公开(公告)号：US11929260B2

公开(公告)日：2024-03-12

申请号：US17410958

申请日：2021-08-24

Applicant: Applied Materials, Inc.

Inventor： Fang Jie Lim ,  Chin Wei Tan ,  Jun-Liang Su ,  Felix Deng ,  Sai Kumar Kodumuri ,  Ananthkrishna Jupudi ,  Nuno Yen-Chu Chen

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/67115 ,  H01L24/75 ,  H01L24/83 ,  H01L21/6838 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/7555 ,  H01L2224/75744 ,  H01L2224/75985 ,  H01L2224/75986 ,  H01L2224/83047 ,  H01L2224/83048 ,  H01L2224/8322 ,  H01L2224/8385 ,  H01L2224/83908 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511

Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.

公开(公告)号：US11630001B2

公开(公告)日：2023-04-18

申请号：US17073733

申请日：2020-10-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Ananthkrishna Jupudi ,  Sai Kumar Kodumuri ,  Vinodh Ramachandran ,  Prashant Agarwal ,  Hadi Bin Amir Muhammad

IPC: G01K1/16 ,  G01K13/00 ,  G01K1/14 ,  G01K11/20

Abstract: An apparatus for determining temperatures of substrates in microwave and/or vacuum environments. A substrate holder with a plurality of support pins includes a temperature sensor assembly with at least a portion of a surface with a phosphorous coating is configured to be inserted in at least one pin support position from an inner area of the substrate holder and in at least one pin support position from an outer area of the substrate holder. The temperature sensor assembly includes a temperature sensor pin with a spring that is microwave transparent. The temperature sensor pin is made of a material with a thermal conductivity greater than approximately 200 W/mK and a low thermal mass which is microwave transparent. An optical transmission assembly is embedded into at least a portion of the substrate holder to receive light emissions from a surface of the temperature sensor pin.