公开(公告)号：US09793247B2

公开(公告)日：2017-10-17

申请号：US12156995

申请日：2008-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

发明人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

IPC分类号： H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L25/075 ,  F21K9/00 ,  H05B33/08

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

公开(公告)号：US20090050908A1

公开(公告)日：2009-02-26

申请号：US12156995

申请日：2008-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

发明人： Thomas Yuan ,  Bernd Keller ,  Eric Tarsa ,  James Ibbetson ,  Frederick Morgan ,  Kevin Dowling ,  Ihor Lys

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED component according to the present invention comprising an array of LED chips mounted on a submount with the LED chips capable of emitting light in response to an electrical signal. The array can comprise LED chips emitting at two colors of light wherein the LED component emits light comprising the combination of the two colors of light. A single lens is included over the array of LED chips. The LED chip array can emit light of greater than 800 lumens with a drive current of less than 150 milli-Amps. The LED chip component can also operate at temperatures less than 3000 degrees K. In one embodiment, the LED array is in a substantially circular pattern on the submount.

摘要翻译： 根据本发明的LED组件包括安装在基座上的LED芯片的阵列，LED芯片能够响应于电信号而发光。 阵列可以包括以两种颜色的光发射的LED芯片，其中LED组件发射包括两种颜色的光的组合的光。 LED芯片阵列中包含一个单一的镜头。 LED芯片阵列可以发射大于800流明的光，驱动电流小于150毫安。 LED芯片组件也可以在低于3000度K的温度下工作。在一个实施例中，LED阵列在基座上是基本圆形的。

公开(公告)号：US07821023B2

公开(公告)日：2010-10-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20110012143A1

公开(公告)日：2011-01-20

申请号：US12883979

申请日：2010-09-16

申请人： THOMAS YUAN ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： THOMAS YUAN ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/58

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US08698171B2

公开(公告)日：2014-04-15

申请号：US13489035

申请日：2012-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20090050907A1

公开(公告)日：2009-02-26

申请号：US12154691

申请日：2008-05-23

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US08217412B2

公开(公告)日：2012-07-10

申请号：US12883979

申请日：2010-09-16

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US20120241781A1

公开(公告)日：2012-09-27

申请号：US13489035

申请日：2012-06-05

申请人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

发明人： Thomas Yuan ,  Bernd Keller ,  James Ibbetson ,  Eric Tarsa ,  Gerald Negley

IPC分类号： H01L33/50 ,  H01L33/58

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/181 ,  H05B33/0821 ,  H05B33/0857 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

摘要翻译： 一种LED组件，包括安装在基座的平坦表面上的LED芯片的阵列，所述LED芯片能够响应于电信号而发光。 LED芯片包括以不同颜色的光发射的各个组，其中每个组以串联电路互连。 LED芯片中包含一个镜头。 其他实施例可以包括散热结构，其包括与底座一体并且被布置成散发来自LED芯片的热量。

公开(公告)号：US09159888B2

公开(公告)日：2015-10-13

申请号：US11899790

申请日：2007-09-07

申请人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  Yankun Fu

发明人： Ashay Chitnis ,  James Ibbetson ,  Bernd Keller ,  David T. Emerson ,  John Edmond ,  Michael J. Bergmann ,  Jasper S. Cabalu ,  Jeffrey C. Britt ,  Arpan Chakraborty ,  Eric Tarsa ,  James Seruto ,  Yankun Fu

IPC分类号： H01L33/00 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  H01L33/36 ,  H01L33/44 ,  H01L33/54

CPC分类号： H01L33/508 ,  H01L33/0095 ,  H01L33/36 ,  H01L33/387 ,  H01L33/44 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

摘要： Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

摘要翻译： 制造发光二极管（LED）芯片的方法包括通常在衬底上提供多个LED。 基座沉积在LED上，每个基座与其中一个LED电接触。 在LED上形成涂层，其中涂层埋入至少一些基座。 然后将涂层平坦化以暴露至少一些埋置的基座，同时在所述LED上留下至少一些所述涂层。 然后可以例如通过引线接合露出的基座。 本发明公开了用于制造LED芯片的类似方法，所述LED芯片具有倒装芯片接合在载体基板上并用于制造其它半导体器件的LED。 还公开了使用所公开的方法制造的LED芯片晶片和LED芯片。

公开(公告)号：US20060131599A1

公开(公告)日：2006-06-22

申请号：US11338918

申请日：2006-01-25

申请人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

发明人： David Slater ,  Robert Glass ,  Charles Swoboda ,  Bernd Keller ,  James Ibbetson ,  Brian Thibeault ,  Eric Tarsa

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/10 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： Light emitting diodes include a substrate having first and second opposing faces and that is transparent to optical radiation in a predetermined wavelength range and that is patterned to define, in cross-section, a plurality of pedestals that extend into the substrate from the first face towards the second face. A diode region on the second face is configured to emit light in the predetermined wavelength range, into the substrate upon application of voltage across the diode region. A mounting support on the diode region, opposite the substrate is configured to support the diode region, such that the light that is emitted from the diode region into the substrate, is emitted from the first face upon application of voltage across the diode region. The first face of the substrate may include therein a plurality of grooves that define the plurality of triangular pedestals in the substrate. The grooves may include tapered sidewalls and/or a beveled floor. The first face of the substrate also may include therein an array of via holes. The via holes may include tapered sidewalls and/or a floor.

摘要翻译： 发光二极管包括具有第一和第二相对面并且对于预定波长范围内的光辐射透明的衬底，其被图案化以在横截面中限定多个基座，其从第一面朝向 第二张脸。 第二面上的二极管区域被配置为在施加二极管区域上的电压时将预定波长范围内的光发射到衬底中。 配置在与衬底相对的二极管区域上的安装支撑件被配置为支撑二极管区域，使得从二极管区域发射到衬底中的光在施加二极管区域上的电压时从第一面发射。 衬底的第一面可以包括在衬底中限定多个三角形基座的多个凹槽。 凹槽可以包括锥形侧壁和/或斜面底板。 衬底的第一面也可以包括一组通孔。 通孔可以包括锥形侧壁和/或底板。