公开(公告)号：US20230320223A1

公开(公告)日：2023-10-05

申请号：US18022652

申请日：2020-08-24

Applicant: Applied Materials, Inc.

Inventor： Abhijeet Laxman SANGLE ,  Vijay Bhan SHARMA ,  Yuan XUE ,  Ankur KADAM ,  Bharatwaj RAMAKRISHNAN ,  Uday PAI ,  Nilesh PATIL

IPC: H10N30/50 ,  H10N30/093 ,  H10N30/00 ,  H10N30/853 ,  H10N30/87

CPC classification number: H10N30/50 ,  H10N30/093 ,  H10N30/1051 ,  H10N30/8554 ,  H10N30/877

Abstract: Disclosed are methods and apparatus for depositing uniform layers on a substrate (201) for piezoelectric applications. An ultra-thin seed layer (308) having a uniform thickness from center to edge thereof is deposited on a substrate (201). A template layer (310) closely matching the crystal structure of a subsequently formed piezoelectric material layer (312) is deposited on a substrate (201). The uniform thickness and orientation of the seed layer (308) and the template layer (310), in turn, facilitate the growth of piezoelectric materials with improved crystallinity and piezoelectric properties.

公开(公告)号：US20220213590A1

公开(公告)日：2022-07-07

申请号：US17194956

申请日：2021-03-08

Applicant: Applied Materials, Inc.

Inventor： Uday PAI ,  Yuan XUE ,  Abhijeet Laxman SANGLE ,  Vijay Bhan SHARMA ,  Suresh Chand SETH ,  Bharatwaj Ramakrishnan ,  Soundarrajan JEMBULINGAM ,  Naveen CHANNARAYAPATNA PUTTANNA ,  Ankur KADAM ,  Yi YANG

IPC: C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  H01J37/34

Abstract: Methods and apparatus for processing a substrate using improved shield configurations are provided herein. For example, a process kit for use in a physical vapor deposition chamber includes a shield comprising an inner wall with an innermost diameter configured to surround a target when disposed in the physical vapor deposition chamber, wherein a ratio of a surface area of the shield to a planar area of the inner diameter is about 3 to about 10.

公开(公告)号：US20220097202A1

公开(公告)日：2022-03-31

申请号：US17034541

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Uday PAI ,  Jeonghoon OH ,  Van H. NGUYEN

IPC: B24B37/32

Abstract: Apparatus and methods relating to chemical mechanical polishing (CMP) are described herein. An edge load ring (ELR) is configured to fit inside a retaining ring of a CMP head. The ELR includes an annular body having an inner surface and an outer surface opposite the inner surface, the outer surface having a diameter configured to slip inside a retaining ring. The annular body includes a body portion formed from a first material and a bottom projection extending below the body portion. The bottom projection has a bottom surface facing away from the body portion, and the bottom projection is formed form a second material different from the first material. The annular body includes a venting feature formed through the annular body, the venting feature being in fluid communication between the inner and outer surfaces.