公开(公告)号：US12020965B2

公开(公告)日：2024-06-25

申请号：US17076024

申请日：2020-10-21

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Sathya Swaroop Ganta ,  Kallol Bera ,  Canfeng Lai

IPC: C23C16/00 ,  C23C16/513 ,  H01J37/32 ,  H01L21/00 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67709 ,  C23C16/513 ,  H01J37/3266 ,  H01L21/02274

Abstract: Embodiments of the present disclosure generally relate to semiconductor processing equipment, and more specifically to apparatus, e.g., magnet holding structures, that can be used with magnets during plasma processing of a substrate. In an embodiment, a magnet holding structure for a plasma-enhanced chemical vapor deposition chamber is provided. The magnet holding structure includes a top piece having a plurality of magnet retention members and a bottom piece having a plurality of magnet retention members. The top piece has a first inside edge and a first outside edge, and the bottom piece has a second inside edge and a second outside edge. The magnet holding structure further includes a plurality of casings. Each casing of the plurality of casings is configured to at least partially encapsulate a magnet, and each casing positioned between a magnet retention member of the top piece and a magnet retention member of the bottom piece.

公开(公告)号：US12033835B2

公开(公告)日：2024-07-09

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

CPC classification number: H01J37/32467 ,  H01J37/3222 ,  H01J37/3244 ,  H01J37/32513

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

公开(公告)号：US20250022694A1

公开(公告)日：2025-01-16

申请号：US18762865

申请日：2024-07-03

Applicant: Applied Materials, Inc.

Inventor： Pranav Vijay Gadre ,  Adib M. Khan ,  Qiwei Liang ,  Dmitry Lubomirsky ,  Hyun Joo Lee ,  Paneendra Prakash Bhat ,  Douglas A. Buchberger, JR. ,  Onkara Swamy Korasiddaramaiah ,  Vijay D. Parkhe ,  Junghoon Kim ,  Kallol Bera ,  Rupali Sahu ,  Sathya Swaroop Ganta

IPC: H01J37/32 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/509 ,  H05B6/54 ,  H05B6/62

Abstract: A substrate support assembly includes a heater plate including a dielectric material, a heater electrode embedded within the heater plate, a set of distributed purge channels formed within the heater plate, wherein the set of distributed purge channels provides a set of gas flow paths to equalize a gas flow from within the heater plate and direct the gas flow in a direction below the heater plate, a ground electrode embedded within the heater plate, and a radio frequency (RF) mesh embedded within the plate.

公开(公告)号：US20210391149A1

公开(公告)日：2021-12-16

申请号：US16898259

申请日：2020-06-10

Applicant: Applied Materials, Inc.

Inventor： Philip Allan Kraus ,  Robert Moore ,  James Carducci ,  Richard Fovell ,  Sathya Swaroop Ganta ,  Karthikeyan Balaraman ,  Silverst Rodrigues

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

公开(公告)号：US20240395506A1

公开(公告)日：2024-11-28

申请号：US18388250

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Kenneth Brian Doering ,  Xiaokang Yang ,  Sathya Swaroop Ganta

IPC: H01J37/32

Abstract: A microwave plasma impedance transformers comprising a thermal break and methods of use are described. The impedance transformer comprises a housing having a first end and a second end defining a length of the housing. The housing has a channel with channel walls extending through the length from the first end to the second end, and the channel has an opening in the first end of the housing with a first end diameter and an opening in the second end of the housing with a second end diameter. The first end diameter being greater than the second end diameter. The channel acts as a conical impedance transformer.

公开(公告)号：US11984302B2

公开(公告)日：2024-05-14

申请号：US17088407

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Job George Konnoth Joseph ,  Sathya Swaroop Ganta ,  Kallol Bera ,  Andrew Nguyen ,  Jay D. Pinson, II ,  Akshay Dhanakshirur ,  Kaushik Comandoor Alayavalli ,  Canfeng Lai ,  Ren-Guan Duan ,  Jennifer Y. Sun ,  Anil Kumar Kalal ,  Abhishek Pandey

IPC: H01J37/32 ,  H01J37/20

CPC classification number: H01J37/32669 ,  H01J37/20 ,  H01J2237/0264

Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.

公开(公告)号：US11959174B2

公开(公告)日：2024-04-16

申请号：US17131315

申请日：2020-12-22

Applicant: Applied Materials, Inc.

Inventor： Kallol Bera ,  Sathya Swaroop Ganta ,  Timothy Joseph Franklin ,  Kaushik Alayavalli ,  Akshay Dhanakshirur ,  Stephen C. Garner ,  Bhaskar Kumar

IPC: C23C16/52 ,  C23C16/505 ,  C23C16/54 ,  H01J37/32

CPC classification number: C23C16/52 ,  C23C16/505 ,  C23C16/54 ,  H01J37/32082 ,  H01J37/32174 ,  H01J37/3266 ,  H01J37/32669

Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.