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公开(公告)号：US09779971B2
公开(公告)日：2017-10-03
申请号：US14251134
申请日：2014-04-11
IPC分类号： H01L21/67
CPC分类号： H01L21/67109
摘要： Embodiments of methods and apparatus for rapidly cooling a substrate are provided herein. In some embodiments, a cooling chamber for cooling a substrate includes a chamber body having an inner volume; a substrate support disposed in the chamber and having a support surface to support a substrate; a plate disposed in the chamber body opposite the substrate support, wherein the substrate support and the plate are movable with respect to each other between a first position and a second position, wherein when in the first position the substrate support and the plate are disposed away from each other such that the support surface is exposed to a first volume within the inner volume, wherein when in the second position the substrate support and the plate are disposed adjacent to each other such that the support surface is exposed to a second volume within the inner volume, and wherein the second volume is smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume.
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公开(公告)号：US09608549B2
公开(公告)日：2017-03-28
申请号：US13630136
申请日：2012-09-28
IPC分类号： H01L21/683 , H02N13/00
CPC分类号： H02N13/00 , H01L21/6833
摘要： Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck for retaining a substrate includes a base plate, a ceramic plate, supported by the base plate, having a substrate supporting surface, a first plurality of electrodes disposed within the ceramic plate having a first polarity, and a second plurality of electrodes disposed within the ceramic plate having a second polarity opposite from the first polarity, wherein the first and second plurality of electrodes are independently controllable to provide a desired chucking power and frequency.
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公开(公告)号：US10431489B2
公开(公告)日：2019-10-01
申请号：US14554945
申请日：2014-11-26
发明人： Pulkit Agarwal , Song-Moon Suh , Glen Mori , Steven V. Sansoni
IPC分类号： H01L21/687 , B25J15/00 , B25J11/00
摘要： Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive.
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公开(公告)号：US20240170254A1
公开(公告)日：2024-05-23
申请号：US17991379
申请日：2022-11-21
发明人： Jianming Fu , Tza-Jing Gung , Sanjeev Baluja , Haitao Wang , Mandyam Sriram , Srinivas Gandikota , Steven V. Sansoni
IPC分类号： H01J37/32 , C23C16/455 , C23C16/509
CPC分类号： H01J37/3211 , C23C16/45536 , C23C16/45544 , C23C16/509 , H01J37/32715 , H01J2237/332
摘要： Embodiments of the disclosure are directed to PEALD batch processing chambers. Some embodiments are directed to processing chambers having one or more inductively coupled plasma (ICP) coils electrically connected to at least one RF power source. Some embodiments are directed to processing chambers having a wafer cassette comprising a plurality of platforms, each platform configured to support at least one wafer for processing, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette. In some embodiments, the plurality of platforms have a first set of electrodes having a first polarity and a second set of electrodes having a second polarity, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette.
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公开(公告)号：US11887878B2
公开(公告)日：2024-01-30
申请号：US16899750
申请日：2020-06-12
发明人： Shreesha Yogish Rao , Mukund Sundararajan , Cheng-Hsiung Matthew Tsai , Manjunatha P. Koppa , Steven V. Sansoni
IPC分类号： H01L21/683 , H01J37/32
CPC分类号： H01L21/6833 , H01J37/32724 , H01J2237/002 , H01J2237/334
摘要： Embodiments of a substrate support are provided herein. In some embodiments, a substrate support for use in a substrate processing chamber includes a lower assembly having a base plate assembly, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a central protrusion; a ceramic puck disposed on the lower assembly and removeably coupled to the base plate assembly, wherein the ceramic puck has an electrode disposed therein that is electrically coupled to first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and a flexible connector having a spiral portion disposed between the ceramic puck and each of the plurality of electrical feedthroughs to allow for differences in thermal expansion of the ceramic puck and the base plate assembly.
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公开(公告)号：US11414740B2
公开(公告)日：2022-08-16
申请号：US16864949
申请日：2020-05-01
发明人： Alexander N. Lerner , Roey Shaviv , Michael P. Karazim , Kevin Vincent Moraes , Steven V. Sansoni , Andrew J. Constant , Jeffrey Allen Brodine , Kim Ramkumar Vellore , Amikam Sade , Niranjan Kumar
摘要： Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.
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公开(公告)号：US09508584B2
公开(公告)日：2016-11-29
申请号：US14451139
申请日：2014-08-04
IPC分类号： H01T23/00 , H01L21/683
CPC分类号： H01L21/6833 , Y10T29/49815
摘要： Embodiments described herein generally relate to an electrostatic chuck (ESC). The ESC may contain a first plurality of electrodes adapted to electrostatically couple a substrate to the ESC and a second plurality of electrodes adapted to electrostatically couple the ESC to a substrate support. Instead of being integrally disposed within the substrate support, the ESC may be easily removed from the substrate support and removed from a chamber for maintenance or replacement purposes.
摘要翻译： 本文描述的实施例一般涉及静电卡盘（ESC）。 ESC可以包含适于将基板静电耦合到ESC的第一多个电极和适于使ESC与基板支撑件静电耦合的第二多个电极。 代替整体地设置在基板支撑件内，ESC可以容易地从基板支撑件移除并从腔室移除以进行维护或替换。
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公开(公告)号：US09147592B2
公开(公告)日：2015-09-29
申请号：US13961538
申请日：2013-08-07
发明人： Eric A. Englhardt , Steve Szudarski , Andrew Scott Cornelius , Amitabh Puri , Michael Robert Rice , Jeffrey C. Hudgens , Steven V. Sansoni , Robert Irwin Decottignies , Dean C. Hruzek , Peter Irwin , Nir Merry
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/67739 , H01L21/67161 , H01L21/67184
摘要： In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.
摘要翻译： 在一些实施例中，提供了一种链接的加工工具系统，其包括（1）具有至少第一传送室的第一处理工具，所述第一传送室被配置为耦合到多个处理室; （2）具有至少第二传送室的第二处理工具，所述第二传送室被配置为耦合到多个处理室; （3）耦合在所述第一和第二处理工具之间并被配置为在所述第一和第二处理工具之间传送衬底的第三传送室; 以及（4）单个定序器，其控制所述连接的处理工具系统的第一处理工具，第二处理工具和第三传送室之间的衬底传送操作。 提供了许多其他方面。
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公开(公告)号：US08971009B2
公开(公告)日：2015-03-03
申请号：US13630196
申请日：2012-09-28
CPC分类号： F28F3/00 , B23Q3/15 , B23Q3/1543 , H01L21/67109 , H01L21/683 , H01L21/6831 , H02N13/00
摘要： Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.
摘要翻译： 本文提供了用于控制处理室中的静电卡盘的温度的装置的实施例。 在一些实施例中，该设备包括设置在处理室中的静电吸盘，静电吸盘包括具有基板支撑表面的陶瓷板，以及包括设置在静电卡盘下方的多个冷却板的冷却组件，以调节冷却能力 静电吸盘。 在一些实施例中，多个冷却板包括构造成控制静电卡盘的中心部分的温度的内部冷却板和被配置为控制静电卡盘的外部部分的温度的外部冷却板。 在一些实施例中，多个冷却板包括接触静电卡盘的底表面的上部冷却板和接触上部冷却板底面的下部冷却板。
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公开(公告)号：US11348823B2
公开(公告)日：2022-05-31
申请号：US16405414
申请日：2019-05-07
发明人： Steven V. Sansoni , Jeffrey Brodine , Glen Mori
IPC分类号： H01L21/677 , H01L21/687
摘要： Substrate transfer robot blades used to engage and support a substrate during transfer include a blade body having a blade support surface and at least one pad having a top surface and an opposite bottom surface, a central opening extending from the top surface to the bottom surface, and a resilient portion formed from the at least one pad. The resilient portion formed from the at least one pad extends from and cantilevers from a side surface of the central opening of the at least one pad that is disposed directly on the side surface at the end of a long axis of the resilient portion. The resilient portion further includes a curved substrate contact surface on an outermost end of the resilient portion on which a substrate is supported when disposed on the substrate transfer robot blade.
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