert , David T. Naugle , Stephen A. Olson , Jae M. Park , Thomas Rednour , Benoit Ventimiglia , Richard J. Weckesser
CPC分类号： B05C11/1034 , Y10T156/1798
摘要： A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.
摘要翻译： 一种基于接触的微型分配工具，用于将高分辨环氧树脂材料的小球提供给高电压密度模块上的修复位置。 该工具包括整体地安装在包含线性电压差分换能器的空气悬浮芯的接触传感器组件中的固体探头。 悬浮的芯和与其连接的探针通过空气轴承组件支撑在中性平衡中。 当组装探针与其中一个部位接触时，球体流过现场，平衡受到干扰，传感器产生信号，以阻止探针相对于部位的移动。
-
公开(公告)号：US20090309219A1
公开(公告)日：2009-12-17
申请号：US12543811
申请日：2009-08-19
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
-
公开(公告)号：US07955966B2
公开(公告)日：2011-06-07
申请号：US12543811
申请日：2009-08-19
IPC分类号： H01L23/498
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
-
公开(公告)号：US20080164609A1
公开(公告)日：2008-07-10
申请号：US11620900
申请日：2007-01-08
IPC分类号： H01L21/768 , H01L23/492
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
-
-
-
搜索结果
4 条记录 (耗时 0.036 秒)
