公开(公告)号：US20100127283A1

公开(公告)日：2010-05-27

申请号：US12629735

申请日：2009-12-02

申请人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Ted Lowes

发明人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Ted Lowes

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.

摘要翻译： 公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

公开(公告)号：US09484329B2

公开(公告)日：2016-11-01

申请号：US12629735

申请日：2009-12-02

申请人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Theodore Lowes

发明人： Antony P. van de Ven ,  Gerald Negley ,  Thomas Yuan ,  Bernd Keller ,  Theodore Lowes

IPC分类号： H01L25/075 ,  H01L25/16 ,  H01L33/58

CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.

摘要翻译： 公开了具有多个分立光源的固态照明组件，其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED（BSY）LED芯片，第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置，并且可从组件的一侧接近以将电信号施加到LED芯片组。

公开(公告)号：US08217412B2

公开(公告)日：2012-07-10

申请号：US12883979

申请日：2010-09-16

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US08698171B2

公开(公告)日：2014-04-15

申请号：US13489035

申请日：2012-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20090050907A1

公开(公告)日：2009-02-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20120241781A1

公开(公告)日：2012-09-27

申请号：US13489035

申请日：2012-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/50 ,  H01L33/58

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US07821023B2

公开(公告)日：2010-10-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US09793247B2

公开(公告)日：2017-10-17

申请号：US12156995

申请日：2008-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

发明人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

IPC分类号： H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L25/075 ,  F21K9/00 ,  H05B33/08

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

公开(公告)号：US20090050908A1

公开(公告)日：2009-02-26

申请号：US12156995

申请日：2008-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

发明人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

摘要翻译： 根据本发明的LED组件包括安装在基座上的LED芯片的阵列，LED芯片能够响应于电信号而发光。 阵列可以包括以两种颜色的光发射的LED芯片，其中LED组件发射包括两种颜色的光的组合的光。 LED芯片阵列中包含一个单一的镜头。 LED芯片阵列可以发射大于800流明的光，驱动电流小于150毫安。 LED芯片组件也可以在低于3000度K的温度下工作。在一个实施例中，LED阵列在基座上是基本圆形的。

公开(公告)号：US06854998B2

公开(公告)日：2005-02-15

申请号：US10601520

申请日：2003-06-24

申请人： Thomas Yuan

发明人： Thomas Yuan

IPC分类号： H01R4/24 ,  H01R24/00 ,  H01R11/20

CPC分类号： H01R4/2429 ,  H01R24/64

摘要： A wiring block and cover shell arrangement for electric connector in which the wiring block has two smoothly arched bearing walls perpendicularly extended from the front surface of the base thereof and equally spaced from the center of the base at two sides, two sets of parallel crevices symmetrically formed in the bearing walls and respectively cut through the height of the bearing walls to the base, and two sets of slots respectively cut through the height of the bearing walls and front and back sides of the base across the crevices for accommodating a respective wire clamp to fasten the insulated wires of the twisted pairs of a cable, maintaining an equal delay skew at each twisted pair of the cable.

摘要翻译： 一种用于电连接器的接线块和盖壳装置，其中接线块具有从其基部的前表面垂直延伸的两个平滑的拱形轴承壁，并且在两侧与基座的中心等距离地对称地设置两组平行的缝隙 形成在轴承壁上并分别切穿轴承壁的高度到底座，并且两组槽分别穿过轴承壁的高度和基部的前后两侧穿过缝隙，以容纳相应的线夹 以固定电缆的双绞线的绝缘电线，在电缆的每对双绞线处保持相等的延迟偏斜。