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公开(公告)号:US08698171B2
公开(公告)日:2014-04-15
申请号:US13489035
申请日:2012-06-05
申请人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
IPC分类号: H01L33/00
CPC分类号: H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译: 一种LED组件,包括安装在基座的平坦表面上的LED芯片的阵列,所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组,其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构,其包括与底座一体并且被布置成散发来自LED芯片的热量。
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公开(公告)号:US20090050907A1
公开(公告)日:2009-02-26
申请号:US12154691
申请日:2008-05-23
申请人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
IPC分类号: H01L33/00
CPC分类号: H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译: 一种LED组件,包括安装在基座的平坦表面上的LED芯片的阵列,所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组,其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构,其包括与底座一体并且被布置成散发来自LED芯片的热量。
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公开(公告)号:US06854998B2
公开(公告)日:2005-02-15
申请号:US10601520
申请日:2003-06-24
申请人: Thomas Yuan
发明人: Thomas Yuan
CPC分类号: H01R4/2429 , H01R24/64
摘要: A wiring block and cover shell arrangement for electric connector in which the wiring block has two smoothly arched bearing walls perpendicularly extended from the front surface of the base thereof and equally spaced from the center of the base at two sides, two sets of parallel crevices symmetrically formed in the bearing walls and respectively cut through the height of the bearing walls to the base, and two sets of slots respectively cut through the height of the bearing walls and front and back sides of the base across the crevices for accommodating a respective wire clamp to fasten the insulated wires of the twisted pairs of a cable, maintaining an equal delay skew at each twisted pair of the cable.
摘要翻译: 一种用于电连接器的接线块和盖壳装置,其中接线块具有从其基部的前表面垂直延伸的两个平滑的拱形轴承壁,并且在两侧与基座的中心等距离地对称地设置两组平行的缝隙 形成在轴承壁上并分别切穿轴承壁的高度到底座,并且两组槽分别穿过轴承壁的高度和基部的前后两侧穿过缝隙,以容纳相应的线夹 以固定电缆的双绞线的绝缘电线,在电缆的每对双绞线处保持相等的延迟偏斜。
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公开(公告)号:US08217412B2
公开(公告)日:2012-07-10
申请号:US12883979
申请日:2010-09-16
申请人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
IPC分类号: H01L33/00
CPC分类号: H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译: 一种LED组件,包括安装在基座的平坦表面上的LED芯片的阵列,所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组,其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构,其包括与底座一体并且被布置成散发来自LED芯片的热量。
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公开(公告)号:US20100127283A1
公开(公告)日:2010-05-27
申请号:US12629735
申请日:2009-12-02
申请人: Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Ted Lowes
发明人: Antony P. van de Ven , Gerald Negley , Thomas Yuan , Bernd Keller , Ted Lowes
IPC分类号: H01L33/00
CPC分类号: H01L25/0753 , H01L25/167 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.
摘要翻译: 公开了具有多个分立光源的固态照明组件,其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED(BSY)LED芯片,第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置,并且可从组件的一侧接近以将电信号施加到LED芯片组。
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公开(公告)号:US4925609A
公开(公告)日:1990-05-15
申请号:US182547
申请日:1988-04-18
申请人: Hisao Yamada , Thomas Yuan
发明人: Hisao Yamada , Thomas Yuan
IPC分类号: C04B33/32 , G01N27/407 , G01N27/416
CPC分类号: G01N27/407
摘要: An oxygen-sensing element particularly for use in the exhaust stream of an internal combustion engine. In one embodiment, the sensing element may be a tubular solid electrolyte body with a transverse web forming a relatively shallow recess at one end of the body and a relatively deep tube at the other. Separate electrodes are formed on the surface of the body proximate the recess and on both opposing sides of the web. A porous plug disposed in the recess covers one of the electrodes. When the electrode on the surface of the body is exposed to the exhaust stream of a fuel-rich air-fuel mixture, the EMF across that electrode and the electrode on the underside of the web, which is exposed to fresh air, is indicative of the oxygen content of the exhaust stream. When an exhaust stream from a fuel-lean air-fuel mixture is present, the magnitude of an oxygen pumping current that flows between the electrodes disposed on opposing sides of the web, in response to a voltage applied across those electrodes, indicates the oxygen content of the exhaust stream.The sensing element body may be conveniently formed from a slip prepared by ball milling yttria-stabilized zirconia powder with water and a binder. The slip may be cast in a mold or dried to form a flowable powder that is molded under pressure to form a green body. After calcining of the green body, electrodes are formed on the body by applying a platinum paste and heating it. A slurry of ball-milled calcined yttria-stabilized zirconia powder is disposed in the recess. The calcined green body and slurry are fired to produce a sensing element in which a tightly fitting porous plug, free of cracks and shrinkage away from the body, is disposed in the recess.
