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公开(公告)号：US07955966B2
公开(公告)日：2011-06-07
申请号：US12543811
申请日：2009-08-19
IPC分类号： H01L23/498
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
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公开(公告)号：US20080164609A1
公开(公告)日：2008-07-10
申请号：US11620900
申请日：2007-01-08
IPC分类号： H01L21/768 , H01L23/492
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
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公开(公告)号：US20090309219A1
公开(公告)日：2009-12-17
申请号：US12543811
申请日：2009-08-19
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/29111 , H01L2224/29116 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H05K3/3457 , H05K2203/0113 , H05K2203/0338 , H01L2924/01083 , H01L2924/00 , H01L2224/05099 , H01L2924/013
摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.
摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。
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4.发明授权公开(公告)号：US08828860B2
公开(公告)日：2014-09-09
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.
摘要翻译： 采用多次注入熔融焊料来形成双层焊料凸点，其外层在比其内部部分更低的温度下熔化。 在倒装芯片组装过程中，回流温度高于外层的熔化温度并低于焊料凸块的内部部分的熔化温度。 由于焊料凸块的内部在回流期间不会塌陷，所以可以在相对低的温度下制造倒装芯片组件并具有高的间隔高度。 具有双重焊料凸块的结构有助于倒装芯片组装。
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公开(公告)号：US20140065771A1
公开(公告)日：2014-03-06
申请号：US13600204
申请日：2012-08-30
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/60
CPC分类号： H05K3/3436 , B23K1/0016 , B23K3/0638 , H01L21/4853 , H01L21/563 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/11011 , H01L2224/13076 , H01L2224/131 , H01L2224/13147 , H01L2224/16113 , H01L2224/16238 , H01L2224/73204 , H01L2224/81065 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01083 , H01L2924/14 , H01L2924/20104 , H01L2924/20106 , H01L2924/20107 , H01L2924/35 , H05K3/3494 , H05K13/0465 , H05K2203/043 , H01L2924/00014 , H01L2924/014
摘要： Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.
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6.发明授权公开(公告)号：US08381962B2
公开(公告)日：2013-02-26
申请号：US13025419
申请日：2011-02-11
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。
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公开(公告)号：US08376207B2
公开(公告)日：2013-02-19
申请号：US13367466
申请日：2012-02-07
CPC分类号： B23K3/0638 , B23K3/08 , B23K2101/42 , H01L21/4853 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K1/111 , H05K3/3457 , H05K2201/09472 , H05K2203/0126 , Y10T29/49826 , Y10T156/1062 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
摘要翻译： 柔性材料的一部分包括限定槽的四个壁。 狭槽具有与焊料储存器流体连通的相对较大的横截面端，并且还具有与相对大的横截面端相对的相对较小的横截面端。 当在平面中观察时，狭槽具有大致细长的矩形形状，其垂直于扫描方向的长度，与扫描方向平行的宽度，与相对大的横截面端相关联，并且平行于扫描方向的宽度， 与相对较小的截面端相关联。 狭槽配置在柔性材料的部分中，使得狭槽的相对小的横截面端部通常保持基本上闭合，但是当处于流体压力下并且局部地不被工件支撑时，局部开口足够地从储存器分配焊料。 还公开了操作和制造方法。
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公开(公告)号：US20120234902A1
公开(公告)日：2012-09-20
申请号：US13487378
申请日：2012-06-04
CPC分类号： B23K1/0016 , B23K3/0638 , B23K2101/40
摘要： A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.
摘要翻译： 在至少一个基板中的每一个中形成多个贯通基板孔。 每个贯穿基板孔从至少一个基板的顶表面延伸到至少一个基板的底表面。 至少一个基板由固定卡盘或旋转卡盘保持。 通过安装在至少一个基板的底面上的真空歧管，将多个通孔基板孔内的一组贯通基板孔提供真空抽吸。 位于至少一个衬底的顶表面上方的注射模具焊头将焊料材料注入到一组通孔衬底孔中，以形成从顶表面延伸到底表面的多个通孔衬底焊料 至少一个底物。 真空吸力防止在多个贯通基板孔中形成气泡或不完全填充。
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公开(公告)号：US20120138769A1
公开(公告)日：2012-06-07
申请号：US13371840
申请日：2012-02-13
申请人： Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel
发明人： Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel
IPC分类号： B22C9/22
CPC分类号： B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/16225 , H01L2924/00013 , H01L2924/01019 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2224/29099 , H01L2924/00
摘要： Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.
摘要翻译： 通过执行几个步骤在晶片的附接点上形成互连。 在半导体衬底中形成具有预定形状的多个空腔。 然后用互连材料填充这些空腔以形成互连。 互连随后连接到晶片的附接点。
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10.发明申请Direct IMS (Injection Molded Solder) Without a Mask for Forming Solder Bumps on Substrates 有权直接IMS（注塑成型焊料），不需要在基片上形成焊料的掩模公开(公告)号：US20110201194A1
公开(公告)日：2011-08-18
申请号：US12706212
申请日：2010-02-16
申请人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
发明人： Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
IPC分类号： H01L21/3205
CPC分类号： H05K3/3452 , H01L21/4853 , H01L23/3157 , H01L23/49811 , H01L23/49816 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05647 , H01L2224/10145 , H01L2224/1131 , H01L2224/11472 , H01L2224/1148 , H01L2224/11849 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/1403 , H01L2224/742 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K3/3468 , H05K2201/09036 , H05K2201/09827 , H05K2201/09845 , H05K2203/0126 , H05K2203/043 , H05K2203/0557 , H05K2203/0594 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.
摘要翻译： 获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。 至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。 将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积填充有焊料。 使焊料固化。 它形成粘附到湿润垫的多个焊料结构。 在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。 配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。 在替代方法中，焊料注入和凝固在氮气环境或形成气体环境中进行，并且可以省略回流步骤。
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