公开(公告)号：US5834645A

公开(公告)日：1998-11-10

申请号：US889999

申请日：1997-07-10

申请人： Anthony Bartels ,  Bob Allen ,  Chris Karlsrud ,  Joe Mosca

发明人： Anthony Bartels ,  Bob Allen ,  Chris Karlsrud ,  Joe Mosca

IPC分类号： B24B37/04 ,  B24B49/04 ,  G01B5/28

CPC分类号： B24B37/0053 ,  B24B37/04 ,  B24B49/04

摘要： An apparatus for detecting the presence of extraneous material on a polishing pad during a chemical mechanical planarization (CMP) process uses a contact probe assembly. The contact probe assembly interrogates the surface of the polishing pad during processing of a workpiece and generates a control signal indicating the presence of extraneous material when the displacement of a contact stylus exceeds a threshold amount. The contact probe assembly produces a control signal in response to the detection of extraneous material and the control signal causes the CMP system to react in an appropriate manner to reduce damage to the workpieces being processed.

摘要翻译： 用于在化学机械平坦化（CMP）处理过程中用于检测在抛光垫上存在外来物质的装置使用接触探针组件。 接触探针组件在处理工件期间询问抛光垫的表面，并且当触针的位移超过阈值时，产生指示外来材料的存在的控制信号。 接触探针组件响应于外部材料的检测而产生控制信号，并且控制信号使得CMP系统以适当的方式反应以减少对被处理的工件的损坏。

公开(公告)号：US06309279B1

公开(公告)日：2001-10-30

申请号：US09253438

申请日：1999-02-19

申请人： Mike L. Bowman ,  Gene Hempel ,  Chris Karlsrud ,  Franklin D. Root

发明人： Mike L. Bowman ,  Gene Hempel ,  Chris Karlsrud ,  Franklin D. Root

IPC分类号： B24B100

CPC分类号： H01L21/67219 ,  B24B37/345 ,  B24B41/005 ,  H01L21/68707

摘要： Wafer polishing systems include a series of polish modules alongside a neighboring series of secondary modules. A conveyor travels along the series of polish modules and the series of secondary modules. When a polishing operation is completed, the wafers are transferred to a series of near-by storage modules. The polish modules include a pair of traveling wafer gantries, each of which delivers a wafer to a polishing surface, applying the necessary force to complete polishing of the wafer surface.

摘要翻译： 晶圆抛光系统包括一系列抛光模块以及相邻的次级模块系列。 输送机沿着一系列抛光模块和一系列次模块行进。 当抛光操作完成时，晶片被转移到一系列靠近的存储模块。 抛光模块包括一对行进的晶片台架，每个行进的晶片台架将晶片递送到抛光表面，施加必要的力以完成晶片表面的抛光。

公开(公告)号：US06227946B1

公开(公告)日：2001-05-08

申请号：US09518157

申请日：2000-03-02

申请人： Jose R. Gonzalez-Martin ,  Chris Karlsrud

发明人： Jose R. Gonzalez-Martin ,  Chris Karlsrud

IPC分类号： B24B100

CPC分类号： H01L21/02052 ,  B24B37/04 ,  B24B41/005

摘要： An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

摘要翻译： 用于抛光，清洁，漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片，将晶片移动到用于抛光的抛光台，并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站，漂洗站和旋转干燥站，以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

公开(公告)号：US06350177B1

公开(公告)日：2002-02-26

申请号：US09573621

申请日：2000-05-17

申请人： Jose R. Gonzalez-Martin ,  Chris Karlsrud ,  Robert Allen ,  Toby Jordan ,  Craig Howard ,  Arthur Hamer ,  Jeff Cunnane ,  Periya Gopalan ,  Bill Thornton ,  Jon MacErnie ,  Fernando Calderon

发明人： Jose R. Gonzalez-Martin ,  Chris Karlsrud ,  Robert Allen ,  Toby Jordan ,  Craig Howard ,  Arthur Hamer ,  Jeff Cunnane ,  Periya Gopalan ,  Bill Thornton ,  Jon MacErnie ,  Fernando Calderon

IPC分类号： B24B100

CPC分类号： H01L21/02052 ,  B24B37/04 ,  B24B41/005

摘要： An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

摘要翻译： 用于抛光，清洁，漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片，将晶片移动到用于抛光的抛光台，并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站，漂洗站和旋转干燥站，以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

公开(公告)号：US06364745B1

公开(公告)日：2002-04-02

申请号：US09525315

申请日：2000-03-13

申请人： Jose R. Gonzalez-Martin ,  Chris Karlsrud ,  Robert Allen ,  Toby Jordan ,  Craig Howard ,  Arthur Hamer ,  Jeff Cunnane ,  Periya Gopalan ,  Bill Thornton ,  Jon MacErnie ,  Fernando Calderon

发明人： Jose R. Gonzalez-Martin ,  Chris Karlsrud ,  Robert Allen ,  Toby Jordan ,  Craig Howard ,  Arthur Hamer ,  Jeff Cunnane ,  Periya Gopalan ,  Bill Thornton ,  Jon MacErnie ,  Fernando Calderon

IPC分类号： B24B4900

CPC分类号： H01L21/02052 ,  B24B37/04 ,  B24B41/005

摘要： An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

摘要翻译： 用于抛光，清洁，漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片，将晶片移动到用于抛光的抛光台，并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站，漂洗站和旋转干燥站，以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

公开(公告)号：US20060042664A1

公开(公告)日：2006-03-02

申请号：US10930290

申请日：2004-08-30

申请人： Vishwas Hardikar ,  Chris Karlsrud ,  Tom Le

发明人： Vishwas Hardikar ,  Chris Karlsrud ,  Tom Le

IPC分类号： B08B5/00 ,  B08B1/02 ,  B08B7/00 ,  B08B3/00

CPC分类号： H01L21/67051 ,  B08B3/02 ,  H01L21/02041 ,  H01L21/67028 ,  H01L21/6719 ,  H01L21/67207

摘要： An apparatus and method for performing a rinsing process on a workpiece surface, the apparatus including a platform adapted to seat the workpiece thereon, a chuck connected to the platform and adapted to spin the workpiece during the rinsing process, a mechanical arm adapted to sweep across at least part of the workpiece surface during the rinsing process, first and second rinsing liquid nozzles secured to the mechanical arm, a tensioactive vapor nozzle secured to the arm and disposed between the first and second rinsing liquid nozzles, and first and second flow control elements adapted to separately and independently control rinsing liquid flow rates for the first and second rinsing liquid nozzles, respectively.

摘要翻译： 一种用于在工件表面上执行冲洗过程的装置和方法，该装置包括适于将工件放置在其上的平台，连接到平台并适于在漂洗过程中旋转工件的卡盘，适于跨越 漂洗过程中的工件表面的至少一部分，固定到机械臂的第一和第二冲洗液体喷嘴，固定到臂并设置在第一和第二冲洗液体喷嘴之间的张力蒸气喷嘴，以及第一和第二流量控制元件 分别独立地控制第一和第二冲洗液体喷嘴的冲洗液体流速。

公开(公告)号：US06852007B1

公开(公告)日：2005-02-08

申请号：US09517714

申请日：2000-03-02

申请人： Jose R. Gonzalez-Martin ,  Chris Karlsrud

发明人： Jose R. Gonzalez-Martin ,  Chris Karlsrud

IPC分类号： B24B37/04 ,  B24B41/00 ,  B65G49/07 ,  H01L21/304 ,  H01L21/306 ,  H01L21/677 ,  B24B1/00

CPC分类号： H01L21/02052 ,  B24B37/04 ,  B24B41/005

摘要： An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

摘要翻译： 用于抛光，清洁，漂洗和干燥工件如半导体晶片的整体机器。 装载/卸载站具有用于接收要处理的晶片盒的多个平台。 机器的干燥末端执行器从盒中取出晶片并将它们转移到索引表。 具有晶片载体元件的转印装置从分度台拾取晶片，将晶片移动到用于抛光的抛光台，并将晶片返回到索引表以进行进一步处理。 抛光器将抛光的晶片移动到清洁站。 清洁站包括洗刷站，漂洗站和旋转干燥站，以及水道连接系统。 机器的湿端部执行器将冲洗的晶片传送到旋转干燥站。 机器人的干燥末端执行器将干燥的晶片从旋转干燥器站移回到起始盒。

公开(公告)号：US5954888A

公开(公告)日：1999-09-21

申请号：US20979

申请日：1998-02-09

申请人： Anand Gupta ,  Chris Karlsrud ,  Periya Gopalan

发明人： Anand Gupta ,  Chris Karlsrud ,  Periya Gopalan

IPC分类号： H01L21/00 ,  H01L21/3105 ,  C23G1/02

CPC分类号： H01L21/67057 ,  H01L21/31053 ,  H01L21/67046 ,  H01L21/67051 ,  Y10S134/902

摘要： The present invention provides a method for cleaning semiconductor work pieces following a Chemical Mechanical Planarization ("CMP") procedure. Initially, a work piece is scrubbed to remove some of the slurry material and other contaminants on the surfaces of the work piece. Next, the work piece is transported into a HF cleaning station wherein the work piece is positioned horizontally such that both the upper and lower surfaces are substantially exposed. The work piece then is immersed in a hydrogen fluoride ("HF") solution which is circulated around the various surfaces of the work piece. The work piece is immersed in the HF solution for a sufficient length of time to remove an appropriate layer of oxide, thereby removing contaminants and smoothing micro scratches from the surfaces of the work piece.

摘要翻译： 本发明提供了按照化学机械平面化（“CMP”）程序清洗半导体工件的方法。 最初，将工件擦洗以除去工件表面上的一些浆料和其它污染物。 接下来，工件被输送到HF清洗站，其中工件水平定位，使得上表面和下表面都基本上露出。 然后将工件浸入在工件的各个表面周围循环的氟化氢（“HF”）溶液中。 将工件浸入HF溶液中足够长的时间以除去适当的氧化物层，从而从工件的表面除去污染物和平滑微划痕。

公开(公告)号：US5872633A

公开(公告)日：1999-02-16

申请号：US798803

申请日：1997-02-12

申请人： Paul Holzapfel ,  James Schlueter ,  Chris Karlsrud ,  Warren Lin

发明人： Paul Holzapfel ,  James Schlueter ,  Chris Karlsrud ,  Warren Lin

IPC分类号： B24B49/00 ,  G01B11/06 ,  H01L21/66 ,  B24B49/12

CPC分类号： B24B37/013 ,  B24B49/00 ,  G01B11/0625 ,  H01L22/26 ,  H01L22/12

摘要： The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a work piece, e.g., a semiconductor wafer. A probe is disposed proximate to the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A nozzle may be provided to apply a stream of compressed air at the disk surface under inspection to thereby remove excess slurry from the local region of the workpiece being inspected. A broad band light source is employed in conjunction with a fiber optic cable to direct light at the wafer surface. A bifurcated probe is employed such that the light applied to the workpiece surface is reflected back to and captured by a corresponding optical sensor connected to a fiber optic cable. The captured reflected light received by the receptor sensor and fiber optic cable assembly is applied to a photospectrum meter which analyzes the reflected light. An output signal from the photospectrum meter is transmitted to a processor which includes a smart algorithm configured to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer.

摘要翻译： 本发明提供了允许在工件中原位实质测量工件例如半导体晶片的表面层的实际厚度的方法和装置。 探针靠近CMP台面上的抛光垫的外周设置，使得当晶片的一部分延伸超过抛光垫的外周边时，探针与晶片表面建立光学接触。 可以设置喷嘴以在被检查的盘表面处施加压缩空气流，从而从被检查的工件的局部区域去除多余的浆料。 宽带光源与光纤电缆结合使用以引导晶片表面的光。 采用分叉探针，使得施加到工件表面的光被反射回并连接到光纤电缆的相应的光学传感器捕获。 由受体传感器和光缆组件接收的所捕获的反射光被施加到分析反射光的光谱仪上。 来自光谱仪的输出信号被传送到处理器，处理器包括配置成计算表面层厚度的智能算法。 或者，半导体层的反射特性可能影响反射信号的性质; 可以检测反射信号的变化，以指示金属层何时从氧化物层去除。

公开(公告)号：US5791978A

公开(公告)日：1998-08-11

申请号：US751014

申请日：1996-11-14

申请人： Joseph V. Cesna ,  Gordon J. Grosslight ,  Chris Karlsrud

发明人： Joseph V. Cesna ,  Gordon J. Grosslight ,  Chris Karlsrud

IPC分类号： B24B37/30 ,  B24B7/04 ,  B24B29/00

CPC分类号： B24B37/30 ,  Y10T279/11

摘要： An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member. A detachable pressure plate is connected to the lower plate member by at least one quick release apparatus which utilizes a locking pin secured to the pressure plate and configured to fit through a bore in the lower plate member. In a second embodiment, the upper plate member has recesses in its top and bottom surfaces. The lower plate member includes recesses in its top surface which are aligned with the upper plate member. A plurality of springs held by connecting pins are disposed in the recesses, and a flexure spring is disposed between the upper and lower plate members.

摘要翻译： 在第一实施例中用于将工件接合抛光表面的装置包括下板构件，下板构件在顶表面上包括轮毂。 上板构件包括设置在底面上的座。 轮毂装配在座椅内以形成下板和上板构件之间的空气轴承。 结构向空气轴承供应空气，并且弯曲弹簧设置在上板和下板构件之间。 下板构件包括在其底表面中的真空孔，其连接到真空源，该真空源产生用于将工件保持抵靠下板的真空压力。 包括凸缘的保持环围绕下板构件的外边缘表面定位，用于将工件保持在下板构件的底表面上的适当位置。 一个可拆卸的压板通过至少一个快速释放装置连接到下板构件，该快速释放装置利用固定在压板上并被配置成通过下板构件中的孔配合的锁销。 在第二实施例中，上板构件在其顶表面和底表面上具有凹部。 下板构件在其顶表面中包括与上板构件对准的凹部。 通过连接销保持的多个弹簧设置在凹部中，并且弯曲弹簧设置在上板和下板构件之间。