摘要翻译: 一种特别用于内燃机排气流的氧气感测元件。 在一个实施例中,感测元件可以是管状固体电解质体,其横向腹板在主体的一端形成相对浅的凹部,而在另一端形成相对较深的管。 单独的电极形成在靠近凹槽的本体的表面上并且在幅材的两个相对侧上。 设置在凹部中的多孔塞覆盖电极中的一个。 当身体表面上的电极暴露于富燃料空气 - 燃料混合物的排气流时,穿过该电极的EMF和暴露于新鲜空气的幅材下侧的电极表示 排气流的氧含量。 当存在来自贫燃料的空气燃料混合物的废气流时,响应于施加在这些电极上的电压而在布置在幅材的相对侧上的电极之间流动的氧气抽吸电流的大小表示氧含量 的排气流。 感测元件主体可以方便地由球磨氧化钇稳定的氧化锆粉末与水和粘合剂制成的滑块形成。 滑块可以在模具中铸造或干燥以形成在压力下成型以形成生坯体的可流动粉末。 在生坯体煅烧后,通过施加铂膏并加热电极,在体上形成电极。 将球磨的煅烧氧化钇稳定的氧化锆粉末的浆料设置在凹槽中。 煅烧的生坯和浆料被烧制以产生感测元件,其中紧密配合的多孔塞没有裂缝和远离体的收缩被布置在凹槽中。
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公开(公告)号:US09793247B2
公开(公告)日:2017-10-17
申请号:US12156995
申请日:2008-06-05
申请人: Thomas Yuan , Bernd Keller , Eric Tarsa , James Ibbetson , Frederick Morgan , Kevin Dowling , Ihor Lys
发明人: Thomas Yuan , Bernd Keller , Eric Tarsa , James Ibbetson , Frederick Morgan , Kevin Dowling , Ihor Lys
CPC分类号: H01L25/0753 , F21K9/00 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.
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公开(公告)号:US20120241781A1
公开(公告)日:2012-09-27
申请号:US13489035
申请日:2012-06-05
申请人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
发明人: Thomas Yuan , Bernd Keller , James Ibbetson , Eric Tarsa , Gerald Negley
CPC分类号: H01L33/60 , H01L25/0753 , H01L33/58 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/181 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.
摘要翻译: 一种LED组件,包括安装在基座的平坦表面上的LED芯片的阵列,所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组,其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构,其包括与底座一体并且被布置成散发来自LED芯片的热量。
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公开(公告)号:US20090050908A1
公开(公告)日:2009-02-26
申请号:US12156995
申请日:2008-06-05
申请人: Thomas Yuan , Bernd Keller , Eric Tarsa , James Ibbetson , Frederick Morgan , Kevin Dowling , Ihor Lys
发明人: Thomas Yuan , Bernd Keller , Eric Tarsa , James Ibbetson , Frederick Morgan , Kevin Dowling , Ihor Lys
IPC分类号: H01L33/00
CPC分类号: H01L25/0753 , F21K9/00 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/09701 , H05B33/0821 , H05B33/0857 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.
摘要翻译: 根据本发明的LED组件包括安装在基座上的LED芯片的阵列,LED芯片能够响应于电信号而发光。 阵列可以包括以两种颜色的光发射的LED芯片,其中LED组件发射包括两种颜色的光的组合的光。 LED芯片阵列中包含一个单一的镜头。 LED芯片阵列可以发射大于800流明的光,驱动电流小于150毫安。 LED芯片组件也可以在低于3000度K的温度下工作。在一个实施例中,LED阵列在基座上是基本圆形的。
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公开(公告)号:US09484329B2
公开(公告)日:2016-11-01
申请号:US12629735
申请日:2009-12-02
IPC分类号: H01L25/075 , H01L25/16 , H01L33/58
CPC分类号: H01L25/0753 , H01L25/167 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: Solid state lighting components are disclosed having multiple discrete light sources whose light combines to provide the desired emission characteristics. One embodiment of an LED component according to the present invention comprises a rectangular submount. A first group of blue shifted yellow (BSY) LED chips, a second group of BSY LED chips and a group of red LED chips are mounted on the submount. A plurality of contacts is arranged along one of the edges of the submount and accessible from one side of the component for applying electrical signals to the groups of LED chips.
摘要翻译: 公开了具有多个分立光源的固态照明组件,其光组合以提供期望的发射特性。 根据本发明的LED部件的一个实施例包括矩形基座。 第一组蓝移LED(BSY)LED芯片,第二组BSY LED芯片和一组红色LED芯片安装在底座上。 多个触点沿着副安装座的边缘之一布置,并且可从组件的一侧接近以将电信号施加到LED芯片组。
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