公开(公告)号：US11756925B2

公开(公告)日：2023-09-12

申请号：US17508489

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Ruiping Wang

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/67 ,  C23C16/513 ,  H01L21/683 ,  H01L21/66

CPC classification number: H01L24/95 ,  C23C16/513 ,  H01L21/67132 ,  H01L21/67253 ,  H01L21/6836 ,  H01L22/10 ,  H01L24/94

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for hybrid bonding a wafer comprises performing a first vacuum processing procedure on the wafer disposed within a first processing chamber, obtaining at least one of moisture measurements or organic species measurements within the first processing chamber, comparing the obtained at least one of moisture measurements or organic species measurements with a predetermined threshold, and one of when a comparison of the obtained at least one of moisture measurements or organic species measurements is equal to or less than the predetermined threshold automatically performing a second vacuum processing procedure in a second processing chamber different from the first processing chamber on the wafer, or when the comparison of the obtained at least one of moisture measurements or organic species measurements is greater than the predetermined threshold automatically continuing performing the first vacuum processing procedure on the wafer.

公开(公告)号：US12237186B2

公开(公告)日：2025-02-25

申请号：US17945910

申请日：2022-09-15

Applicant: Applied Materials, Inc.

Inventor： Ruiping Wang ,  Ying Wang ,  Guan Huei See ,  Ananthkrishna Jupudi ,  Praveen Kumar Choragudi

IPC: H01L21/67 ,  B08B1/10 ,  B08B3/04 ,  B08B7/00 ,  B08B13/00 ,  F26B25/14 ,  G06T1/00 ,  H01L21/683

Abstract: Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.

公开(公告)号：US12087571B2

公开(公告)日：2024-09-10

申请号：US18383617

申请日：2023-10-25

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Guan Huei See ,  Gregory J. Wilson

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/02076 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6836

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

公开(公告)号：US11837464B2

公开(公告)日：2023-12-05

申请号：US17569629

申请日：2022-01-06

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Guan Huei See ,  Gregory J. Wilson

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/683 ,  B08B3/02

CPC classification number: H01L21/02076 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6836

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

公开(公告)号：US12001193B2

公开(公告)日：2024-06-04

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Xundong Dai ,  Guan Huei See ,  Ruiping Wang ,  Michael R. Rice ,  Hari Kishen Ponnekanti ,  Nirmalya Maity

IPC: G05B19/41 ,  G05B19/418 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.