公开(公告)号：US11881385B2

公开(公告)日：2024-01-23

申请号：US16857828

申请日：2020-04-24

申请人： APPLIED MATERIALS, INC.

发明人： Yueh Sheng Ow ,  Yuichi Wada ,  Junqi Wei ,  Kang Zhang ,  Ananthkrishna Jupudi ,  Sarath Babu ,  Kok Seong Teo ,  Kok Wei Tan

IPC分类号： H01J37/32 ,  H01L21/67

CPC分类号： H01J37/32495 ,  H01J37/32504 ,  H01L21/67028 ,  H01J2237/335

摘要： Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. The specific attachment points are spaced apart to produce an amount of flexibility based on a malleability of the metallic material. The amount of flexibility ranges from approximately 2.5 to approximately 4.5.

公开(公告)号：US11630001B2

公开(公告)日：2023-04-18

申请号：US17073733

申请日：2020-10-19

申请人： APPLIED MATERIALS, INC.

发明人： Ananthkrishna Jupudi ,  Sai Kumar Kodumuri ,  Vinodh Ramachandran ,  Prashant Agarwal ,  Hadi Bin Amir Muhammad

IPC分类号： G01K1/16 ,  G01K13/00 ,  G01K1/14 ,  G01K11/20

摘要： An apparatus for determining temperatures of substrates in microwave and/or vacuum environments. A substrate holder with a plurality of support pins includes a temperature sensor assembly with at least a portion of a surface with a phosphorous coating is configured to be inserted in at least one pin support position from an inner area of the substrate holder and in at least one pin support position from an outer area of the substrate holder. The temperature sensor assembly includes a temperature sensor pin with a spring that is microwave transparent. The temperature sensor pin is made of a material with a thermal conductivity greater than approximately 200 W/mK and a low thermal mass which is microwave transparent. An optical transmission assembly is embedded into at least a portion of the substrate holder to receive light emissions from a surface of the temperature sensor pin.

公开(公告)号：US11375584B2

公开(公告)日：2022-06-28

申请号：US16545901

申请日：2019-08-20

申请人： APPLIED MATERIALS, INC.

发明人： Tuck Foong Koh ,  Yueh Sheng Ow ,  Nuno Yen-Chu Chen ,  Ananthkrishna Jupudi ,  Preetham P. Rao

IPC分类号： H05B1/02 ,  H05B6/80

摘要： Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.

公开(公告)号：USD931241S1

公开(公告)日：2021-09-21

申请号：US29703658

申请日：2019-08-28

申请人： APPLIED MATERIALS, INC.

设计人： Sarath Babu ,  Ananthkrishna Jupudi ,  Yueh Sheng Ow ,  Junqi Wei ,  Kelvin Boh ,  Yuichi Wada ,  Kang Zhang

公开(公告)号：US20210074523A1

公开(公告)日：2021-03-11

申请号：US17012275

申请日：2020-09-04

申请人： Applied Materials, Inc.

发明人： Vinodh Ramachandran ,  Ananthkrishna Jupudi ,  Sarath Babu

IPC分类号： H01J37/32 ,  H01L21/683

摘要： An apparatus, methods and controllers for electrostatically chucking varied substrate materials are disclosed. Some embodiments of the disclosure provide electrostatic chucks with variable polarity and/or voltage. Some embodiments of the disclosure provide electrostatic chucks able to operate as monopolar and bipolar electrostatic chucks. Some embodiments of the disclosure provide bipolar electrostatic chucks able to compensate for substrate bias and produce approximately equal chucking force at different electrodes.

公开(公告)号：US12080522B2

公开(公告)日：2024-09-03

申请号：US16855559

申请日：2020-04-22

申请人： APPLIED MATERIALS, INC.

发明人： Sarath Babu ,  Ananthkrishna Jupudi ,  Yueh Sheng Ow ,  Junqi Wei ,  Kelvin Tai Ming Boh ,  Kang Zhang ,  Yuichi Wada

IPC分类号： H01J37/32

CPC分类号： H01J37/32495 ,  H01J37/3244 ,  H01J37/32513 ,  H01J37/32642 ,  H01J37/32651

摘要： Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.

公开(公告)号：US11929260B2

公开(公告)日：2024-03-12

申请号：US17410958

申请日：2021-08-24

申请人： Applied Materials, Inc.

发明人： Fang Jie Lim ,  Chin Wei Tan ,  Jun-Liang Su ,  Felix Deng ,  Sai Kumar Kodumuri ,  Ananthkrishna Jupudi ,  Nuno Yen-Chu Chen

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L21/563 ,  H01L21/67109 ,  H01L21/67115 ,  H01L24/75 ,  H01L24/83 ,  H01L21/6838 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/73204 ,  H01L2224/75272 ,  H01L2224/7555 ,  H01L2224/75744 ,  H01L2224/75985 ,  H01L2224/75986 ,  H01L2224/83047 ,  H01L2224/83048 ,  H01L2224/8322 ,  H01L2224/8385 ,  H01L2224/83908 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511

摘要： Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.

公开(公告)号：US11699634B2

公开(公告)日：2023-07-11

申请号：US16460979

申请日：2019-07-02

申请人： APPLIED MATERIALS, INC.

发明人： Ribhu Gautam ,  Ananthkrishna Jupudi ,  Vinodh Ramachandran

IPC分类号： H01L23/473 ,  F28F3/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/46

CPC分类号： H01L23/473 ,  F28F3/12 ,  H01L23/36 ,  H01L23/367 ,  H01L23/46 ,  F28F2210/10

摘要： Methods and apparatus for a cooling plate for solid state power amplifiers are provided herein. In some embodiments, a cooling plate of a solid state power amplifier includes a body having a rectangular shape, a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall; a plurality of holes disposed on a first side of the body configured to mount a plurality of heat generating microelectronic components; and a channel having a plurality of segments disposed within the body and extending from a first port disposed on the first sidewall to a second port disposed on the first sidewall.

公开(公告)号：US11670513B2

公开(公告)日：2023-06-06

申请号：US17227327

申请日：2021-04-11

申请人： APPLIED MATERIALS, INC.

发明人： Yueh Sheng Ow ,  Junqi Wei ,  Wen Long Favier Shoo ,  Ananthkrishna Jupudi ,  Takashi Shimizu ,  Kelvin Boh ,  Tuck Foong Koh

IPC分类号： H01L21/02 ,  H01L21/30 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/3003 ,  H01L21/67017 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831

摘要： Methods, apparatuses, and systems for substrate processing for lowering contact resistance in at least contact pads of a semiconductor device are provided herein. In some embodiments, a method of substrate processing for lowering contact resistance of contact pads includes: circulating a cooling fluid in at least one channel of a pedestal; and exposing a backside of the substrate located on the pedestal to a cooling gas to cool a substrate located on the pedestal to a temperature of less than 70 degrees Celsius. In some embodiments in accordance with the present principles, the method can further include distributing a hydrogen gas or hydrogen gas combination over the substrate.

公开(公告)号：USD971167S1

公开(公告)日：2022-11-29

申请号：US29778108

申请日：2021-04-10

申请人： APPLIED MATERIALS, INC.

设计人： Sarath Babu ,  Ananthkrishna Jupudi ,  Yueh Sheng Ow ,  Junqi Wei ,  Kelvin Boh ,  Yuichi Wada ,  Kang Zhang