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    ISOLATOR FOR PROCESSING CHAMBERS
    6.
    发明申请
    ISOLATOR FOR PROCESSING CHAMBERS 有权

    公开(公告)号：US20220328293A1

    公开(公告)日：2022-10-13

    申请号：US17228996

    申请日：2021-04-13

    申请人： Applied Materials, Inc.

    发明人： Akshay Dhanakshirur ,  Saketh Pemmasani ,  Mayur Govind Kulkarni ,  Madhu Santosh Kumar Mutyala

    IPC分类号： H01J37/32 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458

    摘要： Apparatus and methods for reducing undesirable residue material deposition and buildup on one or more surfaces within a processing chamber are provided herein. In embodiments disclosed herein, a processing chamber includes a chamber body having a chamber base, one or more sidewalls, and a chamber lid defining a processing volume; a showerhead disposed in the chamber lid and having a bottom surface adjacent the processing volume; and an isolator disposed between the chamber lid and the one or more sidewalls. The isolator includes a first end contacting the showerhead; a second end opposite the first end; an angled inner wall connected to the first end and extending radially outwardly from the first end towards the second end; and a lower inner wall at a different angle from the angled inner wall. The first end and the angled inner wall of the isolator form a first angle less than 90°.

    WAFER NON-UNIFORMITY TWEAKING THROUGH LOCALIZED ION ENHANCED PLASMA (IEP)
    9.
    发明申请
    WAFER NON-UNIFORMITY TWEAKING THROUGH LOCALIZED ION ENHANCED PLASMA (IEP) 有权

    公开(公告)号：US20220093368A1

    公开(公告)日：2022-03-24

    申请号：US17026840

    申请日：2020-09-21

    申请人： Applied Materials, Inc.

    发明人： Saketh Pemmasani ,  Akshay Dhanakshirur ,  Mayur Govind Kulkarni ,  Khokan Chandra Paul ,  Madhu Santosh Kumar Mutyala

    IPC分类号： H01J37/32 ,  C23C16/455

    摘要： semiconductor processing chambers include a gasbox. The chambers may include a substrate support. The chambers may include a blocker plate positioned between the gasbox and the substrate support. The blocker plate may define a plurality of apertures. The chambers may include a faceplate positioned between the blocker plate and the substrate support. The faceplate may be characterized by a first surface facing the blocker plate and a second surface opposite the first surface. The second surface and the substrate support may at least partially define a processing region within the chamber. The faceplate may define an inner plurality of apertures. Each of the inner apertures may include a generally cylindrical aperture profile. The faceplate may define an outer plurality of apertures that are positioned radially outward from the inner apertures. Each of the outer apertures may include a conical aperture profile that extends through the second surface.