公开(公告)号：US11950384B2

公开(公告)日：2024-04-02

申请号：US18103812

申请日：2023-01-31

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Uday Pai ,  Timothy J. Roggenbuck ,  Sanjeev Baluja ,  Kalesh Panchaxari Karadi ,  Tejas Ulavi

IPC: H05K5/02 ,  C23C16/455 ,  C23C16/458 ,  H02G3/04

CPC classification number: H05K5/0247 ,  C23C16/45544 ,  C23C16/4588 ,  H02G3/0437 ,  C23C16/4586

Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.

公开(公告)号：US11602064B2

公开(公告)日：2023-03-07

申请号：US17009652

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Uday Pai ,  Timothy J. Roggenbuck ,  Sanjeev Baluja ,  Kalesh Panchaxari Karadi ,  Tejas Ulavi

IPC: H05K5/02 ,  C23C16/455 ,  H02G3/04 ,  C23C16/458

Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.

公开(公告)号：US20240304470A1

公开(公告)日：2024-09-12

申请号：US18665683

申请日：2024-05-16

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Tejas Umesh Ulavi ,  Sanjeev Baluja

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/46 ,  F27D5/00 ,  H01L21/687 ,  H05B3/22

CPC classification number: H01L21/67103 ,  C23C16/45544 ,  C23C16/46 ,  F27D5/0037 ,  H01L21/68771 ,  H05B3/22

Abstract: A heater assembly having a top seal and a second seal configured to account for deviation in processing heights and motor runoff of a heater standoff. The top seal is positioned between a shield plate and a top plate and the bottom seal is positioned between a heater mounting base and the heater standoff.

公开(公告)号：US20220071037A1

公开(公告)日：2022-03-03

申请号：US17009652

申请日：2020-09-01

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Uday Pai ,  Timothy J. Roggenbuck ,  Sanjeev Baluja ,  Kalesh Panchaxari Karadi ,  Tejas Ulavi

IPC: H05K5/02 ,  C23C16/455 ,  C23C16/458 ,  H02G3/04

Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.

公开(公告)号：US12040210B2

公开(公告)日：2024-07-16

申请号：US17073671

申请日：2020-10-19

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez ,  Paul L. Brillhart ,  Akshay Gunaji ,  Mayur Govind Kulkarni ,  Sandeep Bindgi ,  Sanjay Kamath ,  Kwangduk Douglas Lee ,  Zongbin Wang ,  Yubin Zhang ,  Yong Xiang Lim

IPC: H01L21/683 ,  C23C16/458 ,  C23C16/50 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/6833 ,  C23C16/4586 ,  C23C16/50 ,  H01J37/32715 ,  H01L21/68742 ,  H01J2237/2007 ,  H01J2237/3321

Abstract: Exemplary semiconductor processing systems include a processing chamber, a power supply, and a chuck disposed at least partially within the processing chamber. The chuck includes a chuck body defining a vacuum port. The chuck also includes first and second coplanar electrodes embedded in the chuck body and connected to the power supply. In some examples, coplanar electrodes include concentric electrodes defining a concentric gap in between. Exemplary semiconductor processing methods may include activating the power supply for the electrostatic chuck to secure a semiconductor substrate on the body of the chuck and/or activating the vacuum port defined by the body of the electrostatic chuck. Some processing can be carried out at increased pressure, while other processing can be carried out at reduced pressure with increased chucking voltage.

公开(公告)号：US20210388495A1

公开(公告)日：2021-12-16

申请号：US16902911

申请日：2020-06-16

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Mayur Govind Kulkarni

IPC: C23C16/44 ,  H01L21/67 ,  H01L21/033 ,  H01L21/02 ,  H01J37/32 ,  C23C16/26 ,  C23C16/505

Abstract: Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The chambers may include a foreline conduit offset from a center of the base for exhausting a gas from the chamber body, and an exhaust volume coupled to the foreline conduit. The chambers may include a pumping plate comprising a central aperture through which the shaft extends, and further comprising exit apertures for directing at least a portion of the gas from the chamber body to the exhaust volume. The exit apertures may be disposed at locations opposite the foreline conduit so as to reduce nonuniformity in gas flow.

公开(公告)号：US12020957B2

公开(公告)日：2024-06-25

申请号：US17008588

申请日：2020-08-31

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Tejas Ulavi ,  Sanjeev Baluja

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/46 ,  F27D5/00 ,  H01L21/687 ,  H05B3/22

CPC classification number: H01L21/67103 ,  C23C16/45544 ,  C23C16/46 ,  F27D5/0037 ,  H01L21/68771 ,  H05B3/22

Abstract: A heater assembly having a top seal and a second seal configured to account for deviation in processing heights and motor runoff of a heater standoff. The top seal is positioned between a shield plate and a top plate and the bottom seal is positioned between a heater mounting base and the heater standoff.

公开(公告)号：US20230175131A1

公开(公告)日：2023-06-08

申请号：US18103812

申请日：2023-01-31

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Uday Pai ,  Timothy J. Roggenbuck ,  Sanjeev Baluja ,  Kalesh Panchaxari Karadi ,  Tejas Ulavi

IPC: H05K5/02 ,  H02G3/04 ,  C23C16/458 ,  C23C16/455

CPC classification number: H05K5/0247 ,  H02G3/0437 ,  C23C16/4588 ,  C23C16/45544 ,  C23C16/4586

Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.

公开(公告)号：US20220122873A1

公开(公告)日：2022-04-21

申请号：US17073671

申请日：2020-10-19

Applicant: Applied Materials, Inc.

Inventor： Jian Li ,  Dmitry A. Dzilno ,  Juan Carlos Rocha-Alvarez ,  Paul L. Brillhart ,  Akshay Gunaji ,  Mayur Govind Kulkarni ,  Sandeep Bindgi ,  Sanjay Kamath ,  Kwangduk Douglas Lee ,  Zongbin Wang ,  Yubin Zhang ,  Yong Xiang Lim

IPC: H01L21/683 ,  C23C16/50 ,  H01J37/32 ,  C23C16/458 ,  H01L21/687

Abstract: Exemplary semiconductor processing systems include a processing chamber, a power supply, and a chuck disposed at least partially within the processing chamber. The chuck includes a chuck body defining a vacuum port. The chuck also includes first and second coplanar electrodes embedded in the chuck body and connected to the power supply. In some examples, coplanar electrodes include concentric electrodes defining a concentric gap in between. Exemplary semiconductor processing methods may include activating the power supply for the electrostatic chuck to secure a semiconductor substrate on the body of the chuck and/or activating the vacuum port defined by the body of the electrostatic chuck. Some processing can be carried out at increased pressure, while other processing can be carried out at reduced pressure with increased chucking voltage.

公开(公告)号：US20220068674A1

公开(公告)日：2022-03-03

申请号：US17008588

申请日：2020-08-31

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Tejas Ulavi ,  Sanjeev Baluja

IPC: H01L21/67 ,  F27D5/00 ,  H05B3/22 ,  H01L21/687 ,  C23C16/455 ,  C23C16/46

Abstract: A heater assembly having a top seal and a second seal configured to account for deviation in processing heights and motor runoff of a heater standoff. The top seal is positioned between a shield plate and a top plate and the bottom seal is positioned between a heater mounting base and the heater standoff.