公开(公告)号：US20190115241A1

公开(公告)日：2019-04-18

申请号：US15782650

申请日：2017-10-12

申请人： APPLIED MATERIALS, INC.

发明人： Kim VELLORE ,  Douglas A. BUCHBERGER, JR. ,  Niranjan Kumar ,  Seshadri RAMASWAMI

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/673 ,  C23C8/16

摘要： The present disclosure relates to an electrostatic chuck, including: a base having a dielectric first surface to support a substrate thereon during processing; and an electrode disposed within the base proximate the dielectric first surface to facilitate electrostatically coupling the substrate to the dielectric first surface during use, wherein the dielectric first surface is sufficiently hydrophobic to electrostatically retain the substrate to the dielectric first surface when contacted with water. Methods of making and using the electrostatic chuck under wet conditions are also disclosed.

公开(公告)号：US10665494B2

公开(公告)日：2020-05-26

申请号：US15885120

申请日：2018-01-31

申请人： APPLIED MATERIALS, INC.

发明人： Niranjan Kumar ,  Seshadri Ramaswami ,  Shay Assaf ,  Amikam Sade ,  Andy Constant ,  Maureen Breiling

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/3065 ,  H01L21/687

摘要： Embodiments include a method for processing thin substrates. Embodiments may include electrostatically bonding a substrate to a first electrostatic carrier (ESC), with a backside of the substrate is facing away from the first ESC. Thereafter, the substrate may be thinned to form a thinned substrate. The thinned substrate may then be transferred to a second ESC with a front side of the thinned substrate facing away from the second ESC. Embodiments may include cleaning the front side surface of the thinned substrate and transferring the thinned substrate to a third ESC. In an embodiment, a backside of the thinned substrate is facing away from the third ESC. Embodiments may also include processing the backside surface of the thinned substrate, and transferring the thinned substrate to a tape frame.

公开(公告)号：US20180122679A1

公开(公告)日：2018-05-03

申请号：US15337973

申请日：2016-10-28

申请人： APPLIED MATERIALS, INC.

发明人： Shambhu N. Roy ,  Gautam Pisharody ,  Seshadri Ramaswami ,  Srinivas D. Nemani ,  Zhong Qiang Hua ,  Douglas A. Buchberger, JR. ,  Niranjan Kumar ,  Ellie Y. Yieh

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/67248 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6835 ,  H01L21/68785 ,  H01L2021/6006 ,  H01L2221/68304

摘要： A substrate carrier with contacts is described that is balanced for thermal stress. In one example workpiece carrier has a rigid substrate configured to support a workpiece to be carried for processing, a first dielectric layer over the substrate, an electrostatic conductive electrode over the first dielectric layer to electrostatically hold the workpiece to be carried, a second dielectric layer over the electrode to electrically isolate the workpiece from the electrode, and a third dielectric layer under the substrate to counter thermal stress applied to the substrate by the first and second dielectric layers.

公开(公告)号：US11414740B2

公开(公告)日：2022-08-16

申请号：US16864949

申请日：2020-05-01

申请人： Applied Materials, Inc.

发明人： Alexander N. Lerner ,  Roey Shaviv ,  Michael P. Karazim ,  Kevin Vincent Moraes ,  Steven V. Sansoni ,  Andrew J. Constant ,  Jeffrey Allen Brodine ,  Kim Ramkumar Vellore ,  Amikam Sade ,  Niranjan Kumar

IPC分类号： C23C14/04 ,  C23C14/02 ,  C23C14/08 ,  H01L51/00 ,  C23C14/12 ,  H01L51/44

摘要： Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.

公开(公告)号：US11047039B2

公开(公告)日：2021-06-29

申请号：US16232496

申请日：2018-12-26

申请人： APPLIED MATERIALS, INC.

发明人： Alexander Lerner ,  Kim Vellore ,  Ami Sade ,  Steven Sansoni ,  Andrew Constant ,  Kevin Moraes ,  Roey Shaviv ,  Niranjan Kumar ,  Jeffrey Brodine ,  Michael Karazim

IPC分类号： C23C14/50 ,  C23C14/04 ,  C23C14/24

摘要： Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

公开(公告)号：US20180144959A1

公开(公告)日：2018-05-24

申请号：US15360412

申请日：2016-11-23

申请人： APPLIED MATERIALS, INC.

发明人： Srinivas D. Nemani ,  Gautam Pisharody ,  Seshadri Ramaswami ,  Shambhu N. Roy ,  Niranjan Kumar

IPC分类号： H01L21/67 ,  H01L21/683 ,  G01R29/12

CPC分类号： H01L21/67288 ,  G01R29/12 ,  H01L21/67253 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6838

摘要： An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.