公开(公告)号：US20170233599A1

公开(公告)日：2017-08-17

申请号：US15518723

申请日：2016-01-20

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Mitsuru Tanikawa ,  Takashi Watanabe ,  Yusuke Fujita ,  Yoshito Fujita ,  Tasuku Yamada

IPC: C09D133/14 ,  H01L23/00 ,  C09J171/12 ,  H01L21/52 ,  C09J5/06 ,  C09J163/00

CPC classification number: C09D133/14 ,  C08G59/4215 ,  C08G59/5033 ,  C08G59/686 ,  C08L33/08 ,  C09D11/101 ,  C09D11/107 ,  C09D11/30 ,  C09D11/52 ,  C09D133/10 ,  C09J5/04 ,  C09J5/06 ,  C09J9/02 ,  C09J133/10 ,  C09J133/14 ,  C09J163/00 ,  C09J171/12 ,  C09J201/02 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/52 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/2741 ,  H01L2224/2783 ,  H01L2224/27848 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83026 ,  H01L2224/8322 ,  H01L2224/83359 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83947 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399 ,  C08L33/04

Abstract: Provided is an inkjet adhesive which is applied using an inkjet device, wherein the adhesive can suppress generation of voids in the adhesive layer and, after bonding, can reduce an outgas at the time of being exposed to high temperatures, and can enhance moisture-resistant reliability. An inkjet adhesive according to the present invention comprises a first photocurable compound having one (meth)acrylol group, a second photocurable compound having two or more (meth)acrylol groups, a photo-radical initiator, a thermosetting compound having one or more cyclic ether groups or cyclic thioether groups, and a compound capable of reacting with the thermosetting compound, and the first photocurable compound contains alkyl (meth)acrylate having 8 to 21 carbon atoms.

公开(公告)号：US09676968B1

公开(公告)日：2017-06-13

申请号：US15310315

申请日：2015-05-11

Applicant: Denka Company Limited

Inventor： Gosuke Nakajima ,  Masanobu Kutsumi

IPC: C09J7/02 ,  C09J4/06 ,  C09J11/08 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00

CPC classification number: C09J4/06 ,  C08F265/06 ,  C08G18/673 ,  C08G18/73 ,  C08G18/755 ,  C08G18/8029 ,  C09J4/00 ,  C09J7/243 ,  C09J11/08 ,  C09J133/04 ,  C09J175/04 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2451/00 ,  C09J2483/00 ,  G01R31/2877 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L22/32 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/8322 ,  C08F2222/1033 ,  H01L2924/00014

Abstract: A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is provided, characterized in that the substrate is heat shrinkable and the adhesive layer contains a (meth)acrylate copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator and does not substantially contain a tackifying resin. This adhesive sheet is not deformed even when heated. Since the adhesive does not substantially contain a tackifying resin, softening of the adhesive layer does not occur even when the sheet is heated.

公开(公告)号：US09673167B2

公开(公告)日：2017-06-06

申请号：US14416297

申请日：2012-07-26

Applicant: Markus Wimplinger

Inventor： Markus Wimplinger

IPC: H01L23/00 ,  H01L31/18 ,  B32B37/24 ,  B32B38/00 ,  C23C14/08 ,  C23C16/40

CPC classification number: H01L24/83 ,  B32B37/24 ,  B32B38/0008 ,  B32B2037/243 ,  B32B2037/246 ,  B32B2457/14 ,  C23C14/08 ,  C23C14/081 ,  C23C14/086 ,  C23C16/40 ,  C23C16/403 ,  C23C16/407 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L31/18 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/278 ,  H01L2224/27848 ,  H01L2224/2908 ,  H01L2224/29187 ,  H01L2224/29287 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/83001 ,  H01L2224/83002 ,  H01L2224/83011 ,  H01L2224/83012 ,  H01L2224/83013 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8322 ,  H01L2224/8383 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/053 ,  H01L2924/12042 ,  H01L2924/20102 ,  H01L2924/0549 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0531 ,  H01L2924/01001 ,  H01L2924/01008 ,  H01L2924/00

Abstract: This invention relates to a method for bonding of a first contact area of a first at least largely transparent substrate to a second contact area of a second at least largely transparent substrate, on at least one of the contact areas an oxide being used for bonding, from which an at least largely transparent interconnection layer is formed with an electrical conductivity of at least 10e1 S/cm2 (measurement: four point method, relative to temperature of 300K) and an optical transmittance greater than 0.8 (for a wavelength range from 400 nm to 1500 nm) on the first and second contact area.

公开(公告)号：US20170152407A1

公开(公告)日：2017-06-01

申请号：US15310315

申请日：2015-05-11

Applicant: Denka Company Limited

Inventor： Gosuke NAKAJIMA ,  Masanobu KUTSUMI

IPC: C09J7/02 ,  H01L23/00 ,  H01L21/66 ,  H01L21/78 ,  C09J4/06 ,  C09J11/08

CPC classification number: C09J4/06 ,  C08F265/06 ,  C08G18/673 ,  C08G18/73 ,  C08G18/755 ,  C08G18/8029 ,  C09J4/00 ,  C09J7/243 ,  C09J11/08 ,  C09J133/04 ,  C09J175/04 ,  C09J175/16 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2451/00 ,  C09J2483/00 ,  G01R31/2877 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L22/32 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/8322 ,  C08F2222/1033 ,  H01L2924/00014

Abstract: A heat resistant adhesive sheet is provided that does not easily develop deformation of an adhesive sheet due to heating. Such an adhesive sheet made by laminating an adhesive layer to a substrate is provided, characterized in that the substrate is heat shrinkable and the adhesive layer contains a (meth)acrylate copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and a photopolymerization initiator and does not substantially contain a tackifying resin. This adhesive sheet is not deformed even when heated. Since the adhesive does not substantially contain a tackifying resin, softening of the adhesive layer does not occur even when the sheet is heated.

公开(公告)号：US09659793B2

公开(公告)日：2017-05-23

申请号：US14943511

申请日：2015-11-17

Applicant: Infineon Technologies AG

Inventor： Nicolas Heuck ,  Frederik Otto ,  Christian Steininger

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/27005 ,  H01L2224/2732 ,  H01L2224/2744 ,  H01L2224/27442 ,  H01L2224/27848 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2939 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75343 ,  H01L2224/75745 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83207 ,  H01L2224/83208 ,  H01L2224/8322 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.

公开(公告)号：US09466719B2

公开(公告)日：2016-10-11

申请号：US14540268

申请日：2014-11-13

Applicant: QUALCOMM SWITCH CORP.

Inventor： Paul A. Nygaard ,  Stuart B. Molin ,  Michael A. Stuber ,  Max Aubain

IPC: H01L21/78 ,  H01L29/78 ,  H01L29/06 ,  H01L29/10 ,  H01L21/84 ,  H01L23/36 ,  H01L23/367 ,  H01L29/786 ,  H01L27/12 ,  H01L23/00 ,  H01L21/762

CPC classification number: H01L29/1054 ,  H01L21/76256 ,  H01L21/78 ,  H01L21/84 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3677 ,  H01L24/03 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L27/1203 ,  H01L29/0649 ,  H01L29/1033 ,  H01L29/78 ,  H01L29/7843 ,  H01L29/7849 ,  H01L29/78603 ,  H01L29/78606 ,  H01L29/78654 ,  H01L2221/6834 ,  H01L2221/6835 ,  H01L2221/68377 ,  H01L2224/03845 ,  H01L2224/05572 ,  H01L2224/08225 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/29186 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48 ,  H01L2224/80006 ,  H01L2224/8022 ,  H01L2224/80801 ,  H01L2224/80894 ,  H01L2224/83005 ,  H01L2224/8322 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/92142 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/053 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/80 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/45099

Abstract: Embodiments of the present invention provide for the enhancement of transistors in a semiconductor structure using a strain layer. The structure comprises a patterned layer consisting of an excavated region and a pattern region, a strain layer located in the excavated region and on the pattern region, an active layer located above the strain layer, a field effect transistor formed in the active layer, and a handle layer located above the active layer. The field effect transistor comprises a source, a drain, and a channel. The channel lies completely within a lateral extent of the pattern region. The source and the drain each lie only partially within the lateral extent of the pattern region. The strain layer alters a carrier mobility of the channel. In some embodiments, the strain layer is introduced to the back side of a semiconductor-on-insulator structure.

Abstract translation: 本发明的实施例提供了使用应变层的半导体结构中的晶体管的增强。 该结构包括由挖掘区域和图案区域构成的图案层，位于挖掘区域和图案区域上的应变层，位于应变层上方的有源层，形成在有源层中的场效应晶体管，以及 位于有源层上方的手柄层。 场效应晶体管包括源极，漏极和沟道。 通道完全位于图案区域的横向范围内。 源极和漏极各自仅部分地位于图案区域的横向范围内。 应变层改变通道的载流子迁移率。 在一些实施例中，将应变层引入到绝缘体上半导体结构的背面。

公开(公告)号：US20160148819A1

公开(公告)日：2016-05-26

申请号：US14943511

申请日：2015-11-17

Applicant: Infineon Technologies AG

Inventor： Nicolas Heuck ,  Frederik Otto ,  Christian Steininger

IPC: H01L21/48

CPC classification number: H01L21/4825 ,  H01L21/4842 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/27003 ,  H01L2224/27005 ,  H01L2224/2732 ,  H01L2224/2744 ,  H01L2224/27442 ,  H01L2224/27848 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2939 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75343 ,  H01L2224/75745 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/83207 ,  H01L2224/83208 ,  H01L2224/8322 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.

Abstract translation: 公开了一种用于在半导体芯片和金属层之间制造材料接合连接的方法。 为此，提供了具有芯片安装部分的半导体芯片，金属层以及含有金属粉末的接合介质。 金属粉末在烧结过程中烧结。 在这种情况下，在规定的烧结时间内，满足规定的要求，接合介质配置在半导体芯片和金属层之间，从半导体芯片向右延伸到金属层，半导体芯片和金属 层压在超过最小压制压力的压制压力范围内，使粘合介质保持在高于最低温度的温度范围内并且声音信号被引入粘合介质中。

公开(公告)号：US12076579B2

公开(公告)日：2024-09-03

申请号：US17433768

申请日：2020-02-27

Applicant: IMMUNOLIGHT, LLC

Inventor： Frederic A. Bourke, Jr. ,  Harold Walder ,  Zakaryae Fathi ,  Wayne F. Beyer ,  Ronald A. Rudder ,  Joseph H. Simmons

IPC: A61N5/06 ,  A61K35/12 ,  A61K41/00 ,  A61N5/067 ,  C09J133/08 ,  C09K11/02 ,  C09K11/59 ,  C09K11/76 ,  C09K11/77 ,  C12N15/01 ,  F21K2/00 ,  F21S11/00 ,  F21V9/40 ,  H01J45/00 ,  H01L23/00 ,  H01L31/0352 ,  H01L31/054 ,  H01L31/055 ,  H01L31/06

CPC classification number: A61N5/0625 ,  A61K35/12 ,  A61K41/00 ,  A61K41/0057 ,  A61N5/0601 ,  A61N5/062 ,  A61N5/067 ,  C09J133/08 ,  C09K11/025 ,  C09K11/595 ,  C09K11/76 ,  C09K11/7701 ,  C09K11/7792 ,  C12N15/01 ,  F21K2/00 ,  F21S11/007 ,  F21V9/40 ,  H01J45/00 ,  H01L24/29 ,  H01L24/83 ,  H01L31/035281 ,  H01L31/054 ,  H01L31/06 ,  A61N2005/0661 ,  A61N2005/0662 ,  A61N2005/0663 ,  H01L31/055 ,  H01L2224/2919 ,  H01L2224/29393 ,  H01L2224/8322 ,  H01L2224/83855

Abstract: An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, including various adhesives applications.

公开(公告)号：US11964167B2

公开(公告)日：2024-04-23

申请号：US17433748

申请日：2020-01-30

Applicant: IMMUNOLIGHT, LLC

Inventor： Frederic A. Bourke, Jr. ,  Harold Walder ,  Zakaryae Fathi ,  Wayne F. Beyer ,  Ronald A. Rudder ,  Joseph H. Simmons

IPC: A61N5/06 ,  A61K35/12 ,  A61K41/00 ,  A61N5/067 ,  C09J133/08 ,  C09K11/02 ,  C09K11/59 ,  C09K11/76 ,  C09K11/77 ,  C12N15/01 ,  F21K2/00 ,  F21S11/00 ,  F21V9/40 ,  H01J45/00 ,  H01L23/00 ,  H01L31/0352 ,  H01L31/054 ,  H01L31/06 ,  H01L31/055

CPC classification number: A61N5/0625 ,  A61K35/12 ,  A61K41/00 ,  A61K41/0057 ,  A61N5/0601 ,  A61N5/062 ,  A61N5/067 ,  C09J133/08 ,  C09K11/025 ,  C09K11/595 ,  C09K11/76 ,  C09K11/7701 ,  C09K11/7792 ,  C12N15/01 ,  F21K2/00 ,  F21S11/007 ,  F21V9/40 ,  H01J45/00 ,  H01L24/29 ,  H01L24/83 ,  H01L31/035281 ,  H01L31/054 ,  H01L31/06 ,  A61N2005/0661 ,  A61N2005/0662 ,  A61N2005/0663 ,  H01L31/055 ,  H01L2224/2919 ,  H01L2224/29393 ,  H01L2224/8322 ,  H01L2224/83855

Abstract: An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields, such as color enhancement, and color enhancement structures containing the same.

公开(公告)号：US11776942B2

公开(公告)日：2023-10-03

申请号：US18067910

申请日：2022-12-19

Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

Inventor： Canyuan Zhang

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L24/14 ,  H01L24/30 ,  H01L2224/13013 ,  H01L2224/13021 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/14132 ,  H01L2224/16145 ,  H01L2224/16506 ,  H01L2224/29021 ,  H01L2224/30132 ,  H01L2224/73104 ,  H01L2224/81203 ,  H01L2224/81805 ,  H01L2224/8322 ,  H01L2224/83862 ,  H01L2224/92225 ,  H01L2224/95136 ,  H01L2924/01322 ,  H01L2924/12041

Abstract: A method for manufacturing a display panel includes providing a backplate, forming bonding parts on backplate, forming an auxiliary layer on backplate, releasing light-emitting elements onto the auxiliary layer such that electrodes of the light-emitting elements are in contact with the first parts to form an intermediate backplate, arranging the intermediate backplate under first predetermined condition under which a fluidity of the first part is greater than that of the second part, and bonding the electrodes and the bonding parts to form an eutectic bonding layer, and arranging the intermediate backplate under second predetermined condition such that the first and second parts form solid-state first and second members. The backplate includes first and second regions. The bonding parts are located in the first regions. The auxiliary layer covers the backplate and the bonding parts. The auxiliary layer includes first and second parts respectively located in the first and second regions